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Datasheet
M16C/65 Group
RENESAS MCU
R01DS0031EJ0200 Rev.2.00 Feb 07, 2011
1.
1.1
Overview
Features
The M16C/65 Group microcomputer (MCU) incorporates the M16C/60 Series CPU core and flash memory, employing sophisticated instructions for a high level of efficiency. This MCU has 1 MB of address space (expandable to 4 MB), and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. This MCU consumes low power, and supports operating modes that allow additional power control. The MCU also uses an anti-noise configuration to reduce emissions of electromagnetic noise and is designed to withstand electromagnetic interference (EMI). By integrating many of the peripheral functions, including the multifunction timer and serial interface, the number of system components has been reduced.
1.1.1
Applications
This MCU can be used in audio components, cameras, televisions, household appliances, office equipment, communication devices, mobile devices, industrial equipment, and other applications.
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M16C/65 Group
1. Overview
1.2
Specifications
The M16C/65 Group includes 128-pin and 100-pin packages. Table 1.1 to Table 1.4 list specifications. Table 1.1
Item
Specifications for the 128-Pin Package (1/2)
Function Description M16C/60 Series core (multiplier: 16 bit x 16 bit 32 bit, multiply and accumulate instruction: 16 bit x 16 bit + 32 bit 32 bit) * Number of basic instructions: 91 * Minimum instruction execution time: 31.25 ns (f(BCLK) = 32 MHz, VCC1 = VCC2 = 2.7 to 5.5 V) * Operating modes: Single-chip, memory expansion, and microprocessor See Table 1.5 "Product List (1/2)" and Table 1.6 "Product List (2/2)".
CPU
Central processing unit
Memory Voltage Detection
ROM, RAM, data flash Voltage detector
* Power-on reset * 3 voltage detection points (detection level of voltage detection 0 and 1
selectable)
* 5 circuits: Main clock, sub clock, low-speed on-chip oscillator (125 kHz),
high-speed on-chip oscillator (40 MHz 10%), PLL frequency synthesizer
* Oscillation stop detection: Main clock oscillation stop/restart detection
Clock Clock generator function
* Frequency divider circuit: Divide ratio selectable from 1, 2, 4, 8, and 16 * Power saving features: Wait mode, stop mode * Real-time clock * Address space: 1 MB * External bus interface: 0 to 8 waits inserted, 4 chip select outputs,
External Bus Bus memory expansion Expansion memory area expansion function (expandable to 4 MB), 3 V and 5 V interfaces * Bus format: Separate bus or multiplexed bus selectable, data bus width selectable (8 or 16 bits), number of address buses selectable (12, 16, or 20)
I/O Ports
Programmable I/O ports
Interrupts
* CMOS I/O ports: 111 (selectable pull-up resistors) * N-channel open drain ports: 3 * Interrupt vectors: 70 * External interrupt inputs: 13 (NMI, INT x 8, key input x 4) * Interrupt priority levels: 7
15-bit timer x 1 (with prescaler) Automatic reset start function selectable
Watchdog Timer
DMA
DMAC
* 4 channels, cycle steal mode * Trigger sources: 43 * Transfer modes: 2 (single transfer, repeat transfer)
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M16C/65 Group
1. Overview
Table 1.2
Item
Specifications for the 128-Pin Package (2/2)
Function Description 16-bit timer x 5 Timer mode, event counter mode, one-shot timer mode, pulse width modulation (PWM) mode Event counter two-phase pulse signal processing (two-phase encoder input) x 3 Programmable output mode x 3 16-bit timer x 6 Timer mode, event counter mode, pulse period measurement mode, pulse width measurement mode
Timer A
Timer B Timers Three-phase motor control timer functions Real-time clock PWM function
* Three-phase inverter control (timer A1, timer A2, timer A4, timer B2) * On-chip dead time timer
Count: seconds, minutes, hours, days of the week 8 bits x 2
* 2 circuits * 4 wave pattern matchings (differentiate wave pattern for headers, data
Remote control signal receiver 0, data 1, and special data)
* 6-byte receive buffer (1 circuit only) * Operating frequency of 32 kHz
Serial Interface Multi-master UART0 to UART2, UART5 to UART7 SI/O3, SI/O4 I2C-bus Interface Clock synchronous/asynchronous x 6 channels I2C-bus, IEBus, special mode 2 SIM (UART2) Clock synchronization only x 2 channels 1 channel CEC transmit/receive, arbitration lost detection, ACK automatic output, operation frequency of 32 kHz 10-bit resolution x 26 channels, including sample and hold function Conversion time: 1.72 s 8-bit resolution x 2 circuits CRC-CCITT (X16 + X12 + X5 + 1), CRC-16 (X16 + X15 + X2 + 1) compliant
CEC Functions (2) A/D Converter D/A Converter CRC Calculator
Flash Memory
* Program and erase power supply voltage: 2.7 to 5.5 V * Program and erase cycles: 1,000 times (program ROM 1, program
ROM 2), 10,000 times (data flash)
* Program security: ROM code protect, ID code check
Debug Functions Operation Frequency/Supply Voltage Current Consumption Operating Temperature Package On-chip debug, on-board flash rewrite, address match interrupt x 4 32 MHz/VCC1 = 2.7 to 5.5 V, VCC2 = 2.7 V to VCC1 Described in Electrical Characteristics -20C to 85C, -40C to 85C (1) 128-pin LQFP: PLQP0128KB-A (Previous package code: 128P6Q-A)
Notes: 1. See Table 1.5 "Product List (1/2)" and Table 1.6 "Product List (2/2)" for the operating temperature. 2. The CEC function indicates circuitry which supports the transmission and reception of CEC signals standardized by the High-Definition Multimedia Interface (HDMI). HDMI and High-Definition Multimedia Interface are registered trademarks of HDMI Licensing, LLC.
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M16C/65 Group
1. Overview
Table 1.3
Item
Specifications for the 100-Pin Package (1/2)
Function Description M16C/60 Series core (multiplier: 16 bit x 16 bit 32 bit, multiply and accumulate instruction: 16 bit x 16 bit + 32 bit 32 bit) * Number of basic instructions: 91 * Minimum instruction execution time: 31.25 ns (f(BCLK) = 32 MHz, VCC1 = VCC2 = 2.7 to 5.5 V) * Operating modes: Single-chip, memory expansion, and microprocessor See Table 1.5 "Product List (1/2)" and Table 1.6 "Product List (2/2)".
CPU
Central processing unit
Memory Voltage Detection
ROM, RAM, data flash Voltage detector
* Power-on reset * 3 voltage detection points (detection level of voltage detection 0 and 1
selectable)
* 5 circuits: Main clock, sub clock, low-speed on-chip oscillator (125 kHz),
high-speed on-chip oscillator (40 MHz 10%), PLL frequency synthesizer
* Oscillation stop detection: Main clock oscillation stop/restart detection
Clock Clock generator function
* Frequency divider circuit: Divide ratio selectable from 1, 2, 4, 8, and 16 * Power saving features: Wait mode, stop mode * Real-time clock * Address space: 1 MB * External bus interface: 0 to 8 waits inserted, 4 chip select outputs,
External Bus Bus memory expansion Expansion memory area expansion function (expandable to 4 MB), 3 V and 5 V interfaces * Bus format: Separate bus or multiplexed bus selectable, data bus width selectable (8 or 16 bits), number of address buses selectable (12, 16, or 20)
I/O Ports
Programmable I/O ports
Interrupts
* CMOS I/O ports: 85 (selectable pull-up resistors) * N-channel open drain ports: 3 * Interrupt vectors: 70 * External interrupt inputs: 13 (NMI, INT x 8, key input x 4) * Interrupt priority levels: 7
15-bit timer x 1 (with prescaler) Automatic reset start function selectable
Watchdog Timer
DMA
DMAC
* 4 channels, cycle steal mode * Trigger sources: 43 * Transfer modes: 2 (single transfer, repeat transfer)
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M16C/65 Group
1. Overview
Table 1.4
Item
Specifications for the 100-Pin Package (2/2)
Function Description 16-bit timer x 5 Timer mode, event counter mode, one-shot timer mode, pulse width modulation (PWM) mode Event counter two-phase pulse signal processing (two-phase encoder input) x 3 Programmable output mode x 3 16-bit timer x 6 Timer mode, event counter mode, pulse period measurement mode, pulse width measurement mode
Timer A
Timer B Timers Three-phase motor control timer functions Real-time clock PWM function
* Three-phase inverter control (timer A1, timer A2, timer A4, timer B2) * On-chip dead time timer
Count: seconds, minutes, hours, days of the week 8 bits x 2
* 2 circuits * 4 wave pattern matchings (differentiate wave pattern for headers, data
Remote control signal receiver 0, data 1, and special data)
* 6-byte receive buffer (1 circuit only) * Operating frequency of 32 kHz
Serial Interface Multi-master UART0 to UART2, UART5 to UART7 SI/O3, SI/O4 I2C-bus Interface Clock synchronous/asynchronous x 6 channels I2C-bus, IEBus, special mode 2 SIM (UART2) Clock synchronization only x 2 channels 1 channel CEC transmit/receive, arbitration lost detection, ACK automatic output, operation frequency of 32 kHz 10-bit resolution x 26 channels, including sample and hold function Conversion time: 1.72 s 8-bit resolution x 2 circuits CRC-CCITT (X16 + X12 + X5 + 1), CRC-16 (X16 + X15 + X2 + 1) compliant
CEC Functions (2) A/D Converter D/A Converter CRC Calculator
Flash Memory
* Program and erase power supply voltage: 2.7 to 5.5 V * Program and erase cycles: 1,000 times (program ROM 1, program
ROM 2), 10,000 times (data flash)
* Program security: ROM code protect, ID code check
Debug Functions Operation Frequency/Supply Voltage Current Consumption Operating Temperature Package On-chip debug, on-board flash rewrite, address match interrupt x 4 25 MHz/VCC1 = 2.7 to 5.5 V, VCC2 = 2.7 V to VCC1 32 MHz/VCC1 = 2.7 to 5.5 V, VCC2 = 2.7 V to VCC1 Described in Electrical Characteristics -20C to 85C, -40C to 85C (1) 100-pin QFP: PRQP0100JD-B (Previous package code: 100P6F-A) 100-pin LQFP: PLQP0100KB-A (Previous package code: 100P6Q-A)
Notes: 1. See Table 1.5 "Product List (1/2)" and Table 1.6 "Product List (2/2)" for the operating temperature. 2. The CEC function indicates circuitry which supports the transmission and reception of CEC signals standardized by the High-Definition Multimedia Interface (HDMI). HDMI and High-Definition Multimedia Interface are registered trademarks of HDMI Licensing, LLC.
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M16C/65 Group
1. Overview
1.3
Product List
Table 1.5 and Table 1.6 list product information. Figure 1.1 shows the Part No., with Memory Size and Package, and Figure 1.2 shows the Marking Diagram (Top View). Table 1.5 Product List (1/2)
Program ROM 1 ROM Capacity Program Data flash ROM 2 RAM Capacity
As of December, 2010
Package Code Remarks
Part No. R5F36506NFA R5F36506NFB
128 KB R5F36506DFA R5F36506DFB R5F3651ENFC R5F3650ENFA R5F3650ENFB R5F3651EDFC R5F3650EDFA R5F3650EDFB R5F3651KNFC R5F3650KNFA R5F3650KNFB R5F3651KDFC R5F3650KDFA R5F3650KDFB R5F3651MNFC R5F3650MNFA R5F3650MNFB R5F3651MDFC R5F3650MDFA R5F3650MDFB R5F3651NNFC R5F3650NNFA R5F3650NNFB R5F3651NDFC R5F3650NDFA R5F3650NDFB R5F3651RNFC R5F3650RNFA R5F3650RNFB R5F3651RDFC R5F3650RDFA R5F3650RDFB (D): Under development (P): Planning Previous package codes are as follows: PLQP0128KB-A: 128P6Q-A PRQP0100JD-B: 100P6F-A PLQP0100KB-A: 100P6Q-A
16 KB
4 KB x 2 blocks
12 KB
256 KB
16 KB
4 KB x 2 blocks
20 KB
PRQP0100JD-B Operating temperature PLQP0100KB-A -20C to 85C PRQP0100JD-B Operating temperature PLQP0100KB-A -40C to 85C PLQP0128KB-A Operating PRQP0100JD-B temperature PLQP0100KB-A -20C to 85C PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A Operating temperature -40C to 85C Operating temperature -20C to 85C Operating temperature -40C to 85C Operating temperature -20C to 85C Operating temperature -40C to 85C Operating temperature -20C to 85C Operating temperature -40C to 85C Operating temperature -20C to 85C Operating temperature -40C to 85C
384 KB
16 KB
4 KB x 2 blocks
31 KB
512 KB
16 KB
4 KB x 2 blocks
31 KB
512 KB
16 KB
4 KB x 2 blocks
47 KB
640 KB
16 KB
4 KB x 2 blocks
47 KB
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M16C/65 Group
1. Overview
Table 1.6
Product List (2/2)
Program ROM 1 ROM Capacity Program Data flash ROM 2 RAM Capacity
As of December, 2010
Package Code PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A PLQP0128KB-A PRQP0100JD-B PLQP0100KB-A Remarks Operating temperature -20C to 85C Operating temperature -40C to 85C
Part No. R5F3651TNFC R5F3650TNFA R5F3650TNFB R5F3651TDFC R5F3650TDFA R5F3650TDFB (D): Under development (P): Planning
768 KB
16 KB
4 KB x 2 blocks
47 KB
Previous package codes are as follows: PLQP0128KB-A: 128P6Q-A PRQP0100JD-B: 100P6F-A PLQP0100KB-A: 100P6Q-A
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M16C/65 Group
1. Overview
Part No.
R5F3
65
0
6
D
FA
Package type FC: Package PLQP0128KB-A (128P6Q-A) FA: Package PRQP0100JD-B (100P6F-A) FB: Package PLQP0100KB-A (100P6Q-A) Property Code N: Operating temperature: -20C to 85C D: Operating temperature: -40C to 85C Memory capacity Program ROM 1/RAM 6: 128 KB/12 KB E: 256 KB/20 KB K: 384 KB/31 KB M: 512 KB/31 KB N: 512 KB/47 KB R: 640 KB/47 KB T: 768 KB/47 KB Number of pins 0: 100 pins 1: 128 pins M16C/65 Group 16-bit MCU Memory type F: Flash memory Renesas MCU Renesas semiconductor
Figure 1.1
Part No., with Memory Size and Package
M1 6 C R 5 F 3 6 5 0 6 DF A XXXXXXX
Type No. (See Figure 1.1 "Part No., with Memory Size and Package") Running No. 0 to 9, A to Z (except for I, O, Q) Week code (from 01 to 54) Last digit of year
Figure 1.2
Marking Diagram (Top View)
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M16C/65 Group
1. Overview
1.4
Block Diagram
Figure 1.3 to Figure 1.4 show block diagrams.
8 Port P0
8 Port P1
8 Port P2
8 Port P3
8 Port P4
8 Port P5
8 Port P12
8 Port P13
VCC2 ports
Internal peripheral functions
Timer (16 bit) Outputs (timer A): 5 Inputs (timer B): 6
Three-phase motor control circuit Real-time clock PWM function (8 bit x 2) Remote control signal receiver (2 circuits) Watchdog timer (15 bit) A/D converter (10-bit resolution x 26 channels) D/A converter (8-bit resolution x 2 circuits)
UART or clock synchronous serial I/O (6 channels) Clock synchronous serial I/O (8 bit x 2 channels) Multi-master I2C-bus interface (1 channel) CEC function
System clock generator
XIN-XOUT XCIN-XCOUT PLL frequency synthesizer On-chip oscillator (125 kHz) High-speed on-chip oscillator
DMAC (4 channels) CRC arithmetic circuit (CRC-CCITT or CRC-16) Voltage detector Power-on reset On-chip debugger
M16C/60 Series CPU core
R0H R1H R2 R3 A0 A1 FB R0L R1L SB USP ISP INTB PC FLG
Memory ROM (1) RAM (2)
Multiplier
VCC1 ports
Port P14 2
Port P11 8
Port P10 8
Port P9 8
Port P8 8
Port P7 8
Port P6 8
Notes: 1. ROM size depends on MCU type. 2. RAM size depends on MCU type.
Figure 1.3
Block Diagram for the 128-Pin Package
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M16C/65 Group
1. Overview
8 Port P0
8 Port P1
8 Port P2
8 Port P3
8 Port P4
8 Port P5
VCC2 ports
Internal peripheral functions
Timer (16 bit) Outputs (timer A): 5 Inputs (timer B): 6 Three-phase motor control circuit Real-time clock PWM function (8 bit x 2) Remote control signal receiver (2 circuits) Watchdog timer (15 bit) A/D converter (10-bit resolution x 26 channels) D/A converter (8-bit resolution x 2 circuits)
UART or clock synchronous serial I/O (6 channels) Clock synchronous serial I/O (8 bit x 2 channels) Multi-master I2C-bus interface (1 channel) CEC function
System clock generator
XIN-XOUT XCIN-XCOUT PLL frequency synthesizer On-chip oscillator (125 kHz) High-speed on-chip oscillator
DMAC (4 channels) CRC arithmetic circuit (CRC-CCITT or CRC-16) Voltage detector Power-on reset On-chip debugger Memory
SB USP ISP
M16C/60 Series CPU core
R0H R1H R2 R3 A0 A1 FB R0L R1L
ROM (1) RAM (2)
INTB PC FLG
Multiplier
VCC1 ports
Port P10 8
Port P9 8
Port P8 8
Port P7 8
Port P6 8
Notes: 1. ROM size depends on MCU type. 2. RAM size depends on MCU type.
Figure 1.4
Block Diagram for the 100-Pin Package
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1.5
M16C/65 Group
Figure 1.5
P1_0/CTS6/RTS6/D8 P0_7/AN0_7/D7 P0_6/AN0_6/D6 P0_5/AN0_5/D5 P0_4/AN0_4/D4 P0_3/AN0_3/D3 P0_2/AN0_2/D2 P0_1/AN0_1/D1 P0_0/AN0_0/D0 P11_7 P11_6 P11_5 P11_4 P11_3 P11_2 P11_1 P11_0 P10_7/AN7/KI3 P10_6/AN6/KI2 P10_5/AN5/KI1 P10_4/AN4/KI0 P10_3/AN3 P10_2/AN2 P10_1/AN1 AVSS P10_0/AN0 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128
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Pin Assignments
See Note 3
VCC1 ports
VCC2 ports
VREF AVCC P9_7/ADTRG/SIN4 P9_6/ANEX1/SOUT4 P9_5/ANEX0/CLK4 P9_4/DA1/TB4IN/PWM1 P9_3/DA0/TB3IN/PWM0 P9_2/TB2IN/PMC0/SOUT3 P9_1/TB1IN/PMC1/SIN3 P9_0/TB0IN/CLK3 P14_1 P14_0 BYTE CNVSS P8_7/XCIN P8_6/XCOUT RESET XOUT VSS XIN VCC1 P8_5/NMI/SD/CEC (1) P8_4/INT2/ZP P8_3/INT1 P8_2/INT0 P8_1/TA4IN/U/CTS5/RTS5 P8_0/TA4OUT/U/RXD5/SCL5 P7_7/TA3IN/CLK5 P7_6/TA3OUT/TXD5/SDA5 P7_5/TA2IN/W P7_4/TA2OUT/W P7_3/CTS2/RTS2/TA1IN/V P7_2/CLK2/TA1OUT/V P7_1/RXD2/SCL2/SCLMM/TA0IN/TB5IN (1) P7_0/TXD2/SDA2/SDAMM/TA0OUT (1) P6_7/TXD1/SDA1 VCC1 P6_6/RXD1/SCL1
Figure 1.5 to Figure 1.7 show pin assignments. Table 1.7 to Table 1.11 list pin names.
Notes: 1. N-channel open drain output. 2. Check the position of Pin 1 by referring to appendix 1, Package Dimensions. 3. Pin names in brackets [ ] represent a single functional signal. They should not be considered as two separate functional signals.
Pin Assignment for the 128-Pin Package
M16C/65 Group
PLQP0128KB-A (128P6Q-A) (Top view)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 P1_1/CLK6/D9 P1_2/RXD6/SCL6/D10 P1_3/TXD6/SDA6/D11 P1_4/D12 P1_5/INT3/IDV/D13 P1_6/INT4/IDW/D14 P1_7/INT5/IDU/D15 P2_0/AN2_0/A0, [A0/D0], A0 P2_1/AN2_1/A1, [A1/D1], [A1/D0] P2_2/AN2_2/A2, [A2/D2], [A2/D1] P2_3/AN2_3/A3, [A3/D3], [A3/D2] P2_4/INT6/AN2_4/A4, [A4/D4], [A4/D3] P2_5/INT7/AN2_5/A5, [A5/D5], [A5/D4] P2_6/AN2_6/A6, [A6/D6], [A6/D5] P2_7/AN2_7/A7, [A7/D7], [A7/D6] VSS P3_0/A8 [A8/D7] VCC2 P12_0 P12_1 P12_2 P12_3 P12_4 P3_1/A9 P3_2/A10 P3_3/A11 P3_4/A12 P3_5/A13 P3_6/A14 P3_7/A15 P4_0/A16 P4_1/A17 P4_2/A18 P4_3/A19 P4_4/CTS7/RTS7/CS0 P4_5/CLK7/CS1 P4_6/PWM0/RXD7/SCL7/CS2 P4_7/PWM1/TXD7/SDA7/CS3 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 P12_5 P12_6 P12_7 P5_0/WRL/WR P5_1/WRH/BHE P5_2/RD P5_3/BCLK P13_0 P13_1 P13_2 P13_3 P5_4/HLDA P5_5/HOLD P5_6/ALE P5_7/RDY/CLKOUT P13_4 P13_5 P13_6 P13_7 P6_0/RTCOUT/CTS0/RTS0 P6_1/CLK0 P6_2/RXD0/SCL0 P6_3/TXD0/SDA0 P6_4/CTS1/RTS1/CTS0/CLKS1 P6_5/CLK1 VSS
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1. Overview
M16C/65 Group
1. Overview
Table 1.7
Pin Names for the 128-Pin Package (1/3)
I/O Pin for Peripheral Function Port Interrupt Timer Serial interface A/D converter, D/A converter Bus Control Pin
Pin No. Control Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VREF AVCC
P9_7 P9_6 P9_5 P9_4 P9_3 P9_2 P9_1 P9_0 P14_1 P14_0 BYTE CNVSS XCIN XCOUT RESET XOUT VSS XIN VCC1
SIN4 SOUT4 CLK4 TB4IN/PWM1 TB3IN/PWM0 TB2IN/PMC0 TB1IN/PMC1 TB0IN
ADTRG ANEX1 ANEX0 DA1 DA0
SOUT3 SIN3 CLK3
P8_7 P8_6
P8_5 P8_4 P8_3 P8_2 P8_1 P8_0 P7_7 P7_6 P7_5 P7_4 P7_3 P7_2 P7_1 P7_0 P6_7 VCC1 P6_6 VSS P6_5 P6_4 P6_3 P6_2 P6_1 P6_0 P13_7 P13_6 P13_5 P13_4 P5_7
NMI INT2 INT1 INT0
SD ZP
CEC
TA4IN/U TA4OUT/U TA3IN TA3OUT TA2IN/W TA2OUT/W TA1IN/V TA1OUT/V TA0IN/TB5IN TA0OUT
CTS5/RTS5 RXD5/SCL5 CLK5 TXD5/SDA5
CTS2/RTS2 CLK2 RXD2/SCL2/SCLMM TXD2/SDA2/SDAMM TXD1/SDA1
RXD1/SCL1 CLK1 CTS1/RTS1/CTS0/CLKS1 TXD0/SDA0 RXD0/SCL0 CLK0 CTS0/RTS0
RTCOUT
CLKOUT
RDY
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M16C/65 Group
1. Overview
Table 1.8
Pin No. 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
Pin Names for the 128-Pin Package (2/3)
Control Pin I/O Pin for Peripheral Function Port P5_6 P5_5 P5_4 P13_3 P13_2 P13_1 P13_0 P5_3 P5_2 P5_1 P5_0 P12_7 P12_6 P12_5 P4_7 P4_6 P4_5 P4_4 P4_3 P4_2 P4_1 P4_0 P3_7 P3_6 P3_5 P3_4 P3_3 P3_2 P3_1 P12_4 P12_3 P12_2 P12_1 P12_0 Interrupt Timer Serial interface A/D converter, D/A converter Bus Control Pin ALE HOLD HLDA
BCLK RD WRH/BHE WRL/WR
PWM1 PWM0
TXD7/SDA7 RXD7/SCL7 CLK7 CTS7/RTS7
CS3 CS2 CS1 CS0 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9
VCC2 P3_0 VSS P2_7 P2_6 P2_5 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7 P1_6 P1_5 P1_4 P1_3 AN2_7 AN2_6 AN2_5 AN2_4 AN2_3 AN2_2 AN2_1 AN2_0 IDU IDW IDV TXD6/SDA6 A7, [A7/D7], [A7/D6] A6, [A6/D6], [A6/D5] A5, [A5/D5], [A5/D4] A4[A4/D4], [A4/D3] A3, [A3/D3], [A3/D2] A2, [A2/D2], [A2/D1] A1, [A1/D1], [A1/D0] A0, [A0/D0], A0 D15 D14 D13 D12 D11 A8, [A8/D7]
INT7 INT6
INT5 INT4 INT3
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M16C/65 Group
1. Overview
Table 1.9
Pin No. 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 Control Pin
Pin Names for the 128-Pin Package (3/3)
I/O Pin for Peripheral Function Port P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 P11_7 P11_6 P11_5 P11_4 P11_3 P11_2 P11_1 P11_0 P10_7 P10_6 P10_5 P10_4 P10_3 P10_2 P10_1 Interrupt Timer Serial interface RXD6/SCL6 CLK6 CTS6/RTS6 AN0_7 AN0_6 AN0_5 AN0_4 AN0_3 AN0_2 AN0_1 AN0_0 A/D converter, D/A converter D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Bus Control Pin
KI3 KI2 KI1 KI0
AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0
AVSS P10_0
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M16C/65 Group
Figure 1.6
P0_7/AN0_7/D7 P0_6/AN0_6/D6 P0_5/AN0_5/D5 P0_4/AN0_4/D4 P0_3/AN0_3/D3 P0_2/AN0_2/D2 P0_1/AN0_1/D1 P0_0/AN0_0/D0 P10_7/AN7/KI3 P10_6/AN6/KI2 P10_5/AN5/KI1 P10_4/AN4/KI0 P10_3/AN3 P10_2/AN2 P10_1/AN1 AVSS P10_0/AN0 VREF AVCC P9_7/ADTRG/SIN4 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
R01DS0031EJ0200 Rev.2.00 Feb 07, 2011
See Note 3
VCC2 ports
VCC1 ports
P9_6/ANEX1/SOUT4 P9_5/ANEX0/CLK4 P9_4/DA1/TB4IN/PWM1 P9_3/DA0/TB3IN/PWM0 P9_2/TB2IN/PMC0/SOUT3 P9_1/TB1IN/PMC1/SIN3 P9_0/TB0IN/CLK3 BYTE CNVSS P8_7/XCIN P8_6/XCOUT RESET XOUT VSS XIN VCC1 P8_5/NMI/SD/CEC (1) P8_4/INT2/ZP P8_3/INT1 P8_2/INT0 P8_1/TA4IN/U/CTS5/RTS5 P8_0/TA4OUT/U/RXD5/SCL5 P7_7/TA3IN/CLK5 P7_6/TA3OUT/TXD5/SDA5 P7_5/TA2IN/W P7_4/TA2OUT/W P7_3/CTS2/RTS2/TA1IN/V P7_2/CLK2/TA1OUT/V P7_1/RXD2/SCL2/SCLMM/TA0IN/TB5IN (1) P7_0/TXD2/SDA2/SDAMM/TA0OUT (1)
Notes: 1. N-channel open drain output. 2. Check the position of Pin 1 by referring to appendix 1, Package Dimensions. 3. Pin names in brackets [ ] represent a single functional signal. They should not be considered as two separate functional signals.
Pin Assignment for the 100-Pin Package
M16C/65 Group
PRQP0100JD-B (100P6F-A) (Top view)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 P4_4/CTS7/RTS7/CS0 P4_5/CLK7/CS1 P4_6/PWM0/RXD7/SCL7/CS2 P4_7/PWM1/TXD7/SDA7/CS3 P5_0/WRL/WR P5_1/WRH/BHE P5_2/RD P5_3/BCLK P5_4/HLDA P5_5/HOLD P5_6/ALE P5_7/RDY/CLKOUT P6_0/RTCOUT/CTS0/RTS0 P6_1/CLK0 P6_2/RXD0/SCL0 P6_3/TXD0/SDA0 P6_4/CTS1/RTS1/CTS0/CLKS1 P6_5/CLK1 P6_6/RXD1/SCL1 P6_7/TXD1/SDA1
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
P1_0/CTS6/RTS6/D8 P1_1/CLK6/D9 P1_2/RXD6/SCL6/D10 P1_3/TXD6/SDA6/D11 P1_4/D12 P1_5/INT3/IDV/D13 P1_6/INT4/IDW/D14 P1_7/INT5/IDU/D15 P2_0/AN2_0/A0, [A0/D0], A0 P2_1/AN2_1/A1, [A1/D1], [A1/D0] P2_2/AN2_2/A2, [A2/D2], [A2/D1] P2_3/AN2_3/A3, [A3/D3], [A3/D2] P2_4/INT6/AN2_4/A4, [A4/D4], [A4/D3] P2_5/INT7/AN2_5/A5, [A5/D5], [A5/D4] P2_6/AN2_6/A6, [A6/D6], [A6/D5] P2_7/AN2_7/A7, [A7/D7], [A7/D6] VSS P3_0/A8 [A8/D7] VCC2 P3_1/A9 P3_2/A10 P3_3/A11 P3_4/A12 P3_5/A13 P3_6/A14 P3_7/A15 P4_0/A16 P4_1/A17 P4_2/A18 P4_3/A19
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1. Overview
M16C/65 Group
1. Overview
See Note 3 P1_3/TXD6/SDA6/D11 P1_4/D12 P1_5/INT3/IDV/D13 P1_6/INT4/IDW/D14 P1_7/INT5/IDU/D15 P2_0/AN2_0/A0, [A0/D0], A0 P2_1/AN2_1/A1, [A1/D1], [A1/D0] P2_2/AN2_2/A2, [A2/D2], [A2/D1] P2_3/AN2_3/A3, [A3/D3], [A3/D2] P2_4/INT6/AN2_4/A4, [A4/D4], [A4/D3] P2_5/INT7/AN2_5/A5, [A5/D5], [A5/D4] P2_6/AN2_6/A6, [A6/D6], [A6/D5] P2_7/AN2_7/A7, [A7/D7], [A7/D6] VSS P3_0/A8 [A8/D7] VCC2 P3_1/A9 P3_2/A10 P3_3/A11 P3_4/A12 P3_5/A13 P3_6/A14 P3_7/A15 P4_0/A16 P4_1/A17 P1_2/RXD6/SCL6/D10 P1_1/CLK6/D9 P1_0/CTS6/RTS6/D8 P0_7/AN0_7/D7 P0_6/AN0_6/D6 P0_5/AN0_5/D5 P0_4/AN0_4/D4 P0_3/AN0_3/D3 P0_2/AN0_2/D2 P0_1/AN0_1/D1 P0_0/AN0_0/D0 P10_7/AN7/KI3 P10_6/AN6/KI2 P10_5/AN5/KI1 P10_4/AN4/KI0 P10_3/AN3 P10_2/AN2 P10_1/AN1 AVSS P10_0/AN0 VREF AVCC P9_7/ADTRG/SIN4 P9_6/ANEX1/SOUT4 P9_5/ANEX0/CLK4 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26
VCC2 ports
M16C/65 Group PLQP0100KB-A (100P6Q-A) (Top view)
VCC1 ports
P4_2/A18 P4_3/A19 P4_4/CTS7/RTS7/CS0 P4_5/CLK7/CS1 P4_6/PWM0/RXD7/SCL7/CS2 P4_7/PWM1/TXD7/SDA7/CS3 P5_0/WRL/WR P5_1/WRH/BHE P5_2/RD P5_3/BCLK P5_4/HLDA P5_5/HOLD P5_6/ALE P5_7/RDY/CLKOUT P6_0/RTCOUT/CTS0/RTS0 P6_1/CLK0 P6_2/RXD0/SCL0 P6_3/TXD0/SDA0 P6_4/CTS1/RTS1/CTS0/CLKS1 P6_5/CLK1 P6_6/RXD1/SCL1 P6_7/TXD1/SDA1 P7_0/TXD2/SDA2/SDAMM/TA0OUT (1) P7_1/RXD2/SCL2/SCLMM/TA0IN/TB5IN P7_2/CLK2/TA1OUT/V
(1)
Notes: 1. N-channel open drain output. 2. Check the position of Pin 1 by referring to appendix 1, Package Dimensions. 3. Pin names in brackets [ ] represent a single functional signal. They should not be considered as two separate functional signals.
Figure 1.7
Pin Assignment for the 100-Pin Package
R01DS0031EJ0200 Rev.2.00 Feb 07, 2011
P9_4/DA1/TB4IN/PWM1 P9_3/DA0/TB3IN/PWM0 P9_2/TB2IN/PMC0/SOUT3 P9_1/TB1IN/PMC1/SIN3 P9_0/TB0IN/CLK3 BYTE CNVSS P8_7/XCIN P8_6/XCOUT RESET XOUT VSS XIN VCC1 P8_5/NMI/SD/CEC (1) P8_4/INT2/ZP P8_3/INT1 P8_2/INT0 P8_1/TA4IN/U/CTS5/RTS5 P8_0/TA4OUT/U/RXD5/SCL5 P7_7/TA3IN/CLK5 P7_6/TA3OUT/TXD5/SDA5 P7_5/TA2IN/W P7_4/TA2OUT/W P7_3/CTS2/RTS2/TA1IN/V
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
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M16C/65 Group
1. Overview
Table 1.10
Pin No. FA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 FB 99 100 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
Pin Names for the 100-Pin Package (1/2)
I/O Pin for Peripheral Function Control Pin Port P9_6 P9_5 P9_4 P9_3 P9_2 P9_1 P9_0 Interrupt Timer Serial interface SOUT4 CLK4 TB4IN/PWM1 TB3IN/PWM0 TB2IN/PMC0 TB1IN/PMC1 TB0IN A/D converter, D/A converter ANEX1 ANEX0 DA1 DA0 Bus Control Pin
SOUT3 SIN3 CLK3
BYTE CNVSS XCIN XCOUT RESET XOUT VSS XIN VCC1
P8_7 P8_6
P8_5 P8_4 P8_3 P8_2 P8_1 P8_0 P7_7 P7_6 P7_5 P7_4 P7_3 P7_2 P7_1 P7_0 P6_7 P6_6 P6_5 P6_4 P6_3 P6_2 P6_1 P6_0 P5_7 P5_6 P5_5 P5_4 P5_3 P5_2 P5_1 P5_0 P4_7 P4_6 P4_5 P4_4
NMI INT2 INT1 INT0
SD ZP
CEC
TA4IN/U TA4OUT/U TA3IN TA3OUT TA2IN/W TA2OUT/W TA1IN/V TA1OUT/V TA0IN/TB5IN TA0OUT
CTS5/RTS5 RXD5/SCL5 CLK5 TXD5/SDA5
RTCOUT
CTS2/RTS2 CLK2 RXD2/SCL2/SCLMM TXD2/SDA2/SDAMM TXD1/SDA1 RXD1/SCL1 CLK1 CTS1/RTS1/CTS0/ CLKS1 TXD0/SDA0 RXD0/SCL0 CLK0 CTS0/RTS0 RDY ALE HOLD HLDA BCLK RD WRH/BHE WRL/WR CS3 CS2 CS1 CS0
CLKOUT
PWM1 PWM0
TXD7/SDA7 RXD7/SCL7 CLK7 CTS7/RTS7
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M16C/65 Group
1. Overview
Table 1.11
Pin No. FA 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 FB 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98
Pin Names for the 100-Pin Package (2/2)
Control Pin Port P4_3 P4_2 P4_1 P4_0 P3_7 P3_6 P3_5 P3_4 P3_3 P3_2 P3_1 VCC2 P3_0 VSS P2_7 P2_6 P2_5 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7 P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 P10_7 P10_6 P10_5 P10_4 P10_3 P10_2 P10_1 AVSS P10_0 VREF AVCC P9_7 SIN4
ADTRG
Interrupt
I/O Pin for Peripheral Function A/D converter, Timer Serial interface D/A converter A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9
Bus Control Pin
A8, [A8/D7] AN2_7 AN2_6 AN2_5 AN2_4 AN2_3 AN2_2 AN2_1 AN2_0 IDU IDW IDV TXD6/SDA6 RXD6/SCL6 CLK6 CTS6/RTS6 AN0_7 AN0_6 AN0_5 AN0_4 AN0_3 AN0_2 AN0_1 AN0_0 AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0 A7, [A7/D7], [A7/D6] A6, [A6/D6], [A6/D5] A5, [A5/D5], [A5/D4] A4, [A4/D4], [A4/D3] A3, [A3/D3], [A3/D2] A2, [A2/D2], [A2/D1] A1, [A1/D1], [A1/D0] A0, [A0/D0], A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
INT7 INT6
INT5 INT4 INT3
KI3 KI2 KI1 KI0
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M16C/65 Group
1. Overview
1.6
Pin Functions
Pin Functions for the 128-Pin Package (1/3)
Pin Name VCC1, VCC2, VSS AVCC, AVSS
RESET
Table 1.12
Signal Name Power supply input Analog power supply input Reset input
I/O I
Power Supply -
Description Apply 2.7 to 5.5 V to pins VCC1 and VCC2 (VCC1 VCC2), and 0 V to the VSS pin. This is the power supply for the A/D and D/A converters. Connect the AVCC pin to VCC1, and connect the AVSS pin to VSS. Driving this pin low resets the MCU. Input pin to switch processor modes. After a reset, to start operating in single-chip mode, connect the CNVSS pin to VSS via a resistor. To start operating in microprocessor mode, connect the pin to VCC1. Input pin to select the data bus of the external area. The data bus is 16 bits when it is low and 8 bits when it is high. This pin must be fixed either high or low. Connect the BYTE pin to VSS in single-chip mode. Inputs or outputs data (D0 to D7) while accessing an external area with a separate bus. Inputs or outputs data (D8 to D15) while accessing an external area with a 16-bit separate bus. Outputs address bits A0 to A19. Inputs or outputs data (D0 to D7) and outputs address bits (A0 to A7) by timesharing, while accessing an external area with an 8-bit multiplexed bus. Inputs or outputs data (D0 to D7) and outputs address bits (A1 to A8) by timesharing, while accessing an external area with a 16-bit multiplexed bus. Outputs chip-select signals CS0 to CS3 to specify an external area. Outputs WRL, WRH, (WR, BHE), and RD signals. WRL and WRH can be switched with BHE and WR. * WRL, WRH, and RD selected If the external data bus is 16 bits, data is written to an even address in an external area when WRL is driven low. Data is written to an odd address when WRH is driven low. Data is read when RD is driven low. * WR, BHE, and RD selected Data is written to an external area when WR is driven low. Data in an external area is read when RD is driven low. An odd address is accessed when BHE is driven low. Select WR, BHE, and RD when using an 8-bit external data bus. Outputs an ALE signal to latch the address.
HOLD input is unavailable. Connect the HOLD pin to VCC2 via a resistor (pull-up).
I I
VCC1 VCC1
CNVSS
CNVSS
I
VCC1
External data bus width select input
BYTE
I
VCC1
D0 to D7 D8 to D15 A0 to A19 A0/D0 to A7/D7 A1/D0 to A8/D7
CS0 to CS3
I/O I/O O I/O
VCC2 VCC2 VCC2 VCC2
I/O
VCC2
O
VCC2
Bus control pins
WRL/WR WRH/BHE RD
O
VCC2
ALE
HOLD HLDA RDY
O I O I
VCC2 VCC2 VCC2 VCC2
In a hold state, HLDA outputs a low-level signal. The MCU bus is placed in wait state while the RDY pin is driven low.
Power supply: VCC2 is used to supply power to the external bus associated pins. The dual power supply configuration allows VCC2 to interface at a different voltage than VCC1.
R01DS0031EJ0200 Rev.2.00 Feb 07, 2011
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M16C/65 Group
1. Overview
Table 1.13
Pin Functions for the 128-Pin Package (2/3)
Pin Name XIN XOUT XCIN XCOUT BCLK CLKOUT
INT0 to INT2 INT3 to INT7 NMI KI0 to KI3
Signal Name Main clock input Main clock output Sub clock input Sub clock output BCLK output Clock output
INT interrupt input NMI interrupt input
I/O I O I O O O I I I I I/O I I I O I I O O I I I O O I/O I/O I I O O O
Power Supply VCC1 VCC1 VCC1 VCC1 VCC2 VCC2 VCC1 VCC2 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC2 VCC1
Description I/O for the main clock oscillator. Connect a ceramic resonator or crystal between pins XIN and XOUT. (1) Input an external clock to XIN pin and leave XOUT pin open. I/O for a sub clock oscillator. Connect a crystal between pins XCIN and XCOUT. (1) Input an external clock to XCIN pin and leave XCOUT pin open. Outputs the BCLK signal. Outputs a clock with the same frequency as fC, f1, f8, or f32. Input for the INT interrupt. Input for the NMI interrupt. Input for the key input interrupt. I/O for timers A0 to A4 (TA0OUT is N-channel open drain output). Input for timers A0 to A4. Input for Z-phase. Input for timers B0 to B5. Output for the three-phase motor control timer. Forced cutoff input. Input for the position data. Output for the real-time clock.
Key input interrupt input
TA0OUT to TA4OUT Timer A TA0IN to TA4IN ZP Timer B Three-phase motor control timer Real-time clock output PWM output Remote control signal receiver input TB0IN to TB5IN U, U, V, V, W, W
SD
IDU, IDV, IDW RTCOUT PWM0, PWM1 PMC0, PMC1
CTS0 to CTS2, CTS5 CTS6, CTS7 RTS0 to RTS2, RTS5 RTS6, RTS7
VCC1, VCC2 PWM output. VCC1 VCC1 VCC2 VCC1 VCC2 VCC1 VCC2 VCC1 VCC2 VCC1 VCC2 VCC1 Output for the transmit/receive clock multiple-pin output function. Serial data output. (2) Serial data input. Transmit/receive clock I/O. Output pins to control data reception. Input for the remote control signal receiver.
Input pins to control data transmission.
Serial interface UART0 to UART2, UART5 to UART7
CLK0 to CLK2, CLK5 CLK6, CLK7 RXD0 to RXD2, RXD5 RXD6, RXD7 TXD0 to TXD2, TXD5 TXD6, TXD7 CLKS1
Notes: 1. Contact the manufacturer of crystal/ceramic resonator regarding the oscillation characteristics. 2. TXD2, SDA2, and SCL2 are N-channel open drain output pins. TXDi (i = 0, 1, 5 to 7), SDAi, and SCLi can be selected as CMOS output pins or N-channel open drain output pins.
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M16C/65 Group
1. Overview
Table 1.14
Signal Name UART0 to UART2, UART5 to UART7 I2C mode
Pin Functions for the 128-Pin Package (3/3)
Pin Name SDA0 to SDA2, SDA5 SDA6, SDA7 SCL0 to SCL2, SCL5 SCL6, SCL7 CLK3, CLK4 I/O I/O I/O I/O I/O I/O I O I/O I/O I/O I I I I I O Power Supply VCC1 VCC2 VCC1 VCC2 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC2 VCC1 VCC1 VCC1 Analog input. External trigger input. Extended analog input. Output pin the D/A converter. Transmit/receive clock I/O. Serial data input. Serial data output. Serial data I/O (N-channel open drain output). Transmit/receive clock I/O (N-channel open drain output). CEC I/O (N-channel open drain output). Reference voltage input for the A/D and D/A converters. Transmit/receive clock I/O. Serial data I/O. Description
Serial interface SI/O3, SI/O4
SIN3, SIN4 SOUT3, SOUT4
Multi-master I2Cbus interface CEC I/O Reference voltage input
SDAMM SCLMM CEC VREF AN0 to AN7
A/D converter
AN0_0 to AN0_7 AN2_0 to AN2_7
ADTRG
ANEX0, ANEX1 D/A converter DA0, DA1 P0_0 to P0_7 P1_0 to P1_7 P2_0 to P2_7 P3_0 to P3_7 P4_0 to P4_7 P5_0 to P5_7 P12_0 to P12_7 P13_0 to P13_7 P6_0 to P6_7 P7_0 to P7_7 P8_0 to P8_7 P9_0 to P9_7 P10_0 to P10_7 P11_0 to P11_7 P14_0, P14_1
I/O
VCC2
8-bit CMOS I/O ports. A direction register determines whether each pin is used as an input port or an output port. A pull-up resistor may be enabled or disabled for input ports in 4-bit units.
I/O ports
I/O
VCC1
8-bit I/O ports having equivalent functions to P0. However, P7_0, P7_1, and P8_5 are N-channel open drain output ports. No pull-up resistor is provided. P8_5 is an input port for verifying the NMI pin level and shares a pin with NMI. I/O ports having equivalent functions to P0.
I/O
VCC1
R01DS0031EJ0200 Rev.2.00 Feb 07, 2011
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M16C/65 Group
1. Overview
Table 1.15
Power supply input Analog power supply input Reset input
Pin Functions for the 100-Pin Package (1/3)
Pin Name VCC1, VCC2, VSS AVCC, AVSS
RESET
Signal Name
I/O I
Power Supply -
Description Apply 2.7 to 5.5 V to pins VCC1 and VCC2 (VCC1 VCC2) and 0 V to the VSS pin. This is the power supply for the A/D and D/A converters. Connect the AVCC pin to VCC1, and connect the AVSS pin to VSS. Driving this pin low resets the MCU. Input pin to switch processor modes. After a reset, to start operating in single-chip mode, connect the CNVSS pin to VSS via a resistor. To start operating in microprocessor mode, connect the pin to VCC1. Input pin to select the data bus of the external area. The data bus is 16 bits when it is low, and 8 bits when it is high. This pin must be fixed either high or low. Connect the BYTE pin to VSS in single-chip mode. Inputs or outputs data (D0 to D7) while accessing an external area with a separate bus. Inputs or outputs data (D8 to D15) while accessing an external area with a 16-bit separate bus. Outputs address bits A0 to A19. Inputs or outputs data (D0 to D7) and outputs address bits (A0 to A7) by timesharing, while accessing an external area with an 8-bit multiplexed bus. Inputs or outputs data (D0 to D7) and outputs address bits (A1 to A8) by timesharing, while accessing an external area with a 16-bit multiplexed bus. Outputs chip-select signals CS0 to CS3 to specify an external area. Outputs WRL, WRH, (WR, BHE), and RD signals. WRL and WRH can be switched with BHE and WR. * WRL, WRH, and RD selected If the external data bus is 16 bits, data is written to an even address in an external area when WRL is driven low. Data is written to an odd address when WRH is driven low. Data is read when RD is driven low. * WR, BHE, and RD selected Data is written to an external area when WR is driven low. Data in an external area is read when RD is driven low. An odd address is accessed when BHE is driven low. Select WR, BHE, and RD when using an 8-bit external data bus. Outputs an ALE signal to latch the address.
HOLD input is unavailable. Connect the HOLD pin to VCC2 via a resistor (pull-up).
I I
VCC1 VCC1
CNVSS
CNVSS
I
VCC1
External data bus width select input
BYTE
I
VCC1
D0 to D7 D8 to D15 A0 to A19 A0/D0 to A7/D7 A1/D0 to A8/D7
CS0 to CS3
I/O I/O O I/O
VCC2 VCC2 VCC2 VCC2
I/O
VCC2
O
VCC2
Bus control pins
WRL/WR WRH/BHE RD
O
VCC2
ALE
HOLD HLDA RDY
O I O I
VCC2 VCC2 VCC2 VCC2
In a hold state, HLDA outputs a low-level signal. The MCU bus is placed in a wait state while the RDY pin is driven low.
Power supply: VCC2 is used to supply power to the external bus associated pins. The dual power supply configuration allows VCC2 to interface at a different voltage than VCC1.
R01DS0031EJ0200 Rev.2.00 Feb 07, 2011
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M16C/65 Group
1. Overview
Table 1.16
Pin Functions for the 100-Pin Package (2/3)
Pin Name XIN XOUT XCIN XCOUT BCLK CLKOUT
INT0 to INT2 INT3 to INT7 NMI KI0 to KI3
Signal Name Main clock input Main clock output Sub clock input Sub clock output BCLK output Clock output
INT interrupt input NMI interrupt input
I/O Power Supply I O I O O O I I I I I/O I I I O I I O O I I I O O I/O I/O I I O O O VCC1 VCC1 VCC1 VCC1 VCC2 VCC2 VCC1 VCC2 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC2 VCC1
Description I/O for the main clock oscillator. Connect a ceramic resonator or crystal between pins XIN and XOUT. (1) Input an external clock to XIN pin and leave XOUT pin open. I/O for a sub clock oscillator. Connect a crystal between XCIN pin and XCOUT pin. (1) Input an external clock to XCIN pin and leave XCOUT pin open. Outputs the BCLK signal. Outputs a clock with the same frequency as fC, f1, f8, or f32. Input for the INT interrupt. Input for the NMI interrupt. Input for the key input interrupt. I/O for timers A0 to A4 (TA0OUT is N-channel open drain output). Input for timers A0 to A4. Input for Z-phase. Input for timers B0 to B5. Output for the three-phase motor control timer. Forced cutoff input. Input for the position data. Output for the real-time clock.
Key input interrupt input
TA0OUT to TA4OUT Timer A TA0IN to TA4IN ZP Timer B Three-phase motor control timer Real-time clock output PWM output Remote control signal receiver input TB0IN to TB5IN U, U, V, V, W, W
SD
IDU, IDV, IDW RTCOUT PWM0, PWM1 PMC0, PMC1
CTS0 to CTS2, CTS5 CTS6, CTS7 RTS0 to RTS2, RTS5 RTS6, RTS7
VCC1, VCC2 PWM output. VCC1 VCC1 VCC2 VCC1 VCC2 VCC1 VCC2 VCC1 VCC2 VCC1 VCC2 VCC1 Output for the transmit/receive clock multiple-pin output function. Serial data output. (2) Serial data input. Transmit/receive clock I/O. Output pins to control data reception. Input for the remote control signal receiver.
Input pins to control data transmission.
Serial interface UART0 to UART2, UART5 to UART7
CLK0 to CLK2, CLK5 CLK6, CLK7 RXD0 to RXD2, RXD5 RXD6, RXD7 TXD0 to TXD2, TXD5 TXD6, TXD7 CLKS1
Notes: 1. Contact the manufacturer of crystal/ceramic resonator regarding the oscillation characteristics. 2. TXD2, SDA2, and SCL2 are N-channel open drain output pins. TXDi (i = 0, 1, 5 to 7), SDAi, and SCLi can be selected as CMOS output pins or N-channel open drain output pins.
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M16C/65 Group
1. Overview
Table 1.17
Signal Name UART0 to UART2, UART5 to UART7 I2C mode Serial interface SI/O3, SI/O4 Multi-master I2C-bus interface CEC I/O Reference voltage input
Pin Functions for the 100-Pin Package (3/3)
Pin Name SDA0 to SDA2, SDA5 SDA6, SDA7 SCL0 to SCL2, SCL5 SCL6, SCL7 CLK3, CLK4 SIN3, SIN4 SOUT3, SOUT4 SDAMM SCLMM CEC VREF AN0 to AN7 I/O I/O I/O I/O I/O I/O I O I/O I/O I/O I I I I I O Power Supply VCC1 VCC2 VCC1 VCC2 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC1 VCC2 VCC1 VCC1 VCC1 Analog input. External trigger input. Extended analog input. Output for the D/A converter. Transmit/receive clock I/O. Serial data input. Serial data output. Serial data I/O (N-channel open drain output). Transmit/receive clock I/O (N-channel open drain output). CEC I/O (N-channel open drain output). Reference voltage input for the A/D and D/A converters. Transmit/receive clock I/O. Serial data I/O. Description
A/D converter
AN0_0 to AN0_7 AN2_0 to AN2_7
ADTRG
ANEX0, ANEX1 D/A converter DA0, DA1 P0_0 to P0_7 P1_0 to P1_7 P2_0 to P2_7 P3_0 to P3_7 P4_0 to P4_7 P5_0 to P5_7 P6_0 to P6_7 P7_0 to P7_7 P8_0 to P8_7 P9_0 to P9_7 P10_0 to P10_7
I/O
VCC2
8-bit CMOS I/O ports. A direction register determines whether each pin is used as an input port or an output port. A pull-up resistor may be enabled or disabled for input ports in 4-bit units.
I/O ports
I/O
VCC1
8-bit I/O ports having equivalent functions to P0. However, P7_0, P7_1, and P8_5 are N-channel open drain output ports. No pull-up resistor is provided. P8_5 is an input port for verifying the NMI pin level and shares a pin with NMI.
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M16C/65 Group
2. Central Processing Unit (CPU)
2.
Central Processing Unit (CPU)
Figure 2.1 shows the CPU registers. Seven registers (R0, R1, R2, R3, A0, A1, and FB) out of 13 compose a register bank, and there are two register banks.
b31
b15
b8 b7
b0
R2 R3
R0H (upper bits of R0) R1H (upper bits of R1)
R0L (lower bits of R0) R1L (lower bits of R1)
Data registers (1)
R2 R3 A0 A1 FB
b19 b15 b0
Address registers (1) Frame base registers (1)
INTBH
INTBL
Interrupt table register
INTBH is the 4 upper bits of the INTB register and INTBL is the 16 lower bits.
b19 b0
PC
b15 b0
Program counter
USP ISP SB
b15 b0
User stack pointer Interrupt stack pointer Static base register
FLG
b15 b8 b7 b0
Flag register
IPL
U
I
OB
S
Z
D
C
Carry flag Debug flag Zero flag Sign flag Register bank select flag Overflow flag Interrupt enable flag Stack pointer select flag Reserved area Processor interrupt priority level Reserved area Note: 1. These registers compose a register bank. There are two register banks.
Figure 2.1
CPU Registers
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M16C/65 Group
2. Central Processing Unit (CPU)
2.1
Data Registers (R0, R1, R2, and R3)
R0, R1, R2, and R3 are 16-bit registers used for transfer, arithmetic, and logic operations. R0 and R1 can be split into upper (R0H/R1H) and lower (R0L/R1L) bits to be used separately as 8-bit data registers. R0 can be combined with R2, and R3 can be combined with R1 and be used as 32-bit data registers R2R0 and R3R1, respectively.
2.2
Address Registers (A0 and A1)
A0 and A1 are 16-bit registers used for indirect addressing, relative addressing, transfer, arithmetic, and logic operations. A0 can be combined with A1 and used as a 32-bit address register (A1A0).
2.3
Frame Base Register (FB)
FB is a 16-bit register that is used for FB relative addressing.
2.4
Interrupt Table Register (INTB)
INTB is a 20-bit register that indicates the start address of a relocatable interrupt vector table.
2.5
Program Counter (PC)
The PC is 20 bits wide and indicates the address of the next instruction to be executed.
2.6
User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
The USP and ISP stack pointers (SP) are each comprised of 16 bits. The U flag is used to switch between USP and ISP.
2.7
Static Base Register (SB)
SB is a 16-bit register used for SB relative addressing.
2.8
Flag Register (FLG)
FLG is an 11-bit register that indicates the CPU state.
2.8.1
Carry Flag (C Flag)
The C flag retains a carry, borrow, or shift-out bit generated by the arithmetic/logic unit.
2.8.2
Debug Flag (D Flag)
The D flag is for debugging only. Set it to 0.
2.8.3
Zero Flag (Z Flag)
The Z flag becomes 1 when an arithmetic operation results in 0. Otherwise, it becomes 0.
2.8.4
Sign Flag (S Flag)
The S flag becomes 1 when an arithmetic operation results in a negative value. Otherwise, it becomes 0.
2.8.5
Register Bank Select Flag (B Flag)
Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is 1.
2.8.6
Overflow Flag (O Flag)
The O flag becomes 1 when an arithmetic operation results in an overflow. Otherwise, it becomes 0.
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2. Central Processing Unit (CPU)
2.8.7
Interrupt Enable Flag (I Flag)
The I flag enables maskable interrupts. Maskable interrupts are disabled when the I flag is 0, and enabled when it is 1. The I flag becomes 0 when an interrupt request is accepted.
2.8.8
Stack Pointer Select Flag (U Flag)
ISP is selected when the U flag is 0. USP is selected when the U flag is 1. The U flag becomes 0 when a hardware interrupt request is accepted, or the INT instruction of software interrupt number 0 to 31 is executed.
2.8.9
Processor Interrupt Priority Level (IPL)
IPL is 3 bits wide and assigns processor interrupt priority levels from 0 to 7. If a requested interrupt has higher priority than IPL, the interrupt request is enabled.
2.8.10
Reserved Areas
Only set these bits to 0. The read value is undefined.
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M16C/65 Group
3. Address Space
3.
3.1
Address Space
Address Space
The M16C/65 Group has a 1 MB address space from 00000h to FFFFFh. Address space is expandable to 4 MB with the memory area expansion function. Addresses 40000h to BFFFFh can be used as external areas from bank 0 to bank 7. Figure 3.1 shows the Address Space. Areas that can be accessed vary depending on processor mode and the status of each control bit.
Memory expansion mode 00000h 00400h Internal RAM Reserved area 04000h 0D000h 0D800h 0E000h 10000h 1 MB address space 14000h 27000h 28000h 40000h External area BFFFFh D0000h Reserved area Internal ROM (program ROM 1) FFFFFh Notes: 1. Do not access reserved areas. 2. The figure above applies under the following conditions: - The PM13 bit in the PM1 register is 0 (addresses 04000h to 0CFFFh and 80000h to CFFFFh are used as external areas) - The IRON bit in the PRG2C register is 0 (addresses 40000h to 7FFFFh are used as an external area) Program ROM 1 is allocated from address FFFFFh lower. Bank 0 512 KB x 8 External area SFR External area Internal ROM (data flash) Internal ROM (program ROM 2) External area Reserved area When data flash is enabled When program ROM 2 is enabled Bank 7 Bank 6 Bank 5 Bank 4 Bank 3 Bank 2 Bank 1 In 4 MB mode SFR Internal RAM is allocated from address 00400h higher.
Figure 3.1
Address Space
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3. Address Space
3.2
Memory Map
Special function registers (SFRs) are allocated from address 00000h to 003FFh and from 0D000h to 0D7FFh. Peripheral function control registers are located here. All blank areas within SFRs are reserved. Do not access these areas. Internal RAM is allocated from address 00400h and higher, with 10 KB of internal RAM allocated from 00400h to 02BFFh. Internal RAM is used not only for data storage, but also for the stack area when subroutines are called or when an interrupt request is accepted. The internal ROM is flash memory. Three internal ROM areas are available: data flash, program ROM 1, and program ROM 2. The data flash is allocated from 0E000h to 0FFFFh. This data flash area is mostly used for data storage, but can also store programs. Program ROM 2 is allocated from 10000h to 13FFFh. Program ROM 1 is allocated from FFFFFh and lower, with the 64-KB program ROM 1 area allocated from address F0000h to FFFFFh. The special page vectors are allocated from FFE00h to FFFD7h. They are used for the JMPS and JSRS instructions. Refer to the M16C/60, M16C/20, M16C/Tiny Series Software Manual for details. The fixed vector table for interrupts is allocated from FFFDCh to FFFFFh. The 256 bytes beginning with the start address set in the INTB register compose the relocatable vector table for interrupts. Figure 3.2 shows the Memory Map.
00000h Internal RAM Size 12 KB 20 KB 31 KB 47 KB
Address XXXXXh
SFR Internal RAM Reserved area (1)
00400h XXXXXh
033FFh 053FFh 07FFFh 0BFFFh 0D000h 0D800h 0E000h 10000h 14000h 27000h 28000h
SFR External area Internal ROM (data flash) Internal ROM (program ROM 2) External area Reserved area (1)
Relocatable vector table
13000h 13FF0h 13FFFh
On-chip debugger monitor area User boot code area
External area Program ROM 1 Address YYYYYh Size E0000h 128 KB 256 KB 384 KB 512 KB 640 KB 768 KB C0000h A0000h 80000h 60000h 40000h FFFFFh YYYYYh Internal ROM (program ROM 1) 40000h Reserved area (1) FFE00h
256 bytes beginning with the start address set in the INTB register
FFFD8h FFFDCh
Special page vector table Reserved area (3) Fixed vector table
Address for ID code stored
FFFFFh
OFS1 address
Notes: 1. Do not access reserved areas. 2. The figure above applies under the following conditions: - Memory expansion mode - The PM10 bit in the PM1 register is 1 (addresses 0E000h to 0FFFFh are used as data flash) - The PRG2C0 bit in the PRG2C register is 0 (program ROM 2 enabled) - The PM13 bit in the PM1 register is 1 (all areas in internal RAM, and the program ROM 1 area from 80000h are usable) - The IRON bit in the PRG2C register is 1 (program ROM 1 in addresses 40000h to 7FFFFh enabled) 3. Do not change the data from FFh.
Figure 3.2
Memory Map
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M16C/65 Group
3. Address Space
3.3
Accessible Area in Each Mode
Areas that can be accessed vary depending on processor mode and the status of each control bit. Figure 3.3 shows the Accessible Area in Each Mode. In single-chip mode, the SFRs, internal RAM, and internal ROM can be accessed. In memory expansion mode, the SFRs, internal RAM, internal ROM, and external areas can be accessed. Address space is expandable to 4 MB with the memory area expansion function. In microprocessor mode, the SFRs, internal RAM, and external areas can be accessed. Address space is expandable to 4 MB with the memory area expansion function. Allocate ROM to the fixed vector table from FFFDCh to FFFFFh.
Single-Chip Mode 00000h 00400h Internal RAM 0D000h 0D800h 0E000h 10000h 14000h Reserved area SFR Reserved area Internal ROM (data flash) Internal ROM (program ROM 2) SFR
Memory Expansion Mode 00000h SFR 00400h Internal RAM 0D000h 0D800h 0E000h 10000h 14000h 27000h Reserved area 28000h Reserved area SFR External area Internal ROM (data flash) Internal ROM (program ROM 2) External area
Microprocessor Mode 00000h 00400h Internal RAM Reserved area 0D000h 0D800h SFR SFR
External area
27000h Reserved area 28000h External area
Reserved area 80000h
Reserved area
External area
Internal ROM (program ROM 1) FFFFFh FFFFFh
Internal ROM (program ROM 1) FFFFFh
Notes: 1. Do not access reserved areas. 2. The figure above applies under the following conditions: Single-chip mode and memory expansion mode - The PM10 bit in the PM1 register is 1 (addresses 0E000h to 0FFFFh are used as data flash) - The PRG2C0 bit in the PRG2C register is 0 (program ROM 2 enabled) - The PM13 bit in the PM1 register is 1 (all areas in internal RAM, and the program ROM 1 area from 80000h are usable) - The IRON bit in the PRG2C register is 1 (program ROM 1 in addresses 40000h to 7FFFFh enabled) Microprocessor mode - The PM10 bit is 0 (addresses 0E000h to 0FFFFh are used as the CS2 area) - The PRG2C0 bit is 1 (program ROM 2 disabled)
Figure 3.3
Accessible Area in Each Mode
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M16C/65 Group
4. Special Function Registers (SFRs)
4.
4.1
Special Function Registers (SFRs)
SFRs
An SFR is a control register for a peripheral function.
Table 4.1 Address 0000h 0001h 0002h 0003h 0004h 0005h 0006h 0007h 0008h 0009h 000Ah 000Bh 000Ch 000Dh 000Eh 000Fh 0010h 0011h 0012h 0013h 0014h 0015h 0016h 0017h 0018h 0019h 001Ah 001Bh 001Ch 001Dh 001Eh 001Fh Processor Mode Register 0 Processor Mode Register 1 System Clock Control Register 0 System Clock Control Register 1 Chip Select Control Register External Area Recovery Cycle Control Register Protect Register Data Bank Register Oscillation Stop Detection Register SFR Information (1) (1) Register Symbol Reset Value
PM0 PM1 CM0 CM1 CSR EWR PRCR DBR CM2
0000 0000b (CNVSS pin is low) 0000 0011b (CNVSS pin is high) (2) 0000 1000b 0100 1000b 0010 0000b 01h XXXX XX00b 00h 00h 0X00 0010b (3)
Program 2 Area Control Register External Area Wait Control Expansion Register Peripheral Clock Select Register
PRG2C EWC PCLKR
XXXX XX00b 00h 0000 0011b
Clock Prescaler Reset Flag
CPSRF
0XXX XXXXb
Reset Source Determine Register Voltage Detector 2 Flag Register Voltage Detector Operation Enable Register Chip Select Expansion Control Register PLL Control Register 0 Processor Mode Register 2
RSTFR VCR1 VCR2 CSE PLC0 PM2
XX00 001Xb (hardware reset) (4) 0000 1000b (5) 00h (5) 00h 0X01 X010b XX00 0X01b X: Undefined
Notes: 1. The blank areas are reserved. No access is allowed. 2. Software reset, watchdog timer reset, oscillator stop detect reset, voltage monitor 1 reset, and voltage monitor 2 reset do not affect the following bits: bits PM01 and PM00 in the PM0 register. 3. Oscillator stop detect reset does not affect bits CM20, CM21, and CM27. 4. The state of bits in the RSTFR register depends on the reset type. 5. This is the reset value after hardware reset. Refer to the explanation of each register for details.
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4. Special Function Registers (SFRs)
Table 4.2 Address 0020h 0021h 0022h 0023h 0024h 0025h 0026h 0027h 0028h 0029h 002Ah 002Bh 002Ch 002Dh 002Eh 002Fh 0030h 0031h 0032h 0033h 0034h 0035h 0036h 0037h 0038h 0039h 003Ah 003Bh 003Ch 003Dh 003Eh 003Fh
SFR Information (2) (1) Register Symbol Reset Value
40 MHz On-Chip Oscillator Control Register 0
FRA0
XXXX XX00b
Voltage Monitor Function Select Register Voltage Detector 1 Level Select Register Voltage Monitor 0 Control Register Voltage Monitor 1 Control Register Voltage Monitor 2 Control Register
VWCE VD1LS VW0C VW1C VW2C
00h 0000 1010b (2) 1000 XX10b (2) 1000 1010b (2) 1000 0X10b (2)
X: Undefined Notes: 1. The blank areas are reserved. No access is allowed. 2. This is the reset value after hardware reset. Refer to the explanation of each register for details.
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4. Special Function Registers (SFRs)
Table 4.3 Address 0040h 0041h 0042h 0043h 0044h 0045h 0046h 0047h 0048h 0049h 004Ah 004Bh 004Ch 004Dh 004Eh 004Fh 0050h 0051h 0052h 0053h 0054h 0055h 0056h 0057h 0058h 0059h 005Ah 005Bh 005Ch 005Dh 005Eh 005Fh Note: 1.
SFR Information (3) (1) Register Symbol Reset Value
INT7 Interrupt Control Register INT6 Interrupt Control Register INT3 Interrupt Control Register Timer B5 Interrupt Control Register Timer B4 Interrupt Control Register UART1 Bus Collision Detection Interrupt Control Register Timer B3 Interrupt Control Register UART0 Bus Collision Detection Interrupt Control Register SI/O4 Interrupt Control Register INT5 Interrupt Control Register SI/O3 Interrupt Control Register INT4 Interrupt Control Register UART2 Bus Collision Detection Interrupt Control Register DMA0 Interrupt Control Register DMA1 Interrupt Control Register Key Input Interrupt Control Register A/D Conversion Interrupt Control Register UART2 Transmit Interrupt Control Register UART2 Receive Interrupt Control Register UART0 Transmit Interrupt Control Register UART0 Receive Interrupt Control Register UART1 Transmit Interrupt Control Register UART1 Receive Interrupt Control Register Timer A0 Interrupt Control Register Timer A1 Interrupt Control Register Timer A2 Interrupt Control Register Timer A3 Interrupt Control Register Timer A4 Interrupt Control Register Timer B0 Interrupt Control Register Timer B1 Interrupt Control Register Timer B2 Interrupt Control Register INT0 Interrupt Control Register INT1 Interrupt Control Register INT2 Interrupt Control Register
INT7IC INT6IC INT3IC TB5IC TB4IC U1BCNIC TB3IC U0BCNIC S4IC INT5IC S3IC INT4IC BCNIC DM0IC DM1IC KUPIC ADIC S2TIC S2RIC S0TIC S0RIC S1TIC S1RIC TA0IC TA1IC TA2IC TA3IC TA4IC TB0IC TB1IC TB2IC INT0IC INT1IC INT2IC
XX00 X000b XX00 X000b XX00 X000b XXXX X000b XXXX X000b XXXX X000b XX00 X000b XX00 X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XX00 X000b XX00 X000b XX00 X000b X: Undefined
The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.4 Address 0060h 0061h 0062h 0063h 0064h 0065h 0066h 0067h 0068h 0069h 006Ah 006Bh 006Ch 006Dh 006Eh 006Fh 0070h 0071h 0072h 0073h 0074h 0075h 0076h 0077h 0078h 0079h 007Ah 007Bh 007Ch 007Dh 007Eh 007Fh 0080h to 017Fh
SFR Information (4) (1) Register Symbol Reset Value
DMA2 Interrupt Control Register DMA3 Interrupt Control Register UART5 Bus Collision Detection Interrupt Control Register CEC1 Interrupt Control Register UART5 Transmit Interrupt Control Register CEC2 Interrupt Control Register UART5 Receive Interrupt Control Register UART6 Bus Collision Detection Interrupt Control Register Real-Time Clock Periodic Interrupt Control Register UART6 Transmit Interrupt Control Register Real-Time Clock Compare Interrupt Control Register UART6 Receive Interrupt Control Register UART7 Bus Collision Detection Interrupt Control Register Remote Control Signal Receiver 0 Interrupt Control Register UART7 Transmit Interrupt Control Register Remote Control Signal Receiver 1 Interrupt Control Register UART7 Receive Interrupt Control Register
DM2IC DM3IC U5BCNIC CEC1IC S5TIC CEC2IC S5RIC U6BCNIC RTCTIC S6TIC RTCCIC S6RIC U7BCNIC PMC0IC S7TIC PMC1IC S7RIC
XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b XXXX X000b
I2C-bus Interface Interrupt Control Register SCL/SDA Interrupt Control Register
IICIC SCLDAIC
XXXX X000b XXXX X000b
X: Undefined Note: 1. The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.5 Address 0180h 0181h 0182h 0183h 0184h 0185h 0186h 0187h 0188h 0189h 018Ah 018Bh 018Ch 018Dh 018Eh 018Fh 0190h 0191h 0192h 0193h 0194h 0195h 0196h 0197h 0198h 0199h 019Ah 019Bh 019Ch 019Dh 019Eh 019Fh 01A0h 01A1h 01A2h 01A3h 01A4h 01A5h 01A6h 01A7h 01A8h 01A9h 01AAh 01ABh 01ACh 01ADh 01AEh 01AFh Note: 1.
SFR Information (5) (1) Register DMA0 Source Pointer Symbol SAR0 Reset Value XXh XXh 0Xh XXh XXh 0Xh XXh XXh
DMA0 Destination Pointer
DAR0
DMA0 Transfer Counter
TCR0
DMA0 Control Register
DM0CON
0000 0X00b
DMA1 Source Pointer
SAR1
XXh XXh 0Xh XXh XXh 0Xh XXh XXh
DMA1 Destination Pointer
DAR1
DMA1 Transfer Counter
TCR1
DMA1 Control Register
DM1CON
0000 0X00b
DMA2 Source Pointer
SAR2
XXh XXh 0Xh XXh XXh 0Xh XXh XXh
DMA2 Destination Pointer
DAR2
DMA2 Transfer Counter
TCR2
DMA2 Control Register
DM2CON
0000 0X00b
X: Undefined The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.6 Address 01B0h 01B1h 01B2h 01B3h 01B4h 01B5h 01B6h 01B7h 01B8h 01B9h 01BAh 01BBh 01BCh 01BDh 01BEh 01BFh 01C0h 01C1h 01C2h 01C3h 01C4h 01C5h 01C6h 01C7h 01C8h 01C9h 01CAh 01CBh 01CCh 01CDh 01CEh 01CFh 01D0h 01D1h 01D2h 01D3h 01D4h 01D5h 01D6h 01D7h 01D8h 01D9h 01DAh 01DBh 01DCh 01DDh 01DEh 01DFh Note: 1.
SFR Information (6) (1) Register DMA3 Source Pointer Symbol SAR3 Reset Value XXh XXh 0Xh XXh XXh 0Xh XXh XXh
DMA3 Destination Pointer
DAR3
DMA3 Transfer Counter
TCR3
DMA3 Control Register
DM3CON
0000 0X00b
Timer B0-1 Register Timer B1-1 Register Timer B2-1 Register Pulse Period/Pulse Width Measurement Mode Function Select Register 1 Timer B Count Source Select Register 0 Timer B Count Source Select Register 1 Timer AB Division Control Register 0
TB01 TB11 TB21 PPWFS1 TBCS0 TBCS1 TCKDIVC0
XXh XXh XXh XXh XXh XXh XXXX X000b 00h X0h 0000 X000b
Timer A Count Source Select Register 0 Timer A Count Source Select Register 1 Timer A Count Source Select Register 2 16-bit Pulse Width Modulation Mode Function Select Register Timer A Waveform Output Function Select Register
TACS0 TACS1 TACS2 PWMFS TAPOFS
00h 00h X0h 0XX0 X00Xb XXX0 0000b
Timer A Output Waveform Change Enable Register Three-Phase Protect Control Register
TAOW TPRC
XXX0 X00Xb 00h
X: Undefined The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.7
Address
SFR Information (7) (1)
Register Symbol
01E0h 01E1h 01E2h 01E3h 01E4h 01E5h 01E6h 01E7h 01E8h 01E9h 01EAh 01EBh 01ECh 01EDh 01EEh 01EFh 01F0h 01F1h 01F2h 01F3h 01F4h 01F5h 01F6h 01F7h 01F8h 01F9h 01FAh 01FBh 01FCh 01FDh 01FEh 01FFh 0200h 0201h 0202h 0203h 0204h 0205h 0206h 0207h 0208h 0209h 020Ah 020Bh 020Ch 020Dh 020Eh 020Fh Note: 1.
Timer B3-1 Register Timer B4-1 Register Timer B5-1 Register Pulse Period/Pulse Width Measurement Mode Function Select Register 2 Timer B Count Source Select Register 2 Timer B Count Source Select Register 3
TB31 TB41 TB51 PPWFS2 TBCS2 TBCS3
Reset Value XXh XXh XXh XXh XXh XXh XXXX X000b 00h X0h
PMC0 Function Select Register 0 PMC0 Function Select Register 1 PMC0 Function Select Register 2 PMC0 Function Select Register 3 PMC0 Status Register PMC0 Interrupt Source Select Register PMC0 Compare Control Register PMC0 Compare Data Register PMC1 Function Select Register 0 PMC1 Function Select Register 1 PMC1 Function Select Register 2 PMC1 Function Select Register 3 PMC1 Status Register PMC1 Interrupt Source Select Register
PMC0CON0 PMC0CON1 PMC0CON2 PMC0CON3 PMC0STS PMC0INT PMC0CPC PMC0CPD PMC1CON0 PMC1CON1 PMC1CON2 PMC1CON3 PMC1STS PMC1INT
00h 00XX 0000b 0000 00X0b 00h 00h 00h XXX0 X000b 00h XXX0 X000b XXXX 0X00b 0000 00X0b 00h X000 X00Xb X000 X00Xb
Interrupt Source Select Register 3 Interrupt Source Select Register 2 Interrupt Source Select Register
IFSR3A IFSR2A IFSR
00h 00h 00h
Address Match Interrupt Enable Register Address Match Interrupt Enable Register 2
AIER AIER2
XXXX XX00b XXXX XX00b X: Undefined
The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.8
Address
SFR Information (8) (1)
Register Symbol
0210h 0211h 0212h 0213h 0214h 0215h 0216h 0217h 0218h 0219h 021Ah 021Bh 021Ch 021Dh 021Eh 021Fh 0220h 0221h 0222h 0223h 0224h 0225h 0226h 0227h 0228h 0229h 022Ah 022Bh 022Ch 022Dh 022Eh 022Fh 0230h 0231h 0232h 0233h 0234h 0235h 0236h 0237h 0238h 0239h 023Ah 023Bh 023Ch 023Dh 023Eh 023Fh Note: 1.
Address Match Interrupt Register 0
RMAD0
Reset Value 00h 00h X0h 00h 00h X0h 00h 00h X0h 00h 00h X0h 0000 0001b (Other than user boot mode) 0010 0001b (User boot mode) 00X0 XX0Xb XXXX 0000b
Address Match Interrupt Register 1
RMAD1
Address Match Interrupt Register 2
RMAD2
Address Match Interrupt Register 3
RMAD3
Flash Memory Control Register 0 Flash Memory Control Register 1 Flash Memory Control Register 2
FMR0 FMR1 FMR2
Flash Memory Control Register 6
FMR6
XX0X XX00b
X: Undefined The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.9
Address
SFR Information (9) (1)
Register Symbol
Reset Value
0240h 0241h 0242h 0243h 0244h 0245h 0246h 0247h 0248h 0249h 024Ah 024Bh 024Ch 024Dh 024Eh 024Fh 0250h 0251h 0252h 0253h 0254h 0255h 0256h 0257h 0258h 0259h 025Ah 025Bh 025Ch 025Dh 025Eh 025Fh 0260h 0261h 0262h 0263h 0264h 0265h 0266h 0267h 0268h 0269h 026Ah 026Bh 026Ch 026Dh 026Eh 026Fh
Note:
UART0 Special Mode Register 4 UART0 Special Mode Register 3 UART0 Special Mode Register 2 UART0 Special Mode Register UART0 Transmit/Receive Mode Register UART0 Bit Rate Register UART0 Transmit Buffer Register UART0 Transmit/Receive Control Register 0 UART0 Transmit/Receive Control Register 1 UART0 Receive Buffer Register UART Transmit/Receive Control Register 2 UART Clock Select Register UART1 Special Mode Register 4 UART1 Special Mode Register 3 UART1 Special Mode Register 2 UART1 Special Mode Register UART1 Transmit/Receive Mode Register UART1 Bit Rate Register UART1 Transmit Buffer Register UART1 Transmit/Receive Control Register 0 UART1 Transmit/Receive Control Register 1 UART1 Receive Buffer Register
U0SMR4 U0SMR3 U0SMR2 U0SMR U0MR U0BRG U0TB U0C0 U0C1 U0RB UCON UCLKSEL0 U1SMR4 U1SMR3 U1SMR2 U1SMR U1MR U1BRG U1TB U1C0 U1C1 U1RB
00h 000X 0X0Xb X000 0000b X000 0000b 00h XXh XXh XXh 0000 1000b 00XX 0010b XXh XXh X000 0000b X0h 00h 000X 0X0Xb X000 0000b X000 0000b 00h XXh XXh XXh 0000 1000b 00XX 0010b XXh XXh
UART2 Special Mode Register 4 UART2 Special Mode Register 3 UART2 Special Mode Register 2 UART2 Special Mode Register UART2 Transmit/Receive Mode Register UART2 Bit Rate Register UART2 Transmit Buffer Register UART2 Transmit/Receive Control Register 0 UART2 Transmit/Receive Control Register 1 UART2 Receive Buffer Register
U2SMR4 U2SMR3 U2SMR2 U2SMR U2MR U2BRG U2TB U2C0 U2C1 U2RB
00h 000X 0X0Xb X000 0000b X000 0000b 00h XXh XXh XXh 0000 1000b 0000 0010b XXh XXh X: Undefined
1.
The blank areas are reserved. No access is allowed.
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M16C/65 Group
4. Special Function Registers (SFRs)
Table 4.10
Address
SFR Information (10) (1)
Register Symbol
0270h 0271h 0272h 0273h 0274h 0275h 0276h 0277h 0278h 0279h 027Ah 027Bh 027Ch 027Dh 027Eh 027Fh 0280h 0281h 0282h 0283h 0284h 0285h 0286h 0287h 0288h 0289h 028Ah 028Bh 028Ch 028Dh 028Eh 028Fh 0290h 0291h 0292h 0293h 0294h 0295h 0296h 0297h 0298h 0299h 029Ah 029Bh 029Ch 029Dh 029Eh 029Fh Note: 1.
SI/O3 Transmit/Receive Register SI/O3 Control Register SI/O3 Bit Rate Register SI/O4 Transmit/Receive Register SI/O4 Control Register SI/O4 Bit Rate Register SI/O3, 4 Control Register 2
S3TRR S3C S3BRG S4TRR S4C S4BRG S34C2
Reset Value XXh 0100 0000b XXh XXh 0100 0000b XXh 00XX X0X0b
UART5 Special Mode Register 4 UART5 Special Mode Register 3 UART5 Special Mode Register 2 UART5 Special Mode Register UART5 Transmit/Receive Mode Register UART5 Bit Rate Register UART5 Transmit Buffer Register UART5 Transmit/Receive Control Register 0 UART5 Transmit/Receive Control Register 1 UART5 Receive Buffer Register
U5SMR4 U5SMR3 U5SMR2 U5SMR U5MR U5BRG U5TB U5C0 U5C1 U5RB
00h 000X 0X0Xb X000 0000b X000 0000b 00h XXh XXh XXh 0000 1000b 0000 0010b XXh XXh
UART6 Special Mode Register 4 UART6 Special Mode Register 3 UART6 Special Mode Register 2 UART6 Special Mode Register UART6 Transmit/Receive Mode Register UART6 Bit Rate Register UART6 Transmit Buffer Register UART6 Transmit/Receive Control Register 0 UART6 Transmit/Receive Control Register 1 UART6 Receive Buffer Register
U6SMR4 U6SMR3 U6SMR2 U6SMR U6MR U6BRG U6TB U6C0 U6C1 U6RB
00h 000X 0X0Xb X000 0000b X000 0000b 00h XXh XXh XXh 0000 1000b 0000 0010b XXh XXh X: Undefined
The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.11
Address
SFR Information (11) (1)
Register Symbol
Reset Value
02A0h 02A1h 02A2h 02A3h 02A4h 02A5h 02A6h 02A7h 02A8h 02A9h 02AAh 02ABh 02ACh 02ADh 02AEh 02AFh 02B0h 02B1h 02B2h 02B3h 02B4h 02B5h 02B6h 02B7h 02B8h 02B9h 02BAh 02BBh 02BCh 02BDh 02BEh 02BFh 02C0h to 02FFh Note: 1.
UART7 Special Mode Register 4 UART7 Special Mode Register 3 UART7 Special Mode Register 2 UART7 Special Mode Register UART7 Transmit/Receive Mode Register UART7 Bit Rate Register UART7 Transmit Buffer Register UART7 Transmit/Receive Control Register 0 UART7 Transmit/Receive Control Register 1 UART7 Receive Buffer Register I2C0 Data Shift Register I2C0 Address Register 0 I2C0 Control Register 0 I2C0 Clock Control Register I2C0 Start/Stop Condition Control Register I2C0 Control Register 1 I2C0 Control Register 2 I2C0 Status Register 0 I2C0 Status Register 1 I2C0 Address Register 1 I2C0 Address Register 2
U7SMR4 U7SMR3 U7SMR2 U7SMR U7MR U7BRG U7TB U7C0 U7C1 U7RB S00 S0D0 S1D0 S20 S2D0 S3D0 S4D0 S10 S11 S0D1 S0D2
00h 000X 0X0Xb X000 0000b X000 0000b 00h XXh XXh XXh 0000 1000b 0000 0010b XXh XXh XXh 0000 000Xb 00h 00h 0001 1010b 0011 0000b 00h 0001 000Xb XXXX X000b 0000 000Xb 0000 000Xb
X: Undefined The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.12 Address 0300h 0301h 0302h 0303h 0304h 0305h 0306h 0307h 0308h 0309h 030Ah 030Bh 030Ch 030Dh 030Eh 030Fh 0310h 0311h 0312h 0313h 0314h 0315h 0316h 0317h 0318h 0319h 031Ah 031Bh 031Ch 031Dh 031Eh 031Fh 0320h 0321h 0322h 0323h 0324h 0325h 0326h 0327h 0328h 0329h 032Ah 032Bh 032Ch 032Dh 032Eh 032Fh Note: 1.
SFR Information (12) (1) Register Timer B3/B4/B5 Count Start Flag Timer A1-1 Register Timer A2-1 Register Timer A4-1 Register Three-Phase PWM Control Register 0 Three-Phase PWM Control Register 1 Three-Phase Output Buffer Register 0 Three-Phase Output Buffer Register 1 Dead Time Timer Timer B2 Interrupt Generation Frequency Set Counter Position-Data-Retain Function Control Register Timer B3 Register Timer B4 Register Timer B5 Register Symbol TBSR TA11 TA21 TA41 INVC0 INVC1 IDB0 IDB1 DTT ICTB2 PDRF TB3 TB4 TB5 Reset Value 000X XXXXb XXh XXh XXh XXh XXh XXh 00h 00h XX11 1111b XX11 1111b XXh XXh XXXX 0000b XXh XXh XXh XXh XXh XXh
Port Function Control Register
PFCR
0011 1111b
Timer B3 Mode Register Timer B4 Mode Register Timer B5 Mode Register
TB3MR TB4MR TB5MR
00XX 0000b 00XX 0000b 00XX 0000b
Count Start Flag One-Shot Start Flag Trigger Select Register Increment/Decrement Flag Timer A0 Register Timer A1 Register Timer A2 Register Timer A3 Register Timer A4 Register
TABSR ONSF TRGSR UDF TA0 TA1 TA2 TA3 TA4
00h 00h 00h 00h XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh X: Undefined
The blank areas are reserved. No access is allowed.
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M16C/65 Group
4. Special Function Registers (SFRs)
Table 4.13
Address
SFR Information (13) (1)
Register Symbol
0330h 0331h 0332h 0333h 0334h 0335h 0336h 0337h 0338h 0339h 033Ah 033Bh 033Ch 033Dh 033Eh 033Fh 0340h 0341h 0342h 0343h 0344h 0345h 0346h 0347h 0348h 0349h 034Ah 034Bh 034Ch 034Dh 034Eh 034Fh 0350h 0351h 0352h 0353h 0354h 0355h 0356h 0357h 0358h 0359h 035Ah 035Bh 035Ch 035Dh 035Eh 035Fh Note: 1.
Timer B0 Register Timer B1 Register Timer B2 Register Timer A0 Mode Register Timer A1 Mode Register Timer A2 Mode Register Timer A3 Mode Register Timer A4 Mode Register Timer B0 Mode Register Timer B1 Mode Register Timer B2 Mode Register Timer B2 Special Mode Register Real-Time Clock Second Data Register Real-Time Clock Minute Data Register Real-Time Clock Hour Data Register Real-Time Clock Day Data Register Real-Time Clock Control Register 1 Real-Time Clock Control Register 2 Real-Time Clock Count Source Select Register Real-Time Clock Second Compare Data Register Real-Time Clock Minute Compare Data Register Real-Time Clock Hour Compare Data Register
TB0 TB1 TB2 TA0MR TA1MR TA2MR TA3MR TA4MR TB0MR TB1MR TB2MR TB2SC RTCSEC RTCMIN RTCHR RTCWK RTCCR1 RTCCR2 RTCCSR RTCCSEC RTCCMIN RTCCHR
Reset Value XXh XXh XXh XXh XXh XXh 00h 00h 00h 00h 00h 00XX 0000b 00XX 0000b 00XX 0000b X000 0000b 00h X000 0000b XX00 0000b XXXX X000b 0000 X00Xb X000 0000b XXX0 0000b X000 0000b X000 0000b X000 0000b
CEC Function Control Register 1 CEC Function Control Register 2 CEC Function Control Register 3 CEC Function Control Register 4 CEC Flag Register CEC Interrupt Source Select Register CEC Transmit Buffer Register 1 CEC Transmit Buffer Register 2 CEC Receive Buffer Register 1 CEC Receive Buffer Register 2 CEC Receive Follower Address Set Register 1 CEC Receive Follower Address Set Register 2
CECC1 CECC2 CECC3 CECC4 CECFLG CISEL CCTB1 CCTB2 CCRB1 CCRB2 CRADRI1 CRADRI2
XXXX X000b 00h XXXX 0000b 00h 00h 00h 00h XXXX XX00b 00h XXXX X000b 00h 00h
X: Undefined The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.14 Address 0360h 0361h 0362h 0363h 0364h 0365h 0366h 0367h 0368h 0369h 036Ah 036Bh 036Ch 036Dh 036Eh 036Fh 0370h 0371h 0372h 0373h 0374h 0375h 0376h 0377h 0378h 0379h 037Ah 037Bh 037Ch 037Dh 037Eh 037Fh 0380h to 038Fh
SFR Information (14) (1) Register Pull-Up Control Register 0 Pull-Up Control Register 1 Pull-Up Control Register 2 Pull-Up Control Register 3 Symbol PUR0 PUR1 PUR2 PUR3 Reset Value 00h 0000 0000b (2) 0000 0010b 00h 00h
Port Control Register
PCR
0000 0XX0b
NMI/SD Digital Filter Register
NMIDF
XXXX X000b
PWM Control Register 0 PWM0 Prescaler PWM0 Register PWM1 Prescaler PWM1 Register PWM Control Register 1
PWMCON0 PWMPRE0 PWMREG0 PWMPRE1 PWMREG1 PWMCON1
00h 00h 00h 00h 00h 00h
Count Source Protection Mode Register Watchdog Timer Refresh Register Watchdog Timer Start Register Watchdog Timer Control Register
CSPR WDTR WDTS WDC
00h (3) XXh XXh 00XX XXXXb
X: Undefined Notes: 1. The blank areas are reserved. No access is allowed. 2. Values after hardware reset, power-on reset, or voltage monitor 0 reset are as follows: - 00000000b when a low-level signal is input to the CNVSS pin - 00000010b when a high-level signal is input to the CNVSS pin Values after voltage monitor 1 reset, voltage monitor 2 reset, software reset, watchdog timer reset, or oscillation stop detect reset are as follows: - 00000000b when bits PM01 and PM00 in the PM0 register are 00b (single-chip mode). - 00000010b when bits PM01 and PM00 in the PM0 register are 01b (memory expansion mode) or 11b (microprocessor mode). 3. When the CSPROINI bit in the OFS1 address is 0, the reset value is 10000000b.
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M16C/65 Group
4. Special Function Registers (SFRs)
Table 4.15 Address 0390h 0391h 0392h 0393h 0394h 0395h 0396h 0397h 0398h 0399h 039Ah 039Bh 039Ch 039Dh 039Eh 039Fh 03A0h 03A1h 03A2h 03A3h 03A4h 03A5h 03A6h 03A7h 03A8h 03A9h 03AAh 03ABh 03ACh 03ADh 03AEh 03AFh 03B0h 03B1h 03B2h 03B3h 03B4h 03B5h 03B6h 03B7h 03B8h 03B9h 03BAh 03BBh 03BCh 03BDh 03BEh 03BFh Note: 1.
SFR Information (15) (1) Register DMA2 Source Select Register DMA3 Source Select Register Symbol DM2SL DM3SL Reset Value 00h 00h
DMA0 Source Select Register DMA1 Source Select Register
DM0SL DM1SL
00h 00h
Open-Circuit Detection Assist Function Register
AINRST
XX00 XXXXb
SFR Snoop Address Register CRC Mode Register
CRCSAR CRCMR
XXXX XXXXb 00XX XXXXb 0XXX XXX0b
CRC Data Register CRC Input Register
CRCD CRCIN
XXh XXh XXh X: Undefined
The blank areas are reserved. No access is allowed.
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4. Special Function Registers (SFRs)
Table 4.16 Address 03C0h 03C1h 03C2h 03C3h 03C4h 03C5h 03C6h 03C7h 03C8h 03C9h 03CAh 03CBh 03CCh 03CDh 03CEh 03CFh 03D0h 03D1h 03D2h 03D3h 03D4h 03D5h 03D6h 03D7h 03D8h 03D9h 03DAh 03DBh 03DCh 03DDh 03DEh 03DFh 03E0h 03E1h 03E2h 03E3h 03E4h 03E5h 03E6h 03E7h 03E8h 03E9h 03EAh 03EBh 03ECh 03EDh 03EEh 03EFh Note: 1.
SFR Information (16) (1) Register A/D Register 0 A/D Register 1 A/D Register 2 A/D Register 3 A/D Register 4 A/D Register 5 A/D Register 6 A/D Register 7 Symbol AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 Reset Value XXXX XXXXb 0000 00XXb XXXX XXXXb 0000 00XXb XXXX XXXXb 0000 00XXb XXXX XXXXb 0000 00XXb XXXX XXXXb 0000 00XXb XXXX XXXXb 0000 00XXb XXXX XXXXb 0000 00XXb XXXX XXXXb 0000 00XXb
A/D Control Register 2 A/D Control Register 0 A/D Control Register 1 D/A0 Register D/A1 Register D/A Control Register
ADCON2 ADCON0 ADCON1 DA0 DA1 DACON
0000 X00Xb 0000 0XXXb 0000 X000b 00h 00h 00h
Port P0 Register Port P1 Register Port P0 Direction Register Port P1 Direction Register Port P2 Register Port P3 Register Port P2 Direction Register Port P3 Direction Register Port P4 Register Port P5 Register Port P4 Direction Register Port P5 Direction Register Port P6 Register Port P7 Register Port P6 Direction Register Port P7 Direction Register
P0 P1 PD0 PD1 P2 P3 PD2 PD3 P4 P5 PD4 PD5 P6 P7 PD6 PD7
XXh XXh 00h 00h XXh XXh 00h 00h XXh XXh 00h 00h XXh XXh 00h 00h X: Undefined
The blank areas are reserved. No access is allowed.
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M16C/65 Group
4. Special Function Registers (SFRs)
Table 4.17 Address 03F0h 03F1h 03F2h 03F3h 03F4h 03F5h 03F6h 03F7h 03F8h 03F9h 03FAh 03FBh 03FCh 03FDh 03FEh 03FFh Note: 1.
SFR Information (17) (1) Register Port P8 Register Port P9 Register Port P8 Direction Register Port P9 Direction Register Port P10 Register Port P11 Register Port P10 Direction Register Port P11 Direction Register Port P12 Register Port P13 Register Port P12 Direction Register Port P13 Direction Register Port P14 Register Port P14 Direction Register Symbol P8 P9 PD8 PD9 P10 P11 PD10 PD11 P12 P13 PD12 PD13 P14 PD14 Reset Value XXh XXh 00h 00h XXh XXh 00h 00h XXh XXh 00h 00h XXh XXXX XX00b X: Undefined
The blank areas are reserved. No access is allowed.
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M16C/65 Group
4. Special Function Registers (SFRs)
Table 4.18
Address
SFR Information (18) (1)
Register Symbol
D080h D081h D082h D083h D084h D085h D086h D087h D088h D089h D08Ah D08Bh D08Ch D08Dh D08Eh D08Fh D090h D091h D092h D093h D094h D095h D096h D097h D098h D099h D09Ah D09Bh D09Ch D09Dh D09Eh D09Fh Note: 1.
PMC0 Header Pattern Set Register (Min) PMC0 Header Pattern Set Register (Max) PMC0 Data 0 Pattern Set Register (Min) PMC0 Data 0 Pattern Set Register (Max) PMC0 Data 1 Pattern Set Register (Min) PMC0 Data 1 Pattern Set Register (Max) PMC0 Measurements Register
PMC0HDPMIN PMC0HDPMAX PMC0D0PMIN PMC0D0PMAX PMC0D1PMIN PMC0D1PMAX PMC0TIM
Reset Value 0000 0000b XXXX X000b 0000 0000b XXXX X000b 00h 00h 00h 00h 00h 00h
PMC0 Receive Data Store Register 0 PMC0 Receive Data Store Register 1 PMC0 Receive Data Store Register 2 PMC0 Receive Data Store Register 3 PMC0 Receive Data Store Register 4 PMC0 Receive Data Store Register 5 PMC0 Receive Bit Count Register PMC1 Header Pattern Set Register (Min) PMC1 Header Pattern Set Register (Max) PMC1 Data 0 Pattern Set Register (Min) PMC1 Data 0 Pattern Set Register (Max) PMC1 Data 1 Pattern Set Register (Min) PMC1 Data 1 Pattern Set Register (Max) PMC1 Measurements Register
PMC0DAT0 PMC0DAT1 PMC0DAT2 PMC0DAT3 PMC0DAT4 PMC0DAT5 PMC0RBIT PMC1HDPMIN PMC1HDPMAX PMC1D0PMIN PMC1D0PMAX PMC1D1PMIN PMC1D1PMAX PMC1TIM
00h 00h 00h 00h 00h 00h XX00 0000b 0000 0000b XXXX X000b 0000 0000b XXXX X000b 00h 00h 00h 00h 00h 00h
X: Undefined The blank areas are reserved. No access is allowed.
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M16C/65 Group
4. Special Function Registers (SFRs)
4.2 4.2.1
Notes on SFRs Register Settings
Table 4.19 lists Registers with Write-Only Bits and registers whose function differs between reading and writing. Set these registers with immediate values. Do not use read-modify-write instructions. When establishing the next value by altering the existing value, write the existing value to the RAM as well as to the register. Transfer the next value to the register after making changes in the RAM. Read-modify-write instructions can be used when writing to the no register bits.
Table 4.19 Registers with Write-Only Bits
Address 0249h 024Bh to 024Ah 0259h 025Bh to 025Ah 0269h 026Bh to 026Ah 0273h 0277h 0289h 028Bh to 028Ah 0299h 029Bh to 029Ah 02A9h 02ABh to 02AAh 02B6h 02B8h 0303h to 0302h 0305h to 0304h 0307h to 0306h 030Ah 030Bh 030Ch 030Dh 0327h to 0326h 0329h to 0328h 032Bh to 032Ah 032Dh to 032Ch 032Fh to 032Eh 037Dh 037Eh UART0 Bit Rate Register
Register UART0 Transmit Buffer Register UART1 Bit Rate Register UART1 Transmit Buffer Register UART2 Bit Rate Register UART2 Transmit Buffer Register SI/O3 Bit Rate Register SI/O4 Bit Rate Register UART5 Bit Rate Register UART5 Transmit Buffer Register UART6 Bit Rate Register UART6 Transmit Buffer Register UART7 Bit Rate Register UART7 Transmit Buffer Register I2C0 Control Register 1 I2C0 Status Register 0 Timer A1-1 Register Timer A2-1 Register Timer A4-1 Register Three-Phase Output Buffer Register 0 Three-Phase Output Buffer Register 1 Dead Time Timer Timer B2 Interrupt Generation Frequency Set Counter Timer A0 Register Timer A1 Register Timer A2 Register Timer A3 Register Timer A4 Register Watchdog Timer Refresh Register Watchdog Timer Start Register
Symbol U0BRG U0TB U1BRG U1TB U2BRG U2TB S3BRG S4BRG U5BRG U5TB U6BRG U6TB U7BRG U7TB S3D0 S10 TA11 TA21 TA41 IDB0 IDB1 DTT ICTB2 TA0 TA1 TA2 TA3 TA4 WDTR WDTS
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M16C/65 Group
4. Special Function Registers (SFRs)
Table 4.20
Read-Modify-Write Instructions
Function Transfer Bit processing Shifting Arithmetic operation Decimal operation Logical operation Jump
Mnemonic MOVDir BCLR, BMCnd, BNOT, BSET, BTSTC, and BTSTS ROLC, RORC, ROT, SHA, and SHL ABS, ADC, ADCF, ADD, DEC, DIV, DIVU, DIVX, EXTS, INC, MUL, MULU, NEG, SBB, and SUB DADC, DADD, DSBB, and DSUB AND, NOT, OR, and XOR ADJNZ, SBJNZ
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M16C/65 Group
5. Electrical Characteristics
5.
5.1
Electrical Characteristics
Electrical Characteristics (Common to 3 V and 5 V) Absolute Maximum Rating
Absolute Maximum Ratings
Parameter Supply voltage Supply voltage Analog supply voltage Analog reference voltage Input voltage
RESET, CNVSS, BYTE, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 XIN
5.1.1
Table 5.1
Symbol VCC1 VCC2 AVCC VREF VI
Condition VCC1 = AVCC VCC1 = AVCC VCC1 = AVCC VCC1 = AVCC
Rated Value
-0.3 to 6.5 -0.3 to VCC1 + 0.1 (1) -0.3 to 6.5 -0.3 to VCC1 + 0.1 (1) -0.3 to VCC1 + 0.3 (1)
Unit V V V V V
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 P7_0, P7_1, P8_5 VO
Output voltage P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 XOUT
-0.3 to VCC2 + 0.3 (1)
V
-0.3 to 6.5 -0.3 to VCC1 + 0.3
(1)
V V
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 P7_0, P7_1, P8_5 Pd Topr Power consumption Operating temperature When the MCU is operating Flash program erase Program area Data area Tstg Storage temperature
-40C < Topr 85C
-0.3 to VCC2 + 0.3 (1)
V
-0.3 to 6.5
V mW
C
300
-20 to 85/-40 to 85
0 to 60
-20 to 85/-40 to 85 -65 to 150 C
Note: 1. Maximum value is 6.5 V.
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5. Electrical Characteristics
5.1.2
Table 5.2
Recommended Operating Conditions
Recommended Operating Conditions (1/3)
Standard Typ. 5.0 VCC1 0 0 0.8VCC2 0.8VCC2 0.5VCC2 VCC2 VCC2 VCC2
VCC1 = VCC2 = 2.7 to 5.5 V at Topr = -20C to 85C/-40C to 85C unless otherwise specified. Symbol VCC1, VCC2 AVCC VSS AVSS VIH Supply voltage (VCC1 VCC2) Analog supply voltage Supply voltage Analog supply voltage High input P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, voltage P12_0 to P12_7, P13_0 to P13_7 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (in single-chip mode) P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (data input in memory expansion and microprocessor modes) P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 XIN, RESET, CNVSS, BYTE P7_0, P7_1, P8_5 CEC VIL Low input voltage P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (in single-chip mode) P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (data input in memory expansion and microprocessor mode) P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7,P11_0 to P11_7, P14_0, P14_1 XIN, RESET, CNVSS, BYTE CEC Parameter
CEC function is not used CEC function is used
Min. 2.7 2.7
Max. 5.5 3.63
Unit V V V V V V V V
0.8VCC1
VCC1
V
0.8VCC1 0.7VCC1 0 0 0 0
6.5 0.2VCC2 0.2VCC2
0.16VCC2
V V V V V V
0.2VCC1
0.26VCC1 -40.0 -40.0 -40.0 -40.0
-10.0
V mA mA mA mA mA
IOH(sum) High peak Sum of IOH(peak) at P0_0 to P0_7, P1_0 to P1_7, output P2_0 to P2_7 current Sum of IOH(peak) at P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, and P13_0 to P13_7 Sum of IOH(peak) at P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4 Sum of IOH(peak) at P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0 to P14_1 IOH(peak) High peak P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, output P4_0 to P4_7, P5_0 to P5_7, current P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 IOH(avg) High P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, average P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, output P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, current (1) P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 Note: 1. The average output current is the mean value within 100 ms.
-5.0
mA
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Table 5.3
Recommended Operating Conditions (2/3)
Standard Min. Typ. Max. 80.0
VCC1 = VCC2 = 2.7 to 5.5 V at Topr = -20C to 85C/-40C to 85C unless otherwise specified. Symbol IOL(sum) Parameter Low peak Sum of IOL(peak) at P0_0 to P0_7, P1_0 to P1_7, output P2_0 to P2_7, P8_6, P8_7, P9_0 to P9_7, current P10_0 to P10_7, P11_0 to P11_7, P14_0 to P14_1 Sum of IOL(peak) at P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_5, P12_0 to P12_7, P13_0 to P13_7 IOL(peak) Low peak P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, output P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, current P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 IOL(avg) Low average output current (1) P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 VCC1 = 2.7 V to 5.5 V 2 32.768 10 2 VCC1 = 5.0 V VCC1 = 3.0 V Unit mA
80.0
mA
10.0
mA
5.0
mA
f(XIN) f(XCIN) f(PLL) f(BCLK) tSU(PLL)
Main clock input oscillation frequency PLL clock oscillation frequency CPU operation clock PLL frequency synthesizer stabilization wait time
20 50 32 32 2 3
MHz kHz MHz MHz ms ms
Sub clock oscillation frequency VCC1 = 2.7 V to 5.5 V
Note: 1. The average output current is the mean value within 100 ms.
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5. Electrical Characteristics
Table 5.4
Recommended Operating Conditions (3/3) (1)
VCC1 = 2.7 to 5.5 V, VSS = 0 V, and Topr = -20C to 85C/-40C to 85C unless otherwise specified. The ripple voltage must not exceed Vr(VCC1) and/or dVr(VCC1)/dt. Symbol Vr(VCC1) Allowable ripple voltage Parameter VCC1 = 5.0 V VCC1 = 3.0 V dVr(VCC1)/dt Ripple voltage falling gradient VCC1 = 5.0 V VCC1 = 3.0 V Note: 1. The device is operationally guaranteed under these operating conditions. Standard Min. Typ. Max. 0.5 0.3 0.3 0.3 Unit Vp-p Vp-p V/ms V/ms
VCC1
Vr( VCC1)
Figure 5.1
Ripple Waveform
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5.1.3
Table 5.5
A/D Conversion Characteristics
A/D Conversion Characteristics (1/2) (1)
VCC1 = AVCC = 3.0 to 5.5 V VCC2 VREF, VSS = AVSS = 0 V at Topr = -20C to 85C/-40C to 85C unless otherwise specified. Symbol INL Resolution Integral non-linearity error 10bit Parameter Measuring Condition AVCC = VCC1 VCC2 VREF VCC1 = AN0 to AN7 input, AN0_0 to AN0_7 input, 5.0 V AN2_0 to AN2_7 input, ANEX0, ANEX1 input (Note 2) VCC1 = AN0 to AN7 input, AN0_0 to AN0_7 input, 3.3 V AN2_0 to AN2_7 input, ANEX0, ANEX1 input (Note 2) VCC1 = AN0 to AN7 input, AN0_0 to AN0_7 input, 3.0 V AN2_0 to AN2_7 input, ANEX0, ANEX1 input (Note 2) VCC1 = AN0 to AN7 input, AN0_0 to AN0_7 input, 5.0 V AN2_0 to AN2_7 input, ANEX0, ANEX1 input (Note 2) VCC1 = AN0 to AN7 input, AN0_0 to AN0_7 input, 3.3 V AN2_0 to AN2_7 input, ANEX0, ANEX1 input (Note 2) VCC1 = AN0 to AN7 input, AN0_0 to AN0_7 input, 3.0 V AN2_0 to AN2_7 input, ANEX0, ANEX1 input (Note 2) Min. Standard Typ. Max. 10 3 Unit Bits LSB
3
LSB
3
LSB
-
Absolute accuracy
10bit
3
LSB
3
LSB
3
LSB
Notes: 1. Use when AVCC = VCC1. 2. Flash memory rewrite disabled. Except for the analog input pin, set the pins to be measured as input ports and connect them to VSS. See Figure 5.2 "A/D Accuracy Measure Circuit".
AN
Analog input
P0 to P14
AN: One of the analog input pin P0 to P14: I/O pins other than AN
Figure 5.2
A/D Accuracy Measure Circuit
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Table 5.6
A/D Conversion Characteristics (2/2) (1)
VCC1 = AVCC = 3.0 to 5.5 V VCC2 VREF, VSS = AVSS = 0 V at Topr = -20C to 85C/-40C to 85C unless otherwise specified. Symbol
AD
Parameter A/D operating clock frequency
Measuring Condition
Standard Min. 2 2 2 2 2 2 3 Typ. Max. 25 16 10 25 16 10 1 3 3 1.60 0.60 3.0 0 VCC1 VREF
Unit MHz MHz MHz MHz MHz MHz k LSB LSB LSB
s s
AN0 to AN7 input, 4.0 V VCC1 5.5 V ANEX0 to ANEX1 3.2 V V CC1 4.0 V input 3.0 V VCC1 3.2 V AN0_0 to AN0_7 4.0 V VCC2 5.5 V input, AN2_0 to 3.2 V VCC2 4.0 V AN2_7 input 3.2 V 3.0 V V
CC2
DNL tCONV tSAMP VREF VIA
Tolerance level impedance Differential non-linearity error Offset error Gain error 10-bit conversion time Sampling time Reference voltage Analog input voltage (2), (3)
(4) (4) (4)
VCC1 = 5 V, AD = 25 MHz
V V
Notes: 1. Use when AVCC = VCC1. 2. When VCC1 VCC2, set as below: Analog input voltage (AN0 to AN7, ANEX0, and ANEX1) VCC1 Analog input voltage (AN0_0 to AN0_7 and AN2_0 to AN2_7) VCC2. 3. When analog input voltage is over reference voltage, the result of A/D conversion is 3FFh. 4. Flash memory rewrite disabled. Except for the analog input pin, set the pins to be measured as input ports and connect them to VSS. See Figure 5.2 "A/D Accuracy Measure Circuit".
5.1.4
Table 5.7
D/A Conversion Characteristics
D/A Conversion Characteristics
Standard Min. Typ. Max. 8 2.5 3 5 See Notes 1 and 2 6 8.2 1.5
VCC1 = AVCC = VREF = 3.0 to 5.5 V, VSS = AVSS = 0 V at Topr = -20C to 85C/-40C to 85C unless otherwise specified. Symbol tSU RO IVREF Resolution Absolute Accuracy Setup Time Output Resistance Reference Power Supply Input Current Parameter Measuring Condition Unit Bits LSB
s
k mA
Notes: 1. This applies when using one D/A converter, with the D/A register for the unused D/A converter set to 00h. 2. The current consumption of the A/D converter is not included. Also, the IVREF of the D/A converter will flow even if the ADSTBY bit in the ADCON1 register is 0 (A/D operation stopped (standby)).
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5.1.5
Flash Memory Electrical Characteristics
CPU Clock When Operating Flash Memory (f(BCLK))
Standard Min. Typ. Max. 10 (1) 5 (3) fC(32.768) 2.7 V VCC1 3.0 V 3.0 V < VCC1 5.5 V 35 16 (2) 20 (2)
Table 5.8
VCC1 = 2.7 to 5.5 V, Topr = -20C to 85C/-40C to 85C unless otherwise specified. Symbol f(SLOW_R) Parameter CPU rewrite mode Slow read mode Low current consumption read mode Data flash read Conditions Unit MHz MHz kHz MHz MHz
Notes: 1. Set the PM17 bit in the PM1 register to 1 (one wait). 2. When the frequency is over this value, set the FMR17 bit in the FMR1 register to 0 (one wait) or the PM17 bit in the PM1 register to 1 (one wait) 3. Set the PM17 bit in the PM1 register to 1 (one wait). When using 125 kHz on-chip oscillator clock or sub clock as the CPU clock source, a wait is not necessary.
Table 5.9
Flash Memory (Program ROM 1, 2) Electrical Characteristics
Standard Typ. Max. 150 70 0.2 2.7 Topr= -20C to 85C/-40C to 85C 2.7 0 Ambient temperature = 55C 20 4000 3000 3.0 5.5 5.5 60 50
VCC1 = 2.7 to 5.5 V at Topr = 0C to 60C (option: -40C to 85C), unless otherwise specified. Symbol tPS Parameter Conditions Min. 1,000 (2) Unit times
s s
Program and erase cycles (1), (3), (4) VCC1 = 3.3 V, Topr = 25C VCC1 = 3.3 V, Topr = 25C 2 word program time Lock bit program time Block erase time Program, erase voltage Read voltage Program, erase temperature Flash memory circuit stabilization wait time Data hold time (6) VCC1 = 3.3 V, Topr = 25C VCC1 = 3.3 V, Topr = 25C
s V V
C s
year
Notes: 1. Definition of program and erase cycles: The program and erase cycles refer to the number of per-block erasures. If the program and erase cycles are n (n = 1,000), each block can be erased n times. For example, if a block is erased after writing 2 word data 16,384 times, each to a different address, this counts as one program and erase cycles. Data cannot be written to the same address more than once without erasing the block (rewrite prohibited). 2. Cycles to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed). 3. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential addresses in turn so that as much of the block as possible is used up before performing an erase operation. It is advisable to retain data on the erasure cycles of each block and limit the number of erase operations to a certain number. 4. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase command at least three times until the erase error does not occur. 5. Customers desiring program/erase failure rate information should contact a Renesas Electronics sales office. 6. The data hold time includes time that the power supply is off or the clock is not supplied.
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Table 5.10
Flash Memory (Data Flash) Electrical Characteristics
Standard Min. 10,000 (2) 300 140 0.2 2.7 2.7
-20/-40
VCC1 = 2.7 to 5.5 V at Topr = -20 to 85C/-40 to 85C, unless otherwise specified. Symbol tPS Parameter Conditions Typ. Max. 4000 3000 3.0 5.5 5.5 85 50 20 Unit times
s s
Program and erase cycles (1), (3), (4) VCC1 = 3.3 V, Topr = 25C 2 word program time Lock bit program time Block erase time Program, erase voltage Read voltage Program, erase temperature Flash memory circuit stabilization wait time Data hold time (6) Ambient temperature = 55 C VCC1 = 3.3 V, Topr = 25C VCC1 = 3.3 V, Topr = 25C VCC1 = 3.3 V, Topr = 25C
s V V
C s
year
Notes: 1. Definition of program and erase cycles The program and erase cycles refer to the number of per-block erasures. If the program and erase cycles are n (n = 10,000), each block can be erased n times. For example, if a 4 KB block is erased after writing 2 word data 1,024 times, each to a different address, this counts as one program and erase cycles. Data cannot be written to the same address more than once without erasing the block (rewrite prohibited). 2. Cycles to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed). 3. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example, when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 256 groups before erasing them all in one operation. In addition, averaging the erasure cycles between blocks A and B can further reduce the actual erasure cycles. It is also advisable to retain data on the erasure cycles of each block and limit the number of erase operations to a certain number. 4. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase command at least three times until the erase error does not occur. 5. Customers desiring program/erase failure rate information should contact a Renesas Electronics sales office. 6. The data hold time includes time that the power supply is off or the clock is not supplied.
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5.1.6
Table 5.11
Voltage Detector and Power Supply Circuit Electrical Characteristics
Voltage Detector 0 Electrical Characteristics
Standard Min. 1.60 2.55 Typ. 1.90 2.85 Max. 2.20 3.15 200 1.8 100
The measurement condition is VCC1 = 2.7 to 5.5 V, Topr = -20C to 85C/-40C to 85C, unless otherwise specified. Symbol Vdet0 td(E-A) Parameter Voltage detection level Vdet0_0 (1) Voltage detection level Vdet0_2 (1) Voltage detector 0 response time
(3)
Condition When VCC1 is falling. When VCC1 is falling. When VCC1 falls from 5 V to (Vdet0_0 - 0.1) V VC25 = 1, VCC1 = 5.0 V
Unit V V
s A s
Voltage detector self power consumption Waiting time until voltage detector operation starts (2)
Notes: 1. Select the voltage detection level with the VDSEL1 bit in the OFS1 address. 2. Necessary time until the voltage detector operates when setting to 1 again after setting the VC25 bit in the VCR2 register to 0. 3. Time from when passing the Vdet0 until when a voltage monitor 0 reset is generated.
Table 5.12
Voltage Detector 1 Electrical Characteristics
Standard Min. 2.79 3.54 3.94 Typ. 3.09 3.84 4.44 0.15 When VCC1 falls from 5 V to (Vdet1_0 - 0.1) V VC26 = 1, VCC1 = 5.0 V 1.8 100 200 Max. 3.39 4.14 4.94
The measurement condition is VCC1 = 2.7 to 5.5 V, Topr = -20C to 85C/-40C to 85C, unless otherwise specified. Symbol Vdet1 Parameter Voltage detection level Vdet1_6 (1) Voltage detection level Vdet1_B Voltage detection level Vdet1_F td(E-A)
(1) (1)
Condition When VCC1 is falling. When VCC1 is falling. When VCC1 is falling.
Unit V V V V
s A s
Hysteresis width when VCC1 of voltage detector 1 is rising Voltage detector 1 response time (3) Voltage detector self power consumption Waiting time until voltage detector operation starts (2)
Notes: 1. Select the voltage detection level with bits VD1S0 to VD1S3 in the VD1LS register. 2. Necessary time until the voltage detector operates when setting to 1 again after setting the VC26 bit in the VCR2 register to 0. 3. Time from when passing the Vdet1 until when a voltage monitor 1 reset is generated.
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Table 5.13
Voltage Detector 2 Electrical Characteristics
Standard Min. 3.50 Typ. 4.00 0.15 When VCC1 falls from 5 V to (Vdet2_0 - 0.1) V VC27 = 1, VCC1 = 5.0 V
(1)
The measurement condition is VCC1 = 2.7 to 5.5 V, Topr = -20C to 85C/-40C to 85C, unless otherwise specified. Symbol Vdet2 td(E-A) Parameter Voltage detection level Vdet2_0 Hysteresis width at the rising of VCC1 in voltage detector 2 Voltage detector 2 response time (2) Voltage detector self power consumption Waiting time until voltage detector operation starts Condition When VCC1 is falling Max. 4.50 Unit V V 200 1.8 100
s A s
Notes: 1. Necessary time until the voltage detector operates after setting to 1 again after setting the VC27 bit in the VCR2 register to 0. 2. Time from when passing the Vdet2 until when a voltage monitor 2 reset is generated.
Table 5.14
Power-On Reset Circuit
Standard Min. 2.0 300 Typ. Max. 0.1
The measurement condition is VCC1 = 2.0 to 5.5 V, Topr = -20C to 85C/ -40C to 85C, unless otherwise specified. Symbol Vpor1 trth tw(por) Parameter Voltage at which power-on reset enabled (1) External power VCC1 rise gradient Time necessary to enable power-on reset Condition Unit V
50000 mV/ms ms
Note: 1. To use the power-on reset function, enable voltage monitor 0 reset by setting the LVDAS bit in the OFS1 address to 0. Also, set the VDSEL1 bit to 0 (Vdet0_2).
Vdet0 (1) VCC1 Vpor1 tw(por) Voltage detection 0 circuit response time t rth t rth
Vdet0 (1)
Internal reset signal 1 fOCO-S 1 fOCO-S
x 32
x 32
Note: 1. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit.
Figure 5.3
Power-On Reset Circuit Electrical Characteristics
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Table 5.15 Power Supply Circuit Timing Characteristics The measurement condition is VCC1 = 2.7 to 5.5 V and Topr = 25C, unless otherwise specified.
Symbol td(P-R) td(R-S) td(W-S) Parameter Internal power supply stability time when power is on (1) STOP release time Low power mode wait mode release time Condition Standard Min. Typ. Max. 5 150 150 Unit ms
s s
Note: 1. Waiting time until the internal power supply generator stabilizes when power is on.
td(P-R) Internal power supply stability time when power is on
Recommended operation voltage VCC1 td(P-R) CPU clock
td(R-S) STOP release time td(W-S) Low power mode wait mode release time
Interrupt for (a) Stop mode release or (b) Wait mode release
CPU clock (a) (b) td(E-A) Voltage detector operation start time td(R-S) td(W-S)
VC25, VC26, VC27
Voltage detector
Stop
Operate
td(E-A)
Figure 5.4
Power Supply Circuit Timing Diagram
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5.1.7
Table 5.16
Oscillator Electrical Characteristics
40 MHz On-Chip Oscillator Electrical Characteristics (1/2)
R5F36506NFA, R5F36506NFB, R5F36506DFA, R5F36506DFB, R5F3651ENFC, R5F3650ENFA, R5F3650ENFB, R5F3651EDFC, R5F3650EDFA, R5F3650EDFB, R5F3651KNFC, R5F3650KNFA, R5F3650KNFB, R5F3651KDFC, R5F3650KDFB, R5F3650KDFA, R5F3651MNFC, R5F3650MNFA, R5F3650MNFB, R5F3651MDFC, R5F3650MDFA, R5F3650MDFB, R5F3651NNFC, R5F3650NNFA, R5F3650NNFB, R5F3651NDFC, R5F3650NDFA, R5F3650NDFB VCC1 = 2.7 to 5.5 V, Topr = -20C to 85C/-40C to 85C, unless otherwise specified. Symbol fOCO40M Parameter Condition Standard Min. 36 Typ. 40 Max. 44 2 Unit MHz ms
40 MHz on-chip oscillator frequency Average frequency in a 10 ms period
tsu(fOCO40M) Wait time until 40 MHz on-chip oscillator stabilizes
Table 5.17
40 MHz On-Chip Oscillator Electrical Characteristics (2/2)
R5F3651RNFC, R5F3650RNFA, R5F3650RNFB, R5F3651RDFC, R5F3650RDFA, R5F3650RDFB, R5F3651TNFC, R5F3650TNFA, R5F3650TNFB, R5F3651TDFC, R5F3650TDFA, R5F3650TDFB VCC1 = 2.7 to 5.5 V, Topr = -20C to 85C/-40C to 85C, unless otherwise specified. Symbol fOCO40M Parameter Condition Standard Min. 36 1 Typ. 40 40 Max. 44 60 2 Unit MHz MHz ms
40 MHz on-chip oscillator frequency Average frequency in a 10 ms period 2.7 V VCC1 < 5.5 V, Topr = 25 C Average frequency in a 10 ms period
tsu(fOCO40M) Wait time until 40 MHz on-chip oscillator stabilizes
Table 5.18
125 kHz On-Chip Oscillator Electrical Characteristics
Standard Min. Typ. 125 Max. 150 20
VCC1 = 2.7 to 5.5 V, Topr = -20C to 85C/-40C to 85C, unless otherwise specified. Symbol fOCO-S tsu(fOCO-S) Parameter 125 kHz on-chip oscillator frequency Wait time until 125 kHz on-chip oscillator stabilizes Condition Unit kHz
s
Average frequency in a 10 ms period 100
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5.2 5.2.1
Electrical Characteristics (VCC1 = VCC2 = 5 V) Electrical Characteristics VCC1 = VCC2 = 5 V
Electrical Characteristics (1)
(1)
Table 5.19
VCC1 = VCC2 = 4.2 to 5.5 V, VSS = 0 V at Topr = -20C to 85C/-40C to 85C, f(BCLK) = 32 MHz unless otherwise specified. Symbol VOH Parameter Measuring Condition Standard Min. VCC1 - 2.0 Typ. Max. VCC1 Unit V
High output P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, IOH = -5 mA voltage P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOH = -5 mA
VCC2 - 2.0
VCC2
VOH
High output P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, IOH = -200 A voltage P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOH = -200 A
VCC1 - 0.3
VCC1
V
VCC2 - 0.3
VCC2
VOH
High output voltage
XOUT
HIGH POWER LOW POWER
IOH = -1 mA IOH = -0.5 mA With no load applied With no load applied IOL = 5 mA
VCC1 - 2.0 VCC1 - 2.0 2.6 2.2
VCC1 VCC1
V
High output voltage
XCOUT
HIGH POWER LOW POWER
V
VOL
Low output P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, voltage P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7
2.0
V
IOL = 5 mA
2.0
VOL
Low output P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, voltage P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7
IOL = 200 A
0.45
V
IOL = 200 A
0.45
VOL
Low output voltage
XOUT
HIGH POWER LOW POWER
IOL = 1 mA IOL = 0.5 mA With no load applied With no load applied 0 0
2.0 2.0
V
Low output voltage
XCOUT
HIGH POWER LOW POWER
V
Note: 1. When VCC1 VCC2, refer to 5 V or 3 V standard depending on the voltage.
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5. Electrical Characteristics
VCC1 = VCC2 = 5 V
Table 5.20 Electrical Characteristics (2)
(1)
VCC1 = VCC2 = 4.2 to 5.5 V, VSS = 0 V at Topr = -20C to 85C/-40C to 85C, f(BCLK) = 32 MHz unless otherwise specified. Symbol VT+ - VT- Hysteresis Parameter
HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN, INT0 to INT7, NMI, ADTRG, CTS0 to CTS2, CTS5 to CTS7, SCL0 to SCL2, SCL5 to SCL7, SDA0 to SDA2, SDA5 to SDA7, CLK0 to CLK7, TA0OUT to TA4OUT, KI0 to KI3, RXD0 to RXD2, RXD5 to RXD7, SIN3, SIN4, SD, PMC0, PMC1, SCLMM, SDAMM, CEC, ZP, IDU, IDV, IDW RESET
Measuring Condition
Standard Min. 0.5 Typ. Max. 2.0
Unit V
VT+ - VT- Hysteresis IIH High input current
0.5 VI = 5 V
2.5 5.0
V
A
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 XIN, RESET, CNVSS, BYTE P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 XIN, RESET, CNVSS, BYTE P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1
IIL
Low input current
VI = 0 V
-5.0
A
RPULLUP Pull-up resistance
VI = 0 V
30
50
100
k
RfXIN VRAM
Feedback resistance XIN RAM retention voltage In stop mode 1.8
1.5
M V
Note: 1. When VCC1 VCC2, refer to 5 V or 3 V standard depending on the voltage.
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5. Electrical Characteristics
VCC1 = VCC2 = 5 V
Table 5.21 Electrical Characteristics (3)
R5F36506NFA, R5F36506NFB, R5F36506DFA, R5F36506DFB, R5F3650ENFA, R5F3650ENFB, R5F3650EDFA, R5F3650EDFB VCC1 = VCC2 = 4.2 to 5.5 V, VSS = 0 V at Topr = -20C to 85C/-40C to 85C, f(BCLK) = 32 MHz unless otherwise specified.
Symbol RfXCIN ICC Parameter Measuring Condition Min. Standard Typ. Max. 8 24.0 Unit M mA
Feedback resistance XCIN Power supply current High-speed mode f(BCLK) = 32 MHz XIN = 4 MHz (square wave), PLL multiplied by 8 In single-chip, mode, 125 kHz on-chip oscillator stopped the output pin are f(BCLK) =32 MHz, A/D conversion open and other pins XIN = 4 MHz (square wave), PLL multiplied by 8 are VSS 125 kHz on-chip oscillator stopped f(BCLK) = 20 MHz XIN = 20 MHz (square wave) 125 kHz on-chip oscillator stopped 40 MHz on-chip Main clock stopped oscillator mode 40 MHz on-chip oscillator on, no division 125 kHz on-chip oscillator stopped 125 kHz on-chip Main clock stopped oscillator mode 40 MHz on-chip oscillator stopped, 125 kHz on-chip oscillator on, no division FMR22 = 1 (slow read mode) Low-power mode f(BCLK) = 32 kHz In low-power mode FMR22 = FMR23 = 1 On flash memory (1) f(BCLK) = 32 kHz In low-power mode On RAM (1) Wait mode Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on Peripheral clock operating Topr = 25C f(BCLK) = 32 kHz (oscillation capacity High) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C f(BCLK) = 32 kHz (oscillation capacity Low) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C Stop mode Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock stopped Topr = 25C During flash f(BCLK) = 10 MHz, PM17 = 1 (one wait) memory program VCC1 = 5.0 V During flash f(BCLK) = 10 MHz, PM17 = 1 (one wait) memory erase VCC1 = 5.0 V This indicates the memory in which the program to be executed exists.
24.7
mA
16.0
mA
17.0
mA
500.0
A
160.0
A
45.0
A
20.0
A
11.0
A
6.0
A
1.7
A
20.0 30.0
mA mA
Note: 1.
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5. Electrical Characteristics
VCC1 = VCC2 = 5 V
Table 5.22 Electrical Characteristics (4)
R5F3651ENFC, R5F3651EDFC, R5F3651KNFC, R5F3650KNFA, R5F3650KNFB, R5F3651KDFC, R5F3650KDFB, R5F3650KDFA, R5F3651MNFC, R5F3650MNFA, R5F3650MNFB, R5F3651MDFC, R5F3650MDFA, R5F3650MDFB, R5F3651NNFC, R5F3650NNFA, R5F3650NNFB, R5F3651NDFC, R5F3650NDFA, R5F3650NDFB
VCC1 = VCC2 = 4.2 to 5.5 V, VSS = 0 V at Topr = -20C to 85C/-40C to 85C, f(BCLK) = 32 MHz unless otherwise specified. Symbol RfXCIN ICC Parameter Feedback resistance XCIN Power supply current High-speed mode Measuring Condition Min. Standard Typ. Max. 8 26.0 Unit M mA
f(BCLK) = 32 MHz XIN = 4 MHz (square wave), PLL multiplied by 8 In single-chip, mode, 125 kHz on-chip oscillator stopped the output pin are f(BCLK) = 32 MHz, A/D conversion open and other pins XIN = 4 MHz (square wave), PLL multiplied by 8 are VSS 125 kHz on-chip oscillator stopped f(BCLK) = 20 MHz XIN = 20 MHz (square wave) 125 kHz on-chip oscillator stopped 40 MHz on-chip Main clock stopped oscillator mode 40 MHz on-chip oscillator on, no division 125 kHz on-chip oscillator stopped 125 kHz on-chip Main clock stopped oscillator mode 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on, no division FMR22 = 1 (slow read mode) Low-power mode f(BCLK) = 32 kHz In low-power mode FMR22 = FMR23 = 1 on flash memory (1) f(BCLK) = 32 kHz In low-power mode on RAM (1) Wait mode Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on Peripheral clock operating Topr = 25C f(BCLK) = 32 kHz (oscillation capacity High) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C f(BCLK) = 32 kHz (oscillation capacity low) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C Stop mode Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock stopped Topr = 25C During flash memory f(BCLK) = 10 MHz, PM17 = 1 (one wait) program VCC1 = 5.0 V During flash memory f(BCLK) = 10 MHz, PM17 = 1 (one wait) erase VCC1 = 5.0 V
27.0
mA
17.0
mA
18.0
mA
550.0
A
170.0
A
45.0
A
20.5
A
11.0
A
6.0
A
1.7
A
20.0 30.0
mA mA
Note: 1. This indicates the memory in which the program to be executed exists.
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5. Electrical Characteristics
VCC1 = VCC2 = 5 V
Table 5.23 Electrical Characteristics (5) (1)
R5F3651RNFC, R5F3650RNFA, R5F3650RNFB, R5F3651RDFC, R5F3650RDFA, R5F3650RDFB, R5F3651TNFC, R5F3650TNFA, R5F3650TNFB, R5F3651TDFC, R5F3650TDFA, R5F3650TDFB VCC1 = VCC2 = 4.2 to 5.5 V, VSS = 0 V at Topr = -20 to 85C/-40 to 85C, f(BCLK) = 32 MHz unless otherwise specified. Symbol
RfXCIN ICC
Parameter
Feedback resistance XCIN Power supply current High-speed mode In single-chip, mode, the output pin are open and other pins are VSS
Measuring Condition
Min.
Standard Unit Typ. Max.
15 M mA
40 MHz on-chip oscillator mode 125 kHz on-chip oscillator mode
Low-power mode
Wait mode
f(BCLK) = 32 MHz XIN = 4 MHz (square wave), PLL multiplied by 8 125 kHz on-chip oscillator stopped f(BCLK) = 32 MHz, A/D conversion XIN = 4 MHz (square wave), PLL multiplied by 8 125 kHz on-chip oscillator stopped f(BCLK) = 20 MHz XIN = 20 MHz (square wave) 125 kHz on-chip oscillator stopped Main clock stopped 40 MHz on-chip oscillator on, no division 125 kHz on-chip oscillator stopped Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on, no division FMR22 = 1 (slow read mode) f(BCLK) = 32 kHz In low-power mode FMR22 = FMR23 = 1 on flash memory (1) f(BCLK) = 32 kHz In low-power mode on RAM (1) Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on Peripheral clock operating Topr = 25C f(BCLK) = 32 kHz (oscillation capacity High) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C f(BCLK) = 32 kHz (oscillation capacity Low) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C
32.0
32.7
mA
21.0
mA
23.0
mA
750.0
A
250.0
A
45.0
A
21.0
A
11.0
A
6.0
A
Stop mode
Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock stopped Topr = 25C f(BCLK) = 10 MHz, PM17 = 1 (one wait) VCC1 = 5.0 V f(BCLK) = 10 MHz, PM17 = 1 (one wait) VCC1 = 5.0 V
1.7
A
During flash memory program During flash memory erase
20.0 30.0
mA mA
Note: 1. This indicates the memory in which the program to be executed exists.
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5. Electrical Characteristics
VCC1 = VCC2 = 5 V 5.2.2 Timing Requirements (Peripheral Functions and Others)
(VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified)
5.2.2.1
Table 5.24
Symbol tw(RSTL)
Reset Input (RESET Input)
Reset Input (RESET Input)
Parameter RESET input low pulse width Standard Min. 10 Max. Unit s
RESET input t w(RTSL)
Figure 5.5
Reset Input (RESET Input)
5.2.2.2
Table 5.25
Symbol tc tw(H) tw(L) tr tf
External Clock Input
External Clock Input (XIN Input) (1)
Parameter External clock input cycle time External clock input high pulse width External clock input low pulse width External clock rise time External clock fall time Standard Min. 50 20 20 9 9 Max. Unit ns ns ns ns ns
Note: 1. The condition is VCC1 = VCC2 = 3.0 to 5.0 V.
XIN input tr t w(H) tf tc t w(L)
Figure 5.6
External Clock Input (XIN Input)
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.2.3
Table 5.26
Symbol tc(TA) tw(TAH) tw(TAL) TAiIN input cycle time TAiIN input high pulse width TAiIN input low pulse width
5V
Timer A Input
Timer A Input (Counter Input in Event Counter Mode)
Parameter Standard Min. 100 40 40 Max. Unit ns ns ns
Table 5.27
Symbol tc(TA) tw(TAH) tw(TAL)
Timer A Input (Gating Input in Timer Mode)
Parameter TAiIN input cycle time TAiIN input high pulse width TAiIN input low pulse width Standard Min. 400 200 200 Max. Unit ns ns ns
Table 5.28
Symbol tc(TA) tw(TAH) tw(TAL)
Timer A Input (External Trigger Input in One-Shot Timer Mode)
Parameter TAiIN input cycle time TAiIN input high pulse width TAiIN input low pulse width Standard Min. 200 100 100 Max. Unit ns ns ns
Table 5.29
Symbol tw(TAH) tw(TAL)
Timer A Input (External Trigger Input in Pulse Width Modulation Mode and Programmable Output Mode)
Parameter TAiIN input high pulse width TAiIN input low pulse width Standard Min. 100 100 Max. Unit ns ns
tc(TA) t w(TAH) TAiIN input t w(TAL) tc(UP) t w(UPH) TAiOUT input t w(UPL)
Figure 5.7
Timer A Input
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified)
Table 5.30
Symbol tc(TA) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN) TAiIN input cycle time TAiOUT input setup time TAiIN input setup time
5V
Timer A Input (Two-Phase Pulse Input in Event Counter Mode)
Parameter Standard Min. 800 200 200 Max. Unit ns ns ns
Two-phase pulse input in event counter mode tc(TA) TAiIN input tsu(TAIN-TAOUT) TAiOUT input tsu(TAOUT-TAIN) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN)
Figure 5.8
Timer A Input (Two-Phase Pulse Input in Event Counter Mode)
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.2.4
Table 5.31
Symbol tc(TB) tw(TBH) tw(TBL) tc(TB) tw(TBH) tw(TBL)
5V
Timer B Input
Timer B Input (Counter Input in Event Counter Mode)
Parameter TBiIN input cycle time (counted on one edge) TBiIN input high pulse width (counted on one edge) TBiIN input low pulse width (counted on one edge) TBiIN input cycle time (counted on both edges) TBiIN input high pulse width (counted on both edges) TBiIN input low pulse width (counted on both edges) Standard Min. 100 40 40 200 80 80 Max. Unit ns ns ns ns ns ns
Table 5.32
Symbol tc(TB) tw(TBH) tw(TBL)
Timer B Input (Pulse Period Measurement Mode)
Parameter TBiIN input cycle time TBiIN input high pulse width TBiIN input low pulse width Standard Min. 400 200 200 Max. Unit ns ns ns
Table 5.33
Symbol tc(TB) tw(TBH) tw(TBL)
Timer B Input (Pulse Width Measurement Mode)
Parameter TBiIN input cycle time TBiIN input high pulse width TBiIN input low pulse width Standard Min. 400 200 200 Max. Unit ns ns ns
tc(TB) t w(TBH) TBiIN input t w(TBL)
Figure 5.9
Timer B Input
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.2.5
Table 5.34
Symbol tc(CK) tw(CKH) tw(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) CLKi input cycle time CLKi input high pulse width CLKi input low pulse width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time 0 70 90
5V
Serial Interface
Serial Interface
Parameter Standard Min. 200 100 100 80 Max. Unit ns ns ns ns ns ns ns
tc(CK) t w(CKH) CLKi t w(CKL) th(C-Q) TXDi td(C-Q) RXDi tsu(D-C) th(C-D)
Figure 5.10
Serial Interface
5.2.2.6
Table 5.35
Symbol tw(INH) tw(INL)
External Interrupt INTi Input
External Interrupt INTi Input
Parameter INTi input high pulse width INTi input low pulse width Standard Min. 250 250 Max. Unit ns ns
t w(INL) INTi input t w(INH)
Figure 5.11
External Interrupt INTi Input
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.2.7
Table 5.36
Symbol tBUF tHD;STA tLOW tR tHD;DAT tHIGH fF tsu;DAT tsu;STA tsu;STO Bus free time Hold time in start condition Hold time in SCL clock 0 status SCL, SDA signals' rising time Data hold time Hold time in SCL clock 1 status SCL, SDA signals' falling time Data setup time Setup time in restart condition Stop condition setup time 250 4.7 4.0 0 4.0 300
5V
Multi-master I2C-bus
Multi-master I2C-bus
Parameter Standard Clock Mode Min. 4.7 4.0 4.7 1000 Max. Fast-mode Min. 1.3 0.6 1.3 20 + 0.1 Cb 0 0.6 20 + 0.1 Cb 100 0.6 0.6 300 300 0.9 Max. Unit s s s ns s s ns ns s s
SDA
t BUF t LOW tR tF
Sr p
t HD;STA
t su;STO
SCL
p
s
t HD;STA
t HD;DAT
t HIGH
t su;DAT
t su;STA
Figure 5.12
Multi-master I2C-bus
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.3
5V
Timing Requirements (Memory Expansion Mode and Microprocessor Mode)
Memory Expansion Mode and Microprocessor Mode
Parameter Data input access time (for setting with no wait) Data input access time (for setting with 1 to 3 waits) Data input access time (when accessing multiplex bus area) Data input access time (for setting with 2 + 3 or more) Data input setup time
RDY input setup time
Table 5.37
Symbol tac1(RD-DB) tac2(RD-DB) tac3(RD-DB) tac4(RD-DB) tsu(DB-RD) tsu(RDY-BCLK) th(RD-DB) th(BCLK-RDY)
Standard Min. Max. (Note 1) (Note 2) (Note 3) (Note 4) 40 80 0 0
Unit ns ns ns ns ns ns ns ns
Data input hold time
RDY input hold time
Notes: 1. Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 45 [ ns ] --------------------f ( BCLK )
9
2.
Calculated according to the BCLK frequency as follows:
( n + 0.5 ) x 10 ----------------------------------- - 45 [ ns ] f ( BCLK )
9
n is 1 for 1 wait setting, 2 for 2 waits setting and 3 for 3 waits setting.
3.
Calculated according to the BCLK frequency as follows:
( n - 0.5 ) x 10 ----------------------------------- - 45 [ ns ] f ( BCLK )
9
n is 2 for 2 waits setting, and 3 for 3 waits setting.
4.
Calculated according to the BCLK frequency as follows:
n x 10 ----------------- - 45 [ ns ] f ( BCLK )
9
n is 3 for 2 + 3, 4 for 2 + 4, 4 for 3 + 4, and 5 for 4 + 5.
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode
VCC1 = VCC2 = 5 V
(Effective in wait state setting)
BCLK
RD (Separate bus)
WR, WRL, WRH (Separate bus)
RD (Multiplexed bus)
WR, WRL, WRH
(Multiplexed bus)
RDY input tsu(RDY-BCLK) th(BCLK-RDY)
Measuring conditions VCC1 = V CC2 = 5 V Input timing voltage: V = 1.0 V, V = 4.0 V IL IH Output timing voltage: V = 2.5 V, V = 2.5 V OL OH
Figure 5.13
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = 5 V 5.2.4 Switching Characteristics (Memory Expansion Mode and Microprocessor Mode)
(VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified)
5.2.4.1
Table 5.38
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB)
In No Wait State Setting
Memory Expansion Mode and Microprocessor Mode (in No Wait State Setting)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) Data output delay time (in relation to WR) Data output hold time (in relation to WR)
(3) (3)
Measuring Condition
Standard Min. Max. 25 0 0 (Note 2) 25 0 15 -4 25 0 25 0 40 0 (Note 1) (Note 2)
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
See Figure 5.14
Notes: 1. Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 40 [ ns ] --------------------f(BCLK) is 12.5 MHz or less. f ( BCLK )
9
2.
Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 10 [ ns ] --------------------f ( BCLK )
9
3.
This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = -CR x ln(1-VOL/VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30 pF, R = 1 k, hold time of output low level is t = -30 pF x 1 k x In(1 - 0.2VCC2/VCC2) = 6.7 ns.
R DBi C
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5. Electrical Characteristics
P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14
30 pF
Figure 5.14
Ports P0 to P14 Measurement Circuit
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode (in no wait state setting)
Read timing
VCC1 = VCC2 = 5V
BCLK td(BCLK-CS)
25ns(max.)
th(BCLK-CS)
0ns(min.)
CSi tcyc
td(BCLK-AD)
25ns(max.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE) 15ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(RD-AD)
0ns(min.)
ALE td(BCLK-RD) 25ns(max.) RD tac1(RD-DB) (0.5 x t cyc - 45)ns(max.) Hi-Z DBi tsu(DB-RD) 40ns(min.) th(RD-DB)
0ns(min.)
th(BCLK-RD)
0ns(min.)
Write timing
BCLK td(BCLK-CS)
25ns(max.)
th(BCLK-CS)
0ns(min.)
CSi tcyc
td(BCLK-AD)
25ns(max.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE) 15ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(WR-AD)
(0.5 x t cyc - 10)ns(min.)
ALE td(BCLK-WR)
25ns(max.)
th(BCLK-WR)
0ns(min.)
WR, WRL, WRH
Hi-Z
td(BCLK-DB)
40ns(max.)
th(BCLK-DB)
0ns(min.)
DBi
td(DB-WR) th(WR-DB) (0.5 x t cyc - 40)ns(min.) (0.5 x t cyc - 10)ns(min.) tcyc = 1 f(BCLK)
Measuring conditions VCC1 = V CC2 = 5V Input timing voltage: V = 0.8 V, V = 2.0 V IL IH Output timing voltage: V = 0.4 V, V = 2.4 V OL OH
Figure 5.15
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = Switching Characteristics (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.4.2
Table 5.39
5V
In 1 to 3 Waits Setting and When Accessing External Area
Memory Expansion Mode and Microprocessor Mode (in 1 to 3 Waits Setting and When Accessing External Area)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) Data output delay time (in relation to WR) Data output hold time (in relation to WR)(3)
(3)
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB)
Measuring Condition
Standard Min. Max. 25 0 0 (Note 2) 25 0 15
Unit ns ns ns ns ns ns ns ns
See Figure 5.14
-4 25 0 25 0 40 0 (Note 1) (Note 2)
ns ns ns ns ns ns ns ns
Notes: 1. Calculated according to the BCLK frequency as follows:
( n - 0.5 ) x 10 - - 40 [ ns ] ----------------------------------f ( BCLK )
9
n is 1 for 1 wait setting, 2 for 2 waits setting and 3 for 3 waits setting. When n = 1, f(BCLK) is 12.5 MHz or less.
2.
Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 10 [ ns ] --------------------f ( BCLK )
9
3.
This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = -CR x ln(1 - VOL/VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30 pF, R = 1 k, hold time of output low level is t = -30 pF x 1 k x In(1 - 0.2VCC2/VCC2) = 6.7 ns.
R DBi C
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Memory Expansion Mode and Microprocessor Mode
(in 1 to 3 waits setting and when accessing external area) Read timing
BCLK td(BCLK-CS)
25ns(max.)
VCC1 = VCC2 = 5V
th(BCLK-CS)
0ns(min.)
CSi tcyc
td(BCLK-AD)
25ns(max.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE)
15ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(RD-AD)
0ns(min.)
ALE td(BCLK-RD)
25ns(max.)
th(BCLK-RD)
0ns(min.)
RD tac2(RD-DB) {(n+0.5) x tcyc -45}ns(max.) th(RD-DB)
0ns(min.)
DBi
Hi-Z
tsu(DB-RD)
40ns(min.)
Write timing
BCLK td(BCLK-CS)
25ns(max.)
th(BCLK-CS)
0ns(min.)
CSi tcyc
td(BCLK-AD)
25ns(max.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE)
15ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(WR-AD)
(0.5 x t cyc-10)ns(min.)
ALE td(BCLK-WR)
25ns(max.)
th(BCLK-WR)
0ns(min.)
WR, WRL, WRH
Hi-Z DBi
td(BCLK-DB)
40ns(max.)
th(BCLK-DB)
0ns(min.)
td(DB-WR) {(n-0.5) x tcyc -40}ns(min.) 1 f(BCLK)
th(WR-DB)
(0.5 x t cyc-10)ns(min.)
tcyc =
Measuring conditions VCC1 = V CC2 = 5V Input timing voltage: V = 0.8 V, V = 2.0 V IL IH Output timing voltage: V = 0.4 V, V = 2.4 V OL OH
n: 1 (when 1 wait) 2 (when 2 waits) 3 (when 3 waits)
Figure 5.16
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = Switching Characteristics (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.4.3
Table 5.40
5V
In 2 or 3 Waits Setting, and When Accessing External Area and Using Multiplexed Bus
Memory Expansion Mode and Microprocessor Mode (in 2 or 3 Waits Setting, and When Accessing External Area and Using Multiplexed Bus) (5)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) Chip select output hold time (in relation to RD) Chip select output hold time (in relation to WR) RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) Data output delay time (in relation to WR) Data output hold time (in relation to WR) ALE signal output delay time (in relation to BCLK) ALE signal output hold time (in relation to BCLK) ALE signal output delay time (in relation to Address) ALE signal output hold time (in relation to Address) RD signal output delay from the end of address WR signal output delay from the end of address Address output floating start time
-4
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) th(RD-CS) th(WR-CS) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-ALE) th(BCLK-ALE) td(AD-ALE) th(AD-ALE) td(AD-RD) td(AD-WR) tdz(RD-AD)
Measuring Condition
Standard Min. Max. 25 0 (Note 1) (Note 1) 25 0 (Note 1) (Note 1) 25 0 25
Unit ns ns ns ns ns ns ns ns ns ns ns ns
See Figure 5.14
0 40 0 (Note 2) (Note 1) 15
ns ns ns ns ns ns ns ns ns ns
(Note 3) (Note 4) 0 0 8
ns
Notes: 1. Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 10 [ ns ] --------------------f ( BCLK )
2. Calculated according to the BCLK frequency as follows:
9
( n - 0.5 ) x 10 ----------------------------------- - 40 [ ns ] n is 2 for 2-wait setting, 3 for 3-wait setting. f ( BCLK )
3. Calculated according to the BCLK frequency as follows:
9
0.5 x 10 - - 25 [ ns ] --------------------f ( BCLK )
4. Calculated according to the BCLK frequency as follows:
9
0.5 x 10 - - 15 [ ns ] --------------------f ( BCLK )
5. When using multiplex bus, set f(BCLK) 12.5 MHz or less.
9
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode
(in 2 or 3 waits setting, and when accessing external area and using multiplexed bus ) Read timing
VCC1 = VCC2 = 5V
BCLK
td(BCLK-CS)
25ns(max.)
th(BCLK-CS) tcyc
(0.5 x t cyc-10)ns(min.)
th(RD-CS)
0ns(min.)
CSi td(AD-ALE) (0.5 x t cyc-25ns(min.) ADi /DBi th(ALE-AD) (0.5 x t cyc-15ns(min.) tdz(RD-AD)
8ns(max.)
Address
Data input
Address
tsu(DB-RD) tac3(RD-DB) {(n-0.5) x tcyc -45}ns(max.) 40ns(min.)
th(RD-DB)
0ns(min.)
td(BCLK-AD)
25ns(max.)
td(AD-RD)
0ns(min.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE) 15ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(RD-AD) (0.5 x t cyc-10)ns(min.) td(BCLK-RD) 25ns(max.) th(BCLK-RD)
0ns(min.)
ALE
RD
Write timing
BCLK td(BCLK-CS)
25ns(max.)
tcyc
th(WR-CS) (0.5 x t cyc-10)ns(min.)
th(BCLK-CS)
0ns(min.)
CSi td(BCLK-DB)
40ns(max.)
th(BCLK-DB)
0ns(min.)
ADi /DBi
Address
Data output
Address
td(AD-ALE) (0.5 x t cyc-25ns(min.) td(BCLK-AD)
25ns(max.)
td(DB-WR) {(n-0.5) x tcyc -40}ns(min.)
th(WR-DB) (0.5 x t cyc-10)ns(min.) th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE) 15ns(max.)
th(BCLK-ALE)
-4ns(min.)
td(AD-WR)
0ns(min.)
th(WR-AD) (0.5 x t cyc-10)ns(min.) th(BCLK-WR)
0ns(min.)
ALE
WR, WRL, WRH
td(BCLK-WR) 25ns(max.)
Measuring conditions VCC1 = V CC2 = 5V Input timing voltage: V = 0.8 V, V = 2.0 V IL IH Output timing voltage: V = 0.4 V, V = 2.4 V OL OH
n: 2 (when 2 waits) 3 (when 3 waits)
Figure 5.17
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = Switching Characteristics (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.4.4
Table 5.41
5V
In Wait State Setting 2 + 3, 2 + 4, 3 + 4, and 4 + 5, and When Accessing External Area
Memory Expansion Mode and Microprocessor Mode (in Wait State Setting 2 + 3 , 2 + 4, 3 + 4, and 4 + 5, and When Accessing External Area)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) (3) Data output delay time (in relation to WR) Data output hold time (in relation to WR)
(3)
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB)
Measuring Condition
Standard Min. Max. 25 0 0 (Note 2) 25 0 15
Unit ns ns ns ns ns ns ns ns
See Figure 5.14
-4 25 0 25 0 40 0 (Note 1) (Note 2)
ns ns ns ns ns ns ns ns
Notes: 1. Calculated according to the BCLK frequency as follows:
( n - 0.5 ) x 10 ----------------------------------- - 40 [ ns ] f ( BCLK )
9
n is 3 for 2 + 3, 4 for 2 + 4, 4 for 3 + 4, and 5 for 4 + 5.
2.
Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 10 [ ns ] --------------------f ( BCLK )
9
3.
This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = -CR x ln(1 - VOL/VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30 pF, R = 1 k, hold time of output low level is t = -30 pF x 1 k x In(1 - 0.2VCC2/VCC2) = 6.7 ns.
R DBi C
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Memory Expansion Mode and Microprocessor Mode (in wait state setting 2 + 3 , 2 + 4 , 3 + 4 , and 4 + 5 , and when accessing external area)
Read timing
BCLK td(BCLK-CS) 25ns(max.) CSi td(BCLK-AD) 25ns(max.) ADi BHE td(BCLK-ALE) 15ns(max.) ALE td(BCLK-RD) 25ns(max.) RD th(BCLK-ALE) -4ns(min.) tcyc
VCC1 = VCC2 = 5V
th(BCLK-CS) 0ns(min.)
th(BCLK-AD) 0ns(min.)
th(RD-AD) 0ns(min.)
th(BCLK-RD) 0ns(min.)
tac4(RD-DB) (n x tcyc-45)ns(max.) DBi Hi-Z tsu(DB-RD) 40ns(min.) th(RD-DB) 0ns(min.)
Write timing
tcyc
BCLK td(BCLK-CS) 25ns(max.) CSi td(BCLK-AD) 25ns(max.) ADi BHE td(BCLK-ALE) 15ns(max.) ALE td(BCLK-WR) 25ns(max.) WR, WRL WRH td(BCLK-DB) 40ns(max.) DBi Hi-Z th(BCLK-DB) 0ns(min.) th(BCLK-WR) 0ns(min.) th(BCLK-ALE) -4ns(min.) th(WR-AD) (0.5 x tcyc -10)ns(min.) th(BCLK-AD) 0ns(min.) th(BCLK-CS) 0ns(min.)
1 tcyc = f(BCLK) Measuring conditions VCC1 = V CC2 = 5V Input timing voltage: V = 0.8 V, V = 2.0 V IL IH Output timing voltage: V = 0.4 V, V = 2.4 V OL OH
td(DB-WR) {(n-0.5) x tcyc -40}ns(min.)
th(WR-DB) (0.5 x tcyc -10)ns(min.)
n: 3 (when 2 + 3 ) 4 (when 2 + 4 or 3 + 4 ) 5 (when 4 + 5 )
Figure 5.18
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = Switching Characteristics (VCC1 = VCC2 = 5 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.2.4.5
Table 5.42
5V
In Wait State Setting 2 + 3, 2 + 4, 3 + 4, and 4 + 5, and When Inserting 1 to 3 Recovery Cycles and Accessing External Area
Memory Expansion and Microprocessor Modes (in Wait State Setting 2 + 3, 2 + 4, 3 + 4, and 4 + 5, and When Inserting 1 to 3 Recovery Cycles and Accessing External Area)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) Data output delay time (in relation to WR) Data output hold time (in relation to WR)
(3) (3)
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB)
Measuring Condition
Standard Min. Max. 25 0 (Note 4) (Note 2) 25 0 15
Unit ns ns ns ns ns ns ns ns
See Figure 5.14
-4 25 0 25 0 40 0 (Note 1) (Note 2)
ns ns ns ns ns ns ns ns
Notes: 1. Calculated according to the BCLK frequency as follows:
n x 10 ----------------- - 40 [ ns ] f ( BCLK )
2.
9
n is 3 for 2 + 3, 4 for 2 + 4, 4 for 3 + 4, and 5 for 4 + 5.
Calculated according to the BCLK frequency as follows:
m x 10 - - 10 [ ns ] -----------------f ( BCLK )
3.
9
m is 1 when 1 recovery cycle is inserted, 2 when 2 recovery cycles are inserted, and 3 when 3 recovery cycles are inserted.
4.
This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = -CR x ln(1-VOL/VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30 pF, R = 1 k, hold time of output low level is t = -30 pF x 1 k x In(1 - 0.2VCC2/VCC2) = 6.7 ns. Calculated according to the BCLK frequency as follows:
R DBi C
m x 10 - + 0 [ ns ] -----------------f ( BCLK )
9
m is 1 when 1 recovery cycle is inserted, 2 when 2 recovery cycles are inserted, and 3 when 3 recovery cycles are inserted.
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode (in wait state setting 2 + 3 , 2 + 4 , 3 + 4 , and 4 + 5 , and when inserting 1 to 3 recovery cycles and accessing external area)
Read timing
BCLK td(BCLK-CS) 25ns(max.) CSi td(BCLK-AD) 25ns(max.) ADi BHE td(BCLK-ALE) 15ns(max.) ALE td(BCLK-RD) 25ns(max.) RD tac4(RD-DB) (n x tcyc -45)ns(max.) DBi Hi-Z tsu(DB-RD) 40ns(min.) th(BCLK-ALE) -4ns(min.) tcyc
VCC1 = VCC2 = 5V
th(BCLK-CS) 0ns(min.)
th(BCLK-AD) 0ns(min.)
th(RD-AD) (m x tcyc+0)ns(min.)
th(BCLK-RD) 0ns(min.)
th(RD-DB) 0ns(min.)
Write timing
tcyc BCLK td(BCLK-CS) 25ns(max.) CSi td(BCLK-AD) 25ns(max.) ADi BHE td(BCLK-ALE) 15ns(max.) ALE td(BCLK-WR) 25ns(max.) WR, WRL WRH td(BCLK-DB) 40ns(max.) th(BCLK-DB) 0ns(min.) th(BCLK-WR) 0ns(min.) th(BCLK-ALE) -4ns(min.) th(WR-AD) (m x tcyc -10)ns(min.) th(BCLK-AD) 0ns(min.) th(BCLK-CS) 0ns(min.)
DBi
Hi-Z
1 tcyc = f(BCLK) Measuring conditions VCC1 = V CC2 = 5V Input timing voltage: V = 0.8 V, V = 2.0 V IL IH Output timing voltage: V = 0.4 V, V = 2.4 V OL OH
td(DB-WR) (n x tcyc -40)ns(min.)
th(WR-DB) (m x tcyc -10)ns(min.)
n: 3 (when 2 + 3 ) 4 (when 2 + 4 or 3 + 4 ) 5 (when 4 + 5 ) m: 1 (when 1 recovery cycle inserted ) 2 (when 2 recovery cycles inserted) 3 (when 3 recovery cycles inserted)
Figure 5.19
Timing Diagram
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5. Electrical Characteristics
5.3 5.3.1
Electrical Characteristics (VCC1 = VCC2 = 3 V) Electrical Characteristics VCC1 = VCC2 = 3 V
Electrical Characteristics (1)
(1)
Table 5.43
VCC1 = VCC2 = 2.7 to 3.3 V, VSS = 0 V at Topr = -20C to 85C/-40C to 85C, f(BCLK) = 32 MHz unless otherwise specified.
Symbol VOH High output voltage Parameter P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 VOH High output voltage XOUT HIGH POWER LOW POWER High output voltage VOL XCOUT HIGH POWER LOW POWER Measuring Condition IOH = -1 mA Standard Min. VCC1 - 0.5 Typ. Max. VCC1 Unit V
IOH = -1 mA
VCC2 - 0.5
VCC2
IOH = -0.1 mA IOH = -50 A With no load applied With no load applied
VCC1 - 0.5 VCC1 - 0.5 2.6 2.2
VCC1 VCC1
V
V 0.5 0.5 V
Low output P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to IOL = 1 mA voltage P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 CEC IOL = 1 mA
IOL = 1 mA XOUT HIGH POWER LOW POWER IOL = 0.1 mA IOL = 50 A With no load applied With no load applied 0.2
0
0.5 0.5 0.5
V V
VOL
Low output voltage
Low output voltage VT+-VT-
XCOUT
HIGH POWER LOW POWER
0 0 1.0
V V
Hysteresis HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN, INT0 to INT7, NMI, ADTRG, CTS0 to CTS2, CTS5 to CTS7, SCL0 to SCL2, SCL5 to SCL7, SDA0 to SDA2, SDA5 to SDA7, CLK0 to CLK7, TA0OUT to TA4OUT, KI0 to KI3, RXD0 to RXD2, RXD5 to RXD7, SIN3, SIN4, SD, PMC0, PMC1, SCLMM, SDAMM, ZP, IDU, IDV, IDW CEC
RESET
0.2 0.2 VI = 3 V
0.5
1.0 1.8 4.0
V V
A
IIH
High input current
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 XIN, RESET, CNVSS, BYTE CEC P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 XIN, RESET, CNVSS, BYTE P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1
-
Leakage current in powered-off state Low input current
VCC1 = 0 V VI = 0 V
1.8
-4.0
A A
IIL
RPULLUP Pull-up resistance
VI = 0 V
50
80
150
k
RfXIN VRAM
Feedback resistance XIN RAM retention voltage In stop mode 1.8
3.0
M V
Note: 1. When VCC1 VCC2, refer to 5 V or 3 V standard depending on the voltage.
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5. Electrical Characteristics
VCC1 = VCC2 = 3 V
Table 5.44 Electrical Characteristics (2)
R5F36506NFA, R5F36506NFB, R5F36506DFA, R5F36506DFB, R5F3650ENFA, R5F3650ENFB, R5F3650EDFA, R5F3650EDFB VCC1 = VCC2 = 2.7 to 3.3 V, VSS = 0 V at Topr = -20C to 85C/-40C to 85C, f(BCLK) = 32 MHz unless otherwise specified.
Symbol RfXCIN ICC Parameter Feedback resistance XCIN Power supply current High-speed mode In single-chip, mode, the output pin are open and other pins are VSS Measuring Condition Min. Standard Typ. Max. 16 f(BCLK) = 32 MHz XIN = 4 MHz (square wave), PLL multiplied by 8 125 kHz on-chip oscillator stopped f(BCLK) = 32 MHz, A/D conversion XIN = 4 MHz (square wave), PLL multiplied by 8 125 kHz on-chip oscillator stopped f(BCLK) = 20 MHz XIN = 20 MHz (square wave) 125 kHz on-chip oscillator stopped Main clock stopped 40 MHz on-chip oscillator on, no division 125 kHz on-chip oscillator stopped Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on, no division FMR22 = 1 (slow read mode) f(BCLK) = 32 MHz In low-power mode FMR 22 = FMR23 = 1 On flash memory (1) f(BCLK) = 32 MHz In low-power mode On RAM (1) Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on Peripheral clock operating Topr = 25C f(BCLK) = 32 MHz (oscillation capacity High) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C f(BCLK) = 32 kHz (oscillation capacity Low) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock stopped Topr = 25C f(BCLK) = 10 MHz, PM17 = 1 (one wait) VCC1 = 3.0 V f(BCLK) = 10 MHz, PM17 = 1 (one wait) VCC1 = 3.0 V 24.0 Unit M mA
24.7
mA
16.0
mA
40 MHz on-chip oscillator mode 125 kHz on-chip oscillator mode
17.0
mA
450.0
A
Low-power mode
160.0
A
40.0
A
Wait mode
20.0
A
8.0
A
4.0
A
Stop mode
1.6
A
During flash memory program During flash memory erase Note: 1.
20.0 30.0
mA mA
This indicates the memory in which the program to be executed exists.
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VCC1 = VCC2 = 3 V
Table 5.45 Electrical Characteristics (3)
R5F3651ENFC, R5F3651EDFC, R5F3651KNFC, R5F3650KNFA, R5F3650KNFB, R5F3651KDFC, R5F3650KDFA, R5F3650KDFB, R5F3651MNFC, R5F3650MNFA, R5F3650MNFB, R5F3651MDFC, R5F3650MDFA, R5F3650MDFB, R5F3651NNFC, R5F3650NNFA, R5F3650NNFB, R5F3651NDFC, R5F3650NDFA, R5F3650NDFB VCC1 = VCC2 = 2.7 to 3.3 V, VSS = 0 V at Topr = -20C to 85C/-40C to 85C, f(BCLK) = 32 MHz unless otherwise specified.
Symbol RfXCIN ICC Parameter Feedback resistance XCIN Power supply current High-speed mode In single-chip, mode, the output pin are open and other pins are VSS Measuring Condition Min. Standard Typ. Max. 16 f(BCLK) = 32 MHz XIN = 4 MHz (square wave), PLL multiplied by 8 125 kHz on-chip oscillator stopped Unit M
26.0
mA
40 MHz on-chip oscillator mode 125 kHz on-chip oscillator mode
Low-power mode
Wait mode
f(BCLK) = 32 MHz, A/D conversion XIN = 4 MHz (square wave), PLL multiplied by 8 125 kHz on-chip oscillator stopped f(BCLK) = 20 MHz XIN = 20 MHz (square wave) 125 kHz on-chip oscillator stopped Main clock stopped 40 MHz on-chip oscillator on, no division 125 kHz on-chip oscillator stopped Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on, no division FMR22 = 1 (slow read mode) f(BCLK) = 32 MHz In low-power mode, FMR 22 = FMR23 = 1 on flash memory (1) f(BCLK) = 32 MHz In low-power mode, on RAM (1) Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on Peripheral clock operating Topr = 25C f(BCLK) = 32 MHz (oscillation capacity High) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C f(BCLK) = 32kHz (oscillation capacity Low) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C
27.0
mA
17.0
mA
18.0
mA
500.0
A
170.0
A
40.0
A
20.0
A
8.0
A
4.0
A
Stop mode
Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock stopped Topr = 25C f(BCLK) = 10 MHz, PM17 = 1 (one wait) VCC1 = 3.0 V f(BCLK) = 10 MHz, PM17 = 1 (one wait) VCC1 = 3.0 V
1.6
A
During flash memory program During flash memory erase
20.0 30.0
mA mA
Note: 1. This indicates the memory in which the program to be executed exists.
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5. Electrical Characteristics
VCC1 = VCC2 = 3 V
Table 5.46 Electrical Characteristics (4)
R5F3651RNFC, R5F3650RNFA, R5F3650RNFB, R5F3651RDFC, R5F3650RDFA, R5F3650RDFB, R5F3651TNFC, R5F3650TNFA, R5F3650TNFB, R5F3651TDFC, R5F3650TDFA, R5F3650TDFB VCC1 = VCC2 = 2.7 to 3.3 V, VSS = 0 V at Topr = -20C to 85C/-40C to 85C, f(BCLK) = 32 MHz unless otherwise specified.
Symbol RfXCIN ICC Parameter Feedback resistance XCIN Power supply current High-speed mode In single-chip, mode, the output pin are open and other pins are VSS Measuring Condition Min. Standard Typ. Max. 25 f(BCLK) = 32 MHz XIN = 4 MHz (square wave), PLL multiplied by 8 125 kHz on-chip oscillator stopped f(BCLK) = 32 MHz, A/D conversion XIN = 4 MHz (square wave), PLL multiplied by 8 125 kHz on-chip oscillator stopped f(BCLK) = 20 MHz XIN = 20 MHz (square wave) 125 kHz on-chip oscillator stopped Main clock stopped 40 MHz on-chip oscillator on, no division 125 kHz on-chip oscillator stopped Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on, no division FMR22 = 1 (slow read mode) f(BCLK) = 32 MHz In low-power mode, FMR 22 = FMR23 = 1 on flash memory (1) f(BCLK) = 32 MHz In low-power mode, on RAM (1) Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator on Peripheral clock operating Topr = 25C f(BCLK) = 32 MHz (oscillation capacity High) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C f(BCLK) = 32kHz (oscillation capacity Low) 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock operating Topr = 25C Stop mode Main clock stopped 40 MHz on-chip oscillator stopped 125 kHz on-chip oscillator stopped Peripheral clock stopped Topr = 25C f(BCLK) = 10 MHz, PM17 = 1 (one wait) VCC1 = 3.0 V f(BCLK) = 10 MHz, PM17 = 1 (one wait) VCC1 = 3.0 V Unit M
32.0
mA
32.7
mA
21.0
mA
40 MHz on-chip oscillator mode 125 kHz on-chip oscillator mode
23.0
mA
750.0
A
Low-power mode
300.0
A
40.0
A
Wait mode
20.0
A
8.0
A
4.0
A
1.6
A
During flash memory program During flash memory erase
20.0 30.0
mA mA
Note: 1. This indicates the memory in which the program to be executed exists.
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5. Electrical Characteristics
VCC1 = VCC2 = 3 V 5.3.2 Timing Requirements (Peripheral Functions and Others)
(VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified)
5.3.2.1
Table 5.47
Symbol tw(RSTL)
Reset Input (RESET Input)
Reset Input (RESET Input)
Parameter
RESET input low pulse width
Standard Min. 10 Max.
Unit
s
RESET input t w(RTSL)
Figure 5.20
Reset Input (RESET Input)
5.3.2.2
Table 5.48
Symbol tc tw(H) tw(L) tr tf Note: 1.
External Clock Input
External Clock Input (XIN Input) (1)
Parameter External clock input cycle time External clock input high pulse width External clock input low pulse width External clock rise time External clock fall time Standard Min. 50 20 20 9 9 Max. Unit ns ns ns ns ns
The condition is VCC1 = VCC2 = 2.7 to 3.0 V.
XIN input tr t w(H) tf tc t w(L)
Figure 5.21
External Clock Input (XIN Input)
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VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.2.3
Table 5.49
Symbol tc(TA) tw(TAH) tw(TAL) TAiIN input cycle time TAiIN input high pulse width TAiIN input low pulse width
3V
Timer A Input
Timer A Input (Counter Input in Event Counter Mode)
Parameter Standard Min. 150 60 60 Max. Unit ns ns ns
Table 5.50
Symbol tc(TA) tw(TAH) tw(TAL)
Timer A Input (Gating Input in Timer Mode)
Parameter TAiIN input cycle time TAiIN input high pulse width TAiIN input low pulse width Standard Min. 600 300 300 Max. Unit ns ns ns
Table 5.51
Symbol tc(TA) tw(TAH) tw(TAL)
Timer A Input (External Trigger Input in One-Shot Timer Mode)
Parameter TAiIN input cycle time TAiIN input high pulse width TAiIN input low pulse width Standard Min. 300 150 150 Max. Unit ns ns ns
Table 5.52
Symbol tw(TAH) tw(TAL)
Timer A Input (External Trigger Input in Pulse Width Modulation Mode and Programmable Output Mode)
Parameter TAiIN input high pulse width TAiIN input low pulse width Standard Min. 150 150 Max. Unit ns ns
tc(TA) t w(TAH) TAiIN input t w(TAL) tc(UP) t w(UPH) TAiOUT input t w(UPL)
Figure 5.22
Timer A Input
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VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified)
Table 5.53
Symbol
tc(TA) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN)
3V
Timer A Input (Two-Phase Pulse Input in Event Counter Mode)
Parameter TAiIN input cycle time TAiOUT input setup time TAiIN input setup time Standard Min. 2 500 500 Max. Unit
s
ns ns
Two-phase pulse input in event counter mode tc(TA) TAiIN input tsu(TAIN-TAOUT) TAiOUT input tsu(TAOUT-TAIN) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN)
Figure 5.23
Timer A Input (Two-Phase Pulse Input in Event Counter Mode)
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.2.4
Table 5.54
Symbol tc(TB) tw(TBH) tw(TBL) tc(TB) tw(TBH) tw(TBL)
3V
Timer B Input
Timer B Input (Counter Input in Event Counter Mode)
Parameter TBiIN input cycle time (counted on one edge) TBiIN input high pulse width (counted on one edge) TBiIN input low pulse width (counted on one edge) TBiIN input cycle time (counted on both edges) TBiIN input high pulse width (counted on both edges) TBiIN input low pulse width (counted on both edges) Standard Min. 150 60 60 300 120 120 Max. Unit ns ns ns ns ns ns
Table 5.55
Symbol tc(TB) tw(TBH) tw(TBL)
Timer B Input (Pulse Period Measurement Mode)
Parameter TBiIN input cycle time TBiIN input high pulse width TBiIN input low pulse width Standard Min. 600 300 300 Max. Unit ns ns ns
Table 5.56
Symbol tc(TB) tw(TBH) tw(TBL)
Timer B Input (Pulse Width Measurement Mode)
Parameter TBiIN input cycle time TBiIN input high pulse width TBiIN input low pulse width Standard Min. 600 300 300 Max. Unit ns ns ns
tc(TB) t w(TBH) TBiIN input t w(TBL)
Figure 5.24
Timer B Input
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.2.5
Table 5.57
Symbol tc(CK) tw(CKH) tw(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) CLKi input cycle time CLKi input high pulse width CLKi input low pulse width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time 0 100 90
3V
Serial Interface
Serial Interface
Parameter Standard Min. 300 150 150 160 Max. Unit ns ns ns ns ns ns ns
tc(CK) t w(CKH) CLKi t w(CKL) th(C-Q) TXDi td(C-Q) RXDi tsu(D-C) th(C-D)
Figure 5.25
Serial Interface
5.3.2.6
Table 5.58
Symbol tw(INH) tw(INL)
External Interrupt INTi Input
External Interrupt INTi Input
Parameter
INTi input high pulse width INTi input low pulse width
Standard Min. 380 380 Max.
Unit ns ns
t w(INL) INTi input t w(INH)
Figure 5.26
External Interrupt INTi Input
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.2.7
Table 5.59
Symbol tBUF tHD;STA tLOW tR tHD;DAT tHIGH fF tsu;DAT tsu;STA tsu;STO Bus free time Hold time in start condition Hold time in SCL clock 0 status SCL, SDA signals' rising time Data hold time Hold time in SCL clock 1 status SCL, SDA signals' falling time Data setup time Setup time in restart condition Stop condition setup time 250 4.7 4.0 0 4.0 300
3V
Multi-master I2C-bus
Multi-master I2C-bus
Parameter Standard Clock Mode Min. 4.7 4.0 4.7 1000 Max. Fast-mode Min. 1.3 0.6 1.3 20 + 0.1 Cb 0 0.6 20 + 0.1 Cb 100 0.6 0.6 300 300 0.9 Max. Unit
s s s
ns
s s
ns ns
s s
SDA
t BUF t LOW tR tF
Sr p
t HD;STA
t su;STO
SCL
p
s
t HD;STA
t HD;DAT
t HIGH
t su;DAT
t su;STA
Figure 5.27
Multi-master I2C-bus
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5. Electrical Characteristics
VCC1 = VCC2 = Timing Requirements (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.3
3V
Timing Requirements (Memory Expansion Mode and Microprocessor Mode)
Memory Expansion Mode and Microprocessor Mode
Parameter Data input access time (for setting with no wait) Data input access time (for setting with wait) Data input access time (when accessing multiplex bus area) Data input access time (for setting with 2 + 3 or more) Data input setup time
RDY input setup time
Table 5.60
Symbol tac1(RD-DB) tac2(RD-DB) tac3(RD-DB) tac4(RD-DB) tsu(DB-RD)
tsu(RDY-BCLK)
Standard Min. Max. (Note 1) (Note 2) (Note 3) (Note 4) 50 85 0 0
Unit ns ns ns ns ns ns ns ns
th(RD-DB) th(BCLK-RDY)
Data input hold time
RDY input hold time
Notes: 1. Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 60 [ ns ] --------------------f ( BCLK )
9
2.
Calculated according to the BCLK frequency as follows:
( n + 0.5 ) x 10 ----------------------------------- - 60 [ ns ] f ( BCLK )
9
n is 1 for 1 wait setting, 2 for 2 waits setting and 3 for 3 waits setting.
3.
Calculated according to the BCLK frequency as follows:
( n - 0.5 ) x 10 ----------------------------------- - 60 [ ns ] f ( BCLK )
9
n is 2 for 2 waits setting, 3 for 3 waits setting.
4.
Calculated according to the BCLK frequency as follows:
n x 10 ----------------- - 60 [ ns ] f ( BCLK )
9
n is 3 for 2 + 3 , 4 for 2 + 4 , 4 for 3 + 4 , 5 for 4 + 5 ,.
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode
VCC1 = VCC2 = 3 V
(Effective in wait state setting)
BCLK
RD (Separate bus)
WR, WRL, WRH (Separate bus)
RD (Multiplexed bus)
WR, WRL, WRH (Multiplexed bus)
RDY input tsu(RDY-BCLK) th(BCLK-RDY)
Measuring conditions VCC1 = V CC2 = 3 V Input timing voltage: V = 0.6 V, V = 2.4 V IL IH Output timing voltage: V = 1.5 V, V = 1.5 V OL OH
Figure 5.28
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = 3 V 5.3.4 Switching Characteristics (Memory Expansion Mode and Microprocessor Mode)
(VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified)
5.3.4.1
Table 5.61
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB)
In No Wait State Setting
Memory Expansion and Microprocessor Modes (in No Wait State Setting)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) Data output delay time (in relation to WR) Data output hold time (in relation to WR) (3)
(3)
Measuring Condition
Standard Min. Max. 30 0 0 (Note 2) 30 0 25
-4
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
See Figure 5.29
30 0 30 0 40 0 (Note 1) (Note 2)
Notes: 1. Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 40 [ ns ] --------------------f ( BCLK )
9
f(BCLK) is 12.5 MHz or less.
2.
Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 10 [ ns ] --------------------f ( BCLK )
9
3.
This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = -CR x ln(1 - VOL/VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30 pF, R = 1 k, hold time of output low level is t = -30 pF x 1 k x In(1 - 0.2VCC2/VCC2) = 6.7 ns.
R DBi C
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5. Electrical Characteristics
P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14
30 pF
Figure 5.29
Ports P0 to P14 Measurement Circuit
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode (in no wait state setting)
Read timing
VCC1 = VCC2 = 3V
BCLK td(BCLK-CS)
30ns(max.)
th(BCLK-CS)
0ns(min.)
CSi tcyc
td(BCLK-AD)
30ns(max.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE) 25ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(RD-AD)
0ns(min.)
ALE td(BCLK-RD) 30ns(max.) RD tac1(RD-DB) (0.5 x t cyc-60)ns(max.) Hi-Z DBi tsu(DB-RD)
50ns(min.)
th(BCLK-RD)
0ns(min.)
th(RD-DB)
0ns(min.)
Write timing
BCLK td(BCLK-CS)
30ns(max.)
th(BCLK-CS)
0ns(min.)
CSi tcyc
td(BCLK-AD)
30ns(max.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE) 25ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(WR-AD) (0.5 x t cyc-10)ns(min.) th(BCLK-WR)
0ns(min.)
ALE td(BCLK-WR)
30ns(max.)
WR, WRL, WRH
td(BCLK-DB) 40ns(max.) DBi Hi-Z td(DB-WR) (0.5 x t cyc-40)ns(min.) tcyc = 1 f(BCLK) th(WR-DB) (0.5 x t cyc-10)ns(min.) th(BCLK-DB)
0ns(min.)
Measuring conditions VCC1 = V CC2 = 3V Input timing voltage: V = 0.6 V, V = 2.4 V IL IH Output timing voltage: V = 1.5 V, V = 1.5 V OL OH
Figure 5.30
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = Switching Characteristics (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.4.2
Table 5.62
3V
In 1 to 3 Waits Setting and When Accessing External Area
Memory Expansion Mode and Microprocessor Mode (in 1 to 3 Waits Setting and When Accessing External Area)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) Data output delay time (in relation to WR) Data output hold time (in relation to WR) (3)
(3)
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB)
Measuring Condition
Standard Min. 0 0 (Note 2) 30 0 25 Max. 30
Unit ns ns ns ns ns ns ns ns
See Figure 5.29
-4 30 0 30 0 40 0 (Note 1) (Note 2)
ns ns ns ns ns ns ns ns
Notes: 1. Calculated according to the BCLK frequency as follows:
( n - 0.5 ) x 10 - - 40 [ ns ] ----------------------------------f ( BCLK )
9
n is 1 for 1 wait setting, 2 for 2 waits setting and 3 for 3 waits setting. When n = 1, f(BCLK) is 12.5 MHz or less.
2.
Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 10 [ ns ] --------------------f ( BCLK )
9
3.
This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t=-CR x ln(1-VOL/VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30 pF, R = 1 k, hold time of output low level is t = -30 pF x 1 k x In(1 - 0.2VCC2/VCC2) = 6.7 ns.
R DBi C
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode
(in 1 to 3 waits setting and when accessing external area) Read timing
BCLK td(BCLK-CS)
30ns(max.)
VCC1 = VCC2 = 3V
th(BCLK-CS)
0ns(min.)
CSi tcyc
td(BCLK-AD)
30ns(max.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE)
25ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(RD-AD)
0ns(min.)
ALE td(BCLK-RD)
30ns(max.)
th(BCLK-RD)
0ns(min.)
RD tac2(RD-DB) {(n+0.5) x tcyc -60}ns(max.) th(RD-DB)
0ns(min.)
DBi
Hi-Z
tsu(DB-RD)
50ns(min.)
Write timing
BCLK td(BCLK-CS)
30ns(max.)
th(BCLK-CS)
0ns(min.)
CSi tcyc
td(BCLK-AD)
30ns(max.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE)
25ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(WR-AD)
(0.5 x t cyc-10)ns(min.)
ALE td(BCLK-WR) th(BCLK-WR)
0ns(min.)
WR, WRL, WRH
30ns(max.)
td(BCLK-DB)
40ns(max.)
th(BCLK-DB)
0ns(min.)
Hi-Z DBi td(DB-WR) {(n-0.5) x tcyc -40}ns(min.) 1 f(BCLK) th(WR-DB)
(0.5 x t cyc-10)ns(min.)
tcyc =
Measuring conditions VCC1 = V CC2 = 3V Input timing voltage: V = 0.6 V, V = 2.4 V IL IH Output timing voltage: V = 1.5 V, V = 1.5 V OL OH
n: 1 (when 1 wait) 2 (when 2 waits) 3 (when 3 waits)
Figure 5.31
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = Switching Characteristics (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.4.3
Table 5.63
3V
In 2 or 3 Waits Setting, and When Accessing External Area and Using Multiplexed Bus
Memory Expansion Mode and Microprocessor Mode (in 2 or 3 Waits Setting, and When Accessing External Area and Using Multiplexed Bus) (5)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) Chip select output hold time (in relation to RD) Chip select output hold time (in relation to WR) RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) Data output delay time (in relation to WR) Data output hold time (in relation to WR) ALE signal output delay time (in relation to BCLK) ALE signal output hold time (in relation to BCLK) ALE signal output delay time (in relation to Address) ALE signal output hold time (in relation to Address) RD signal output delay from the end of address WR signal output delay from the end of address Address output floating start time
-4
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) th(RD-CS) th(WR-CS) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-ALE) th(BCLK-ALE) td(AD-ALE) th(AD-ALE) td(AD-RD) td(AD-WR) tdz(RD-AD) Notes: 1. 2.
Measuring Condition
Standard Min. Max. 50 0 (Note 1) (Note 1) 50 0 (Note 1) (Note 1) 40 0 40
Unit ns ns ns ns ns ns ns ns ns ns ns ns
See Figure 5.29
0 50 0 (Note 2) (Note 1) 25
ns ns ns ns ns ns ns ns ns ns
(Note 3) (Note 4) 0 0 8
9
ns
Calculated according to the BCLK frequency as follows: --------------------- - 10 [ ns ] Calculated according to the BCLK frequency as follows:
0.5 x 10 f ( BCLK )
( n - 0.5 ) x 10 ----------------------------------- - 50 [ ns ] f ( BCLK )
3.
9
n is 2 for 2 waits setting, 3 for 3 waits setting.
Calculated according to the BCLK frequency as follows: --------------------- - 40 [ ns ] Calculated according to the BCLK frequency as follows: --------------------- - 15 [ ns ]
When using multiplexed bus, set f(BCLK) 12.5 MHz or less.
0.5 x 10 f ( BCLK ) 0.5 x 10 f ( BCLK )
9
9
4. 5.
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode
(in 2 or 3 waits setting, and when accessing external area and using multiplexed bus ) Read timing
VCC1 = VCC2 = 3V
BCLK
td(BCLK-CS)
50ns(max.)
th(BCLK-CS) tcyc
(0.5 x t cyc-10)ns(min.)
th(RD-CS)
0ns(min.)
CSi td(AD-ALE) (0.5 x t cyc-40ns(min.) ADi /DBi th(ALE-AD) (0.5 x t cyc-15ns(min.) tdz(RD-AD)
8ns(max.)
Address
Data input
Address
tsu(DB-RD) tac3(RD-DB) {(n-0.5) x tcyc -60}ns(max.) 50ns(min.)
th(RD-DB)
0ns(min.)
td(BCLK-AD)
50ns(max.)
td(AD-RD)
0ns(min.)
th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE) 25ns(max.)
th(BCLK-ALE)
-4ns(min.)
th(RD-AD) (0.5 x t cyc-10)ns(min.) td(BCLK-RD) 40ns(max.) th(BCLK-RD)
0ns(min.)
ALE
RD
Write timing
BCLK td(BCLK-CS)
50ns(max.)
tcyc
th(WR-CS) (0.5 x t cyc-10)ns(min.)
th(BCLK-CS)
0ns(min.)
CSi td(BCLK-DB)
50ns(max.)
th(BCLK-DB)
0ns(min.)
ADi /DBi
Address
Data output
Address
td(AD-ALE) (0.5 x t cyc-40ns(min.) td(BCLK-AD)
50ns(max.)
td(DB-WR) {(n-0.5) x tcyc -50}ns(min.)
th(WR-DB) (0.5 x t cyc-10)ns(min.) th(BCLK-AD)
0ns(min.)
ADi BHE
td(BCLK-ALE) 25ns(max.)
th(BCLK-ALE)
-4ns(min.)
td(AD-WR)
0ns(min.)
th(WR-AD) (0.5 x t cyc-10)ns(min.) th(BCLK-WR)
0ns(min.)
ALE
WR, WRL, WRH
td(BCLK-WR) 40ns(max.)
tcyc =
1 f(BCLK) n: 2 (when 2 waits) 3 (when 3 waits)
Measuring conditions VCC1 = V CC2 = 3V Input timing voltage: V = 0.6 V, V = 2.4 V IL IH Output timing voltage: V = 1.5 V, V = 1.5 V OL OH
Figure 5.32
Timing Diagram
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5. Electrical Characteristics
VCC1 = VCC2 = Switching Characteristics (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.4.4
Table 5.64
3V
In Wait State Setting 2 + 3, 2 + 4, 3 + 4, and 4 + 5, and When Accessing External Area
Memory Expansion and Microprocessor Modes (in Wait State Setting 2 + 3, 2 + 4, 3 + 4, and 4 + 5, and When Accessing External Area)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) (3) Data output delay time (in relation to WR) Data output hold time (in relation to WR)
(3)
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB)
Measuring Condition
Standard Min. Max. 30 0 0 (Note 2) 30 0 25
Unit ns ns ns ns ns ns ns ns
See Figure 5.29
-4 30 0 30 0 40 0 (Note 1) (Note 2)
ns ns ns ns ns ns ns ns
Notes: 1. Calculated according to the BCLK frequency as follows:
( n - 0.5 ) x 10 - - 40 [ ns ] ----------------------------------f ( BCLK )
9
n is 3 for 2 + 3, 4 for 2 + 4, 4 for 3 + 4, and 5 for 4 + 5.
2.
Calculated according to the BCLK frequency as follows:
0.5 x 10 - - 10 [ ns ] --------------------f ( BCLK )
9
3.
This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pullup (pull-down) resistance value. Hold time of data bus is expressed in t = -CR x ln(1 - VOL/VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30 pF, R = 1 k, hold time of output low level is t = -30 pF x 1 k x In(1 - 0.2VCC2/VCC2) = 6.7 ns.
R DBi C
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5. Electrical Characteristics
Memory Expansion Mode, Microprocessor Mode (in wait state setting 2 + 3 , 2 + 4 , 3 + 4 , and 4 + 5 , and when accessing external area)
Read timing
BCLK td(BCLK-CS) 30ns(max.) CSi td(BCLK-AD) 30ns(max.) ADi BHE td(BCLK-ALE) 25ns(max.) ALE td(BCLK-RD) 30ns(max.) RD th(BCLK-ALE) -4ns(min.) tcyc
VCC1 = VCC2 = 3V
th(BCLK-CS) 0ns(min.)
th(BCLK-AD) 0ns(min.)
th(RD-AD) 0ns(min.)
th(BCLK-RD) 0ns(min.)
tac4(RD-DB) (n x tcyc-60)ns(max.) DBi Hi-Z tsu(DB-RD) 50ns(min.) th(RD-DB) 0ns(min.)
Write timing
tcyc
BCLK td(BCLK-CS) 30ns(max.) CSi td(BCLK-AD) 30ns(max.) ADi BHE td(BCLK-ALE) 25ns(max.) ALE td(BCLK-WR) 30ns(max.) WR, WRL WRH td(BCLK-DB) 40ns(max.) DBi Hi-Z th(BCLK-DB) 0ns(min.) th(BCLK-WR) 0ns(min.) th(BCLK-ALE) -4ns(min.) th(WR-AD) (0.5 x tcyc -10)ns(min.) th(BCLK-AD) 0ns(min.) th(BCLK-CS) 0ns(min.)
tcyc =
1 f(BCLK)
td(DB-WR) {(n-0.5) x tcyc -40}ns(min.)
th(WR-DB) (0.5 x tcyc -10)ns(min.)
Measuring conditions VCC1 = V CC2 = 3V Input timing voltage: V = 0.6 V, V = 2.4 V IL IH Output timing voltage: V = 1.5 V, V = 1.5 V OL OH
n: 3 (when 2 + 3 ) 4 (when 2 + 4 or 3 + 4 ) 5 (when 4 + 5 )
Figure 5.33
Timing Diagram
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M16C/65 Group
5. Electrical Characteristics
VCC1 = VCC2 = Switching Characteristics (VCC1 = VCC2 = 3 V, VSS = 0 V, at Topr = -20C to 85C/-40C to 85C unless otherwise specified) 5.3.4.5
Table 5.65
3V
In Wait State Setting 2 + 3, 2 + 4, 3 + 4, and 4 + 5, and Inserting 1 to 3 Recovery Cycles and Accessing External Area
Memory Expansion Mode and Microprocessor Mode (in Wait State Setting 2 + 3, 2 + 4, 3 + 4, and 4 + 5, and Inserting 1 to 3 Recovery Cycles and Accessing External Area)
Parameter Address output delay time Address output hold time (in relation to BCLK) Address output hold time (in relation to RD) Address output hold time (in relation to WR) Chip select output delay time Chip select output hold time (in relation to BCLK) ALE signal output delay time ALE signal output hold time RD signal output delay time RD signal output hold time WR signal output delay time WR signal output hold time Data output delay time (in relation to BCLK) Data output hold time (in relation to BCLK) (3) Data output delay time (in relation to WR) Data output hold time (in relation to WR) (3) 0 (Note 1) (Note 2) 0 40 See Figure 5.29 -4 30 0 30 0 25 0 (Note 4) (Note 2) 30 Measuring Condition Standard Min. Max. 30 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB)
Notes: 1. Calculated according to the BCLK frequency as follows:
n x 10 ----------------- - 40 [ ns ] f ( BCLK )
2.
9
n is 3 for 2 + 3, 4 for 2 + 4, 4 for 3 + 4, and 5 for 4 + 5.
Calculated according to the BCLK frequency as follows:
m x 10 - - 10 [ ns ] -----------------f ( BCLK )
3.
9
m is 1 when 1 recovery cycle is inserted, 2 when 2 recovery cycles are inserted, and 3 when 3 recovery cycles are inserted.
4.
This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = -CR x ln(1 - VOL/VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30 pF, R = 1 k, hold time of output low level is t = -30 pF x 1 k x In(1 - 0.2VCC2/VCC2) = 6.7 ns. Calculated according to the BCLK frequency as follows:
R DBi C
m x 10 - + 0 [ ns ] -----------------f ( BCLK )
9
m is 1 when 1 recovery cycle is inserted, 2 when 2 recovery cycles are inserted, and 3 when 3 recovery cycles are inserted.
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5. Electrical Characteristics
Memory Expansion Mode and Microprocessor Mode (in wait state setting 2 + 3 , 2 + 4 , 3 + 4 , and 4 + 5 , and when inserting 1 to 3 recovery cycles inserted and accessing external area)
Read timing
BCLK td(BCLK-CS) 30ns(max.) CSi td(BCLK-AD) 30ns(max.) ADi BHE td(BCLK-ALE) 25ns(max.) ALE td(BCLK-RD) 30ns(max.) RD tac4(RD-DB) (n x tcyc -60)ns(max.) DBi Hi-Z tsu(DB-RD) 50ns(min.) th(BCLK-ALE) -4ns(min.) tcyc
VCC1 = VCC2 = 3V
th(BCLK-CS) 0ns(min.)
th(BCLK-AD) 0ns(min.)
th(RD-AD) (m x tcyc+0)ns(min.)
th(BCLK-RD) 0ns(min.)
th(RD-DB) 0ns(min.)
Write timing
tcyc BCLK td(BCLK-CS) 30ns(max.) CSi td(BCLK-AD) 30ns(max.) ADi BHE td(BCLK-ALE) 25ns(max.) ALE td(BCLK-WR) 30ns(max.) WR, WRL WRH td(BCLK-DB) 40ns(max.) th(BCLK-DB) 0ns(min.) th(BCLK-WR) 0ns(min.) th(BCLK-ALE) -4ns(min.) th(WR-AD) (m x tcyc -10)ns(min.) th(BCLK-AD) 0ns(min.) th(BCLK-CS) 0ns(min.)
DBi
Hi-Z
1 tcyc = f(BCLK) Measuring conditions VCC1 = V CC2 = 3V Input timing voltage: V = 0.6 V, V = 2.4 V IL IH Output timing voltage: V = 1.5 V, V = 1.5 V OL OH
td(DB-WR) (n x tcyc -40)ns(min.)
th(WR-DB) (m x tcyc -10)ns(min.)
n: 3 (when 2 + 3 ) 4 (when 2 + 4 or 3 + 4 ) 5 (when 4 + 5 ) m: 1 (when 1 recovery cycle inserted ) 2 (when 2 recovery cycles inserted) 3 (when 3 recovery cycles inserted)
Figure 5.34
Timing Diagram
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Appendix 1. Package Dimensions
Appendix 1. Package Dimensions
The information on the latest package dimensions or packaging may be obtained from "Packages" on the Renesas Electronics website.
JEITA Package Code P-LQFP128-14x20-0.50 RENESAS Code PLQP0128KB-A Previous Code 128P6Q-A MASS[Typ.] 0.9g
HD *1 102 D 65
103
64 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
bp b1
c1 *2 HE E
c
Terminal cross section
Reference Symbol
Dimension in Millimeters
128
39
1 ZD Index mark
38 A2 A
c
F
L
D E A2 HD HE A A1 bp b1 c c1 e x y ZD ZE L L1
e
y
*3
bp
L1 x DetailF
Min Nom Max 19.9 20.0 20.1 13.9 14.0 14.1 1.4 21.8 22.0 22.2 15.8 16.0 16.2 1.7 0.05 0.125 0.2 0.17 0.22 0.27 0.20 0.09 0.145 0.20 0.125 0 8 0.5 0.10 0.10 0.75 0.75 0.35 0.5 0.65 1.0
ZE
R01DS0031EJ0200 Rev.2.00 Feb 07, 2011
A1
Page 110 of 111
M16C/65 Group
Appendix 1. Package Dimensions
JEITA Package Code P-QFP100-14x20-0.65
RENESAS Code PRQP0100JD-B
Previous Code 100P6F-A
MASS[Typ.] 1.8g
HD *1 80
D 51
81
50 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
*2
HE
E
Reference Symbol
Dimension in Millimeters
ZE
100
31
1
ZD
Index mark
30 F
c
A2
L e y *3 bp x Detail F
D E A2 HD HE A A1 bp c e x y ZD ZE L
Min Nom Max 19.8 20.0 20.2 13.8 14.0 14.2 2.8 22.5 22.8 23.1 16.5 16.8 17.1 3.05 0.1 0.2 0 0.3 0.4 0.25 0.13 0.15 0.2 0 10 0.65 0.13 0.10 0.575 0.825 0.4 0.6 0.8
A
JEITA Package Code P-LQFP100-14x14-0.50
RENESAS Code PLQP0100KB-A
Previous Code 100P6Q-A / FP-100U / FP-100UV
MASS[Typ.] 0.6g
HD *1 D
75
51 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
76
50
bp b1 HE E
Reference Dimension in Millimeters Symbol
*2
c1
c
A1
Terminal cross section
1 Index mark ZD
25 F
ZE
100
26
A2
A
D E A2 HD HE A A1 bp b1 c c1
c
A1
y e
*3
bp
L L1 Detail F
x
e x y ZD ZE L L1
Min Nom Max 13.9 14.0 14.1 13.9 14.0 14.1 1.4 15.8 16.0 16.2 15.8 16.0 16.2 1.7 0.05 0.1 0.15 0.15 0.20 0.25 0.18 0.09 0.145 0.20 0.125 0 8 0.5 0.08 0.08 1.0 1.0 0.35 0.5 0.65 1.0
R01DS0031EJ0200 Rev.2.00 Feb 07, 2011
Page 111 of 111
REVISION HISTORY
Rev. 1.00 1.10 Date Feb 02, 2009 Sep 24, 2009
M16C/65 Group Datasheet
Description Summary First Edition issued. Table 1.2 Specifications for the 128-Pin Package (2/2) partially modified Table 1.4 Specifications for the 100-Pin Package (2/2) partially modified Table 1.5 Product List (1/2) partially modified Table 1.6 Product List (2/2) partially modified Figure 1.2 Marking Diagram (Top View) partially modified Figure 3.2 Memory Map 13800h 13000h Table 4.2 "SFR Information (2/16)"notes partially modified Table 5.1 Absolute Maximum Ratings partially modified Table 5.2 Recommended Operating Conditions (1/3) partially modified Table 5.3 Recommended Operating Conditions (2/3) partially modified Table 5.4 Recommended Operating Conditions (3/3) added Figure 5.1 Ripple Waveform added Table 5.5 A/D Conversion Characteristics (1/2) partially modified Figure 5.2 A/D Accuracy Measure Circuit added Table 5.6 A/D Conversion Characteristics (2/2) partially modified Table 5.8 CPU Clock When Operating Flash Memory (f(BCLK)) partially modified Table 5.9 Flash Memory (Program ROM 1, 2) Electrical Characteristics partially modified Table 5.10 Flash Memory (Data Flash) Electrical Characteristics notes modified Table 5.11 Voltage Detector 0 Electrical Characteristics partially modified Table 5.12 Voltage Detector 1 Electrical Characteristics partially modified Table 5.13 Voltage Detector 2 Electrical Characteristics partially modified Table 5.14 Power-On Reset Circuit partially modified Figure 5.3 Power-On Reset Circuit Electrical Characteristics 0.1 V Vpor1 Table 5.16 40 MHz On-Chip Oscillator Circuit Electrical Characteristics (1/2) partially modified Table 5.17 40 MHz On-Chip Oscillator Circuit Electrical Characteristics (2/2) added Table 5.18 125 kHz On-Chip Oscillator Circuit Electrical Characteristics partially modified Table 5.20 Electrical Characteristics (2) partially modified Table 5.21 Electrical Characteristics (3) partially modified Table 5.22 Electrical Characteristics (4) partially modified Table 5.23 Electrical Characteristics (5) partially modified Table 5.24 Reset Input (RESET Input) partially modified Table 5.42 Electrical Characteristics (1) partially modified Table 5.44 Electrical Characteristics (3) partially modified Table 5.45 Electrical Characteristics (4) partially modified Table 5.46 Electrical Characteristics (5) partially modified Table 5.47 Reset Input (RESET Input) partially modified 001Ah Voltage Detector Operation Enable Register: Changed reset value from "000X 0000b". 002Ah Voltage Monitor 0 Control Register: Changed reset value from "1100 XX10b". 002Bh Voltage Monitor 1 Control Register: Changed reset value from "1000 1X10b". 0324h Increment/Decrement Flag: Changed name from Up/Down Flag. 03DCh D/A Control Register: Changed reset value from "XXXX XX00b". D08Ah to D08Bh PMC0 Counter Value Register: Deleted. D09Eh to D09Fh PMC1 Counter Value Register: Deleted. Table 1.2 and Table 1.4 Specifications for the 128/100-Pin Package: Deleted note 1. Table 1.5 Product List (1/2): Changed the development status.
Page 3 5 6 7 8 29 32 48 49 50 51 51 52 52 53 55 55 56 57 57 58 58 59 61 61 61 63 64 65 66 67 85 87 88 89 90
2.00
Feb 07, 2011
Overall Overall Overall Overall Overall Overall Overall
Overview
3, 5 6 19, 22
Table 1.12 and Table 1.15 Pin Functions for the 128/100-Pin Package: Changed the descriptions of the HOLD pin. Address Space 29 Figure 3.2 Memory Map: Added note 1 and 3 to the reserved areas.
A-1
REVISION HISTORY
Rev. 2.00 Date
M16C/65 Group Datasheet
Description Summary
Page Feb 07, 2011 Special Function Registers (SFRs) 31
32 49 50 51 52 57 60
Table 4.1 SFR Information (1): * Deleted "the VCR1 register, the VCR2 register" from note 2. * Deleted notes 5 to 6 and added note 5. Table 4.2 SFR Information (2): Deleted notes 2 to 7 and added note 2. 4.2.1 Register Settings: Added the description regarding read-modify-write instructions. Table 4.20 Read-Modify-Write Instructions: Added. Table 5.1 Absolute Maximum Ratings: Added a row for the data area value to Topr (Flash program erase). Table 5.2 Recommended Operating Conditions (1/3): Added rows for the CEC value to VCC1, VCC2, VIH, and VIL. Table 5.9 Flash Memory (Program ROM 1, 2) Electrical Characteristics: Added a condition to the Read voltage row. Table 5.14 Power-On Reset Circuit: * Added the tw(por) row. * Added the last line in note 1. Figure 5.3 Power-On Reset Circuit Electrical Characteristics: Deleted note 2. Table 5.20 Electrical Characteristics (2): Added "ZP, IDU, IDV, IDW" to the VT+ - VT- row. Table 5.21 Electrical Characteristics (3): Moved R5F3651ENFC and R5F3651EDFC to Table 5.22 Electrical Characteristics (4).
Electrical Characteristics
60 64 65
73, 96 5.2.2.7 and 5.3.2.7 Multi-master I2C-bus: Added. 74 to 81, Table 5.37 to Table 5.42 and Table 5.60 to Table 5.65 Memory Expansion Mode and 97 to 104 Microprocessor Mode: Deleted the following: * HOLD input setup time * HOLD input hold time * HLDA output delay time 74 Table 5.37 Memory Expansion Mode and Microprocessor Mode: Changed RDY input setup time from 30. 75, 98 Figure 5.13 and Figure 5.28 Timing Diagram: Deleted lower figure (Common to wait state and no wait state settings). 86, 109 Figure 5.19 and Figure 5.34 Timing Diagram: Changed the width of th(RD-AD). 87 Table 5.43 Electrical Characteristics (1): * Added rows for the CEC value to VOL, VT+-VT-, and Leakage current in powered-off state. * Added "ZP, IDU, IDV, IDW" to the VT+ - VT- row. Table 5.44 Electrical Characteristics (2): Moved R5F3651ENFC and R5F3651EDFC to Table 5.45 Electrical Characteristics (3). Table 5.44 to Table 5.46 Electrical Characteristics (2) to (4): Changed "VCC1 = 5.0 V" to "VCC1 = 3.0 V" in the During flash memory program and During flash memory erase rows. Table 5.60 Memory Expansion Mode and Microprocessor Mode: Changed RDY input setup time from 40.
88 88 to 90 97
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General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each other, the description in the body of the manual takes precedence. 1. Handling of Unused Pins Handle unused pins in accord with the directions given under Handling of Unused Pins in the manual. The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible. Unused pins should be handled as described under Handling of Unused Pins in the manual. 2. Processing at Power-on The state of the product is undefined at the moment when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the moment when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the moment when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the moment when power is supplied until the power reaches the level at which resetting has been specified. 3. Prohibition of Access to Reserved Addresses Access to reserved addresses is prohibited. The reserved addresses are provided for the possible future expansion of functions. Do not access these addresses; the correct operation of LSI is not guaranteed if they are accessed. 4. Clock Signals After applying a reset, only release the reset line after the operating clock signal has become stable. When switching the clock signal during program execution, wait until the target clock signal has stabilized. When the clock signal is generated with an external resonator (or from an external oscillator) during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover, when switching to a clock signal produced with an external resonator (or by an external oscillator) while program execution is in progress, wait until the target clock signal is stable. 5. Differences between Products Before changing from one product to another, i.e. to one with a different part number, confirm that the change will not lead to problems. The characteristics of MPU/MCU in the same group but having different part numbers may differ because of the differences in internal memory capacity and layout pattern. When changing to products of different part numbers, implement a system-evaluation test for each of the products.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) (Note 2) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics America Inc. 2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A. Tel: +1-408-588-6000, Fax: +1-408-588-6130 Renesas Electronics Canada Limited 1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada Tel: +1-905-898-5441, Fax: +1-905-898-3220 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-585-100, Fax: +44-1628-585-900 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Dusseldorf, Germany Tel: +49-211-65030, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. 7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898 Renesas Electronics Hong Kong Limited Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2886-9318, Fax: +852 2886-9022/9044 Renesas Electronics Taiwan Co., Ltd. 7F, No. 363 Fu Shing North Road Taipei, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 1 harbourFront Avenue, #06-10, keppel Bay Tower, Singapore 098632 Tel: +65-6213-0200, Fax: +65-6278-8001 Renesas Electronics Malaysia Sdn.Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics Korea Co., Ltd. 11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea Tel: +82-2-558-3737, Fax: +82-2-558-5141
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